Abstract: The present invention provides a compound represented by chemical formula (I) or a pharmaceutically acceptable salt thereof, and a pharmaceutical composition containing the same.

Abstract: A lead frame has a first sink, an island, and a control terminal. The lead frame is bent, and at a rear surface, the island is positioned closer to one surface of a resin molded body than the first sink and a passive component mounting portion of the control terminal. A passive component is mounted on the passive component mounting portion of the control terminal through a bonding material, the passive component mounting portion being a part of one surface.

Abstract: A semiconductor device, in which a plurality of control terminals that correspond to a main terminal and the same semiconductor chip protrude from a surface of an encapsulating part, and a plurality of signal paths that include the plurality of control terminals are positioned so as to be aligned with the main terminal in a first direction. Provided in each of the plurality of signal paths are pairs of relay members having identical functions, and a first relay grouping that includes one relay member of the pair of relay and a second relay grouping that includes the other relay member of the pair are positioned neighboring each other aligned in the first direction, with the ordering of the first relay grouping being mirror-inverted relative to the second relay grouping.

Abstract: A lead frame has a first sink, an island, and a control terminal The lead frame is bent, and at a rear surface, the island is positioned closer to one surface of a resin molded body than the first sink and a passive component mounting portion of the control terminal. A passive component is mounted on the passive component mounting portion of the control terminal through a bonding material, the passive component mounting portion being a part of one surface.

Abstract: A power supply module configured to supply power to a load having a first connector terminal includes a body, an insulating member, and a second connector terminal. The body includes a frame for power supply. The insulating member seals the body such that the frame is exposed from the insulating member. The second connector terminal is configured to be fitted with the first connector terminal and is bonded to the frame.

Abstract: In a circuit device of the present invention, the lower surface side of a circuit board and part of side surfaces thereof are covered with a second resin encapsulant, and the upper surface side and the like of the circuit board are covered with a first resin encapsulant. Since heat dissipation to the outside of the circuit device is achieved mainly through the second resin encapsulant, a particle size of filler contained in the second resin encapsulant is made larger than a particle size of filler contained in the first resin encapsulant. Heat dissipation to the outside of the circuit device is greatly improved.

Abstract: In a circuit device of the present invention, the lower surface side of a circuit board is covered with a second resin encapsulant, and the upper surface side and the like of the circuit board are covered with a first resin encapsulant. Since heat dissipation to the outside of the circuit device is achieved mainly through the second resin encapsulant, a particle size of filler contained in the second resin encapsulant is made larger than a particle size of filler contained in the first resin encapsulant. Heat dissipation to the outside of the circuit device is greatly improved.

Abstract: Provided is a method of manufacturing a circuit device in which a circuit element is resin-sealed with sealing resins formed integrally with each other. In the present invention, a resin sheet and a circuit board are housed in a cavity of a mold, and thereafter a first sealing resin formed of a tablet in melted form is injected into the cavity. At the time of injecting the first sealing resin, a second sealing resin formed of the resin sheet in melted form is not yet cured and is maintained in liquid form. Accordingly, the injected first sealing resin and the second sealing resin are mixed at the boundary therebetween, preventing the generation of a gap in the boundary portion and therefore preventing the deterioration of the moisture resistance and withstand voltage at the boundary portion.

Abstract: A lens including: a lens body having first and second surfaces; a flange part formed to protrude from a periphery of the lens body and to have a cylindrical outer circumferential surface; a lens installation surface formed at an outer edge part of the flange part; a recessed part formed as a part of the flange part such that a part of the cylindrical outer circumferential surface is recessed toward the optical axis; and a gate root part located at a central part of the recessed part. The gate root part has a flat surface which is in a same level with respect to the lens installation surface. The gate root part lies on an optical axis side with respect to a virtual curved surface formed by extending the cylindrical outer circumferential surface through the recessed part.

Abstract: In a circuit device of the present invention, the lower surface side of a circuit board is covered with a second resin encapsulant, and the upper surface side and the like of the circuit board are covered with a first resin encapsulant. Since heat dissipation to the outside of the circuit device is achieved mainly through the second resin encapsulant, a particle size of filler contained in the second resin encapsulant is made larger than a particle size of filler contained in the first resin encapsulant. Heat dissipation to the outside of the circuit device is greatly improved.

Abstract: In a circuit device of the present invention, the lower surface side of a circuit board and part of side surfaces thereof are covered with a second resin encapsulant, and the upper surface side and the like of the circuit board are covered with a first resin encapsulant. Since heat dissipation to the outside of the circuit device is achieved mainly through the second resin encapsulant, a particle size of filler contained in the second resin encapsulant is made larger than a particle size of filler contained in the first resin encapsulant. Heat dissipation to the outside of the circuit device is greatly improved.

Abstract: Provided is a method of manufacturing a circuit device in which a circuit element is resin-sealed with sealing resins formed integrally with each other. In the present invention, a resin sheet and a circuit board are housed in a cavity of a mold, and thereafter a first sealing resin formed of a tablet in melted form is injected into the cavity. At the time of injecting the first sealing resin, a second sealing resin formed of the resin sheet in melted form is not yet cured and is maintained in liquid form. Accordingly, the injected first sealing resin and the second sealing resin are mixed at the boundary therebetween, preventing the generation of a gap in the boundary portion and therefore preventing the deterioration of the moisture resistance and withstand voltage at the boundary portion.

Abstract: A lens including: a lens body having first and second surfaces; a flange part formed to protrude from a periphery of the lens body and to have a cylindrical outer circumferential surface; a lens installation surface formed at an outer edge part of the flange part; a recessed part formed as a part of the flange part such that a part of the cylindrical outer circumferential surface is recessed toward the optical axis; and a gate root part located at a central part of the recessed part. The gate root part has a flat surface which is in a same level with respect to the lens installation surface. The gate root part lies on an optical axis side with respect to a virtual curved surface formed by extending the cylindrical outer circumferential surface through the recessed part.

Abstract: A lens for an optical pick-up formed by injection molding, the lens including a lens body having a first surface on an optical disc side and a second surface on a light source side, and a flange part formed to protrude from a periphery of the lens body outward in a radial direction of the lens body, and wherein a part of the flange part has been cut off along a cylindrical outer circumferential surface of the flange part to remove a gate part of the lens, and when D denotes a cutting depth of the flange part, R denotes a radius of the lens and WG denotes a width of the gate part, the lens satisfies a condition: D < R - R 2 - ( W G 2 ) 2 .

Abstract: A rotary kiln includes a cylindrical kiln body supported for rotation about a central axis inclined with respect to a horizontal plane, a cylindrical combustion chamber formed inside the kiln body and extending along the central axis, and a plurality of cylindrical calcination chambers formed inside the kiln body so as to lie parallel with and surround the combustion chamber. The combustion chamber has an outlet at its lower end from which residue produced by combustion of fuel inside the combustion chamber drops for further combustion and/or discharge.