Patents by Inventor Akira Ishizu

Akira Ishizu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Process for preparing a combined wiring substrate
    Patent number: 5069745
    Abstract: A process for preparing a combined wiring substrate is carried out by bonding with an adhesive agent the end surfaces of the mutually opposing sides of a plurality of substrates each having a pattern of wiring on its major surface, and by connecting electrically parts of the pattern of wiring which oppose each other by interposing the bonding portion.
    Type: Grant
    Filed: August 24, 1990
    Date of Patent: December 3, 1991
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Hirofumi Ohuchida, Eishi Gofuku, Hayato Takasago, Akira Ishizu, Toshio Tobita, Mitsuyuki Takada
  • Thin film semiconductor device with oxide film on insulating layer
    Patent number: 4984033
    Abstract: A thin film semiconductor device is formed by preparing a substrate, forming a pattern of metal thin film on the substrate, forming an insulating layer on the metal thin film, and forming a pattern of a semiconductor thin film active layer over the pattern of the metal thin film by laser CVD.
    Type: Grant
    Filed: December 21, 1988
    Date of Patent: January 8, 1991
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Akira Ishizu, Tadashi Nishimura, Yasuo Inoue
  • Testing device for electrical circuit boards
    Patent number: 4943768
    Abstract: In a testing device for testing electric circuit board having test terminals on the board parallel to each other, conductor strips are arranged in conformity with the test terminals, and a pressing member is provided for pressing the conductor strips on the test terminals.
    Type: Grant
    Filed: June 21, 1989
    Date of Patent: July 24, 1990
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Kenichi Niki, Tohru Kokogawa, Akira Ishizu, Hayato Takasago
  • Testing device for electrical circuit boards
    Patent number: 4887030
    Abstract: In a testing device for testing electric circuit board having test terminals on the board parallel to each other, conductor strips are arranged in conformity with the test terminals, and a pressing member is provided for pressing the conductor strips on the test terminals.
    Type: Grant
    Filed: November 6, 1987
    Date of Patent: December 12, 1989
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Kenichi Niki, Tohru Kokogawa, Akira Ishizu, Hayato Takasago
  • Method of producing a thin film semiconductor device
    Patent number: 4822751
    Abstract: A thin film semiconductor device is formed by preparing a substrate, forming a pattern of metal thin film on the substrate, forming an insulating layer on the metal thin film, and forming a pattern of a semiconductor thin film active layer, which is self-aligned to the pattern of the metal thin film, by laser CVD.
    Type: Grant
    Filed: March 31, 1987
    Date of Patent: April 18, 1989
    Assignee: Mitsubishi Denki Kabushi Kaisha
    Inventors: Akira Ishizu, Tadashi Nishimura, Yasuo Inoue