Abstract: A metal-clad laminate includes an insulating layer that contains a cured product of a resin composition containing a polymer having a structural unit represented by Formula (1) in a molecule and a metal foil that is laminated on the insulating layer and is a metal foil in which a nickel element amount on a surface on a side in contact with the insulating layer and a nickel element amount on the surface when the surface is sputtered for 1 minute at 3 nm/min in terms of SiO2 are each 4.5 at % or less with respect to the total element amount on each surface. In Formula (1), Z represents an arylene group, R1-R3 each independently represent a hydrogen atom or an alkyl group, and R4-R6 each independently represent a hydrogen atom or an alkyl group having 1-6 carbon atoms.

Abstract: A metal-clad laminate includes an insulating layer including a cured product of a resin composition, and a metal foil disposed on a principal surface of the insulating layer. The resin composition includes a polyphenylene ether copolymer and a thermosetting curing agent, the polyphenylene ether copolymer having an intrinsic viscosity measured in methylene chloride at 25° C. of between 0.03 dl/g and 0.12 dl/g, inclusive. And the polyphenylene ether copolymer has, at a molecular terminal, a group represented by formula (1) or formula (2) at an average number of 1.5 to 3 per one molecule. Further, the metal foil has a first surface that is in contact with the insulating layer, the first surface having a 10-point average roughness (Rz) of 2.0 ?m or less. And the metal foil includes a barrier layer disposed at a side of the first surface, the barrier layer containing cobalt.

Abstract: A metal-clad laminate includes an insulating layer, and a metal foil in contact with at least one surface of the insulating layer, in which the insulating layer contains a cured product of a resin composition containing a polyphenylene ether compound, and the metal foil is a metal foil in which a first nickel element amount, on a surface on a side in contact with the insulating layer, measured by X-ray photoelectron spectroscopy is 4.5 at % or less with respect to a total element amount measured by X-ray photoelectron spectroscopy, and a second nickel element amount, on a surface on a side in contact with the insulating layer when the surface is sputtered for 1 minute at a speed of 3 nm/min in terms of SiO2, measured by X-ray photoelectron spectroscopy is 4.5 at % or less with respect to a total element amount measured by X-ray photoelectron spectroscopy.

Abstract: A metal-clad laminate includes an insulating layer including a cured product of a resin composition, and a metal foil disposed on a principal surface of the insulating layer. The resin composition includes a polyphenylene ether copolymer and a thermosetting curing agent, the polyphenylene ether copolymer having an intrinsic viscosity measured in methylene chloride at 25° C. of between 0.03 dl/g and 0.12 dl/g, inclusive. And the polyphenylene ether copolymer has, at a molecular terminal, a group represented by formula (1) or formula (2) at an average number of 1.5 to 3 per one molecule. Further, the metal foil has a first surface that is in contact with the insulating layer, the first surface having a 10-point average roughness (Rz) of 2.0 ?m or less. And the metal foil includes a barrier layer disposed at a side of the first surface, the barrier layer containing cobalt.

Abstract: The invention relates to a thermally conductive, electrically conductive adhesive composition including: (A) an electrically conductive filler, (B) an epoxy resin, and (C) a curing agent. The electrically conductive filler (A) is a submicron fine silver powder, and the content of the fine silver powder is 75 to 94% by mass of the total amount of the adhesive composition. The content of the epoxy resin (B) is 5 to 20% by mass of the total amount of the adhesive composition. The curing agent (C) is a compound of Formula (I), (II), or (III), as defined herein, and the content of the compound is 0.4 to 2.4 molar equivalents in terms of equivalent of active hydrogen relative to 1 molar equivalent of epoxy groups in the epoxy resin (B).