Abstract: In a component press-bonding device that performs work related to component mounting on a board after a mark provided on a transparent end region of the board is recognized, an imaging camera provided with an imaging optical axis extending downwards, a light emitter that irradiates the end region with illumination light from above the board in a state where the mark is positioned within an imaging visual field of the imaging camera, and a light reflecting member that is provided below the imaging camera and reflects the illumination light, which is emitted by the light emitter and is transmitted downwards through the end region, back to the end region are included. The imaging camera images the mark under the illumination light, which is reflected by the light reflecting member and is transmitted upwards through the end region.

Abstract: A tray supplier which performs supplying and collecting of trays includes a supply-side tray storage unit, a collection-side tray storage unit, a first tray placer and a second tray placer on which the trays are placed, and a first placer mover and a second placer mover which respectively move the tray placers between the supply-side tray storage unit and the collection-side tray storage unit, in which a first movement shaft of the first placer mover and a second movement shaft of the second placer mover are disposed parallel to each other, lifting and lowering units which lift or lower the first tray placer and the second tray placer are provided, and interference between the placer movers does not occur.

Abstract: A component bonding device includes a bonding tool which sucks a film-like component and which bonds the film-like component to a substrate. The bonding tool includes: a plurality of suction blocks, each of which has a suction hole for sucking the film-like component; and a suction block holding portion which has a block holding-available region capable of holding the plurality of suction blocks, and which holds the plurality of suction blocks so as to be arranged in a row in the block holding-available region. The suction block holding portion allows change of a holding position of at least one of the plurality of suction blocks to any desired position in the block holding-available region.

Abstract: A component crimping apparatus includes a crimping tool that sucks a film-like component and presses a crimping section of the sucked film-like component against the substrate to crimp the film-like component to the substrate. The crimping tool includes a block holding portion that includes a guide member extending in one direction within a horizontal plane, first suction blocks that are provided movably along the guide member and that sucks an upper part of the crimping section of the film-like component, a second suction block that is provided movably along the guide member of the block holding portion and that sucks an upper part of a non-crimping section of the film-like component and a block fixation unit that fixes the first suction blocks and the second suction block to the guide member.

Abstract: In a component press-bonding device that performs work related to component mounting on a board after a mark provided on a transparent end region of the board is recognized, an imaging camera provided with an imaging optical axis extending downwards, a light emitter that irradiates the end region with illumination light from above the board in a state where the mark is positioned within an imaging visual field of the imaging camera, and a light reflecting member that is provided below the imaging camera and reflects the illumination light, which is emitted by the light emitter and is transmitted downwards through the end region, back to the end region are included. The imaging camera images the mark under the illumination light, which is reflected by the light reflecting member and is transmitted upwards through the end region.

Abstract: A lower surface of a center region of a board is held by a board holding table, and a lower surface of an end region (region in which a component placing region is provided) of the board is supported by a backup table. After the board holding table is moved together with the backup table and the component placing region is positioned at a working position, the placing head presses the component from above to the component placing region to place the component on the board. Meanwhile, a suction mechanism sucks an end region of the board which is supported by the backup table through a plurality of suction ports opened to an upper surface of the backup table.

Abstract: Disclosed is a tape sticking apparatus in which an end region of a board formed of a film-shaped member is supported by a backup stage, a tape slice for bonding a component is pressed against the end region of the board together with a separator attached to an upper surface of the tape slice to stick the tape slice to the end region of the board, and then the separator is pulled up from the tape slice to separate the separator from the tape slice, the apparatus including a porous material portion which is provided at an upper portion of the backup stage and supports a lower surface of the end region of the board; and a suction mechanism which sucks the end region of the board through the porous material portion.

Abstract: While a substrate is placed on a substrate placement stage provided in a central substrate transfer unit, the substrate is transferred to a component loading operation unit, after operation for loading a component on the substrate has been performed by the component loading operation unit, the central substrate transfer unit is moved to the side of a first component crimping operation unit to thereby transfer the substrate that remains placed on the substrate placement stage to the first component crimping operation unit, and the component is crimped to the substrate by the first component crimping operation unit.

Abstract: A tray supplier which performs supplying and collecting of trays includes a supply-side tray storage unit, a collection-side tray storage unit, a first tray placer and a second tray placer on which the trays are placed, and a first placer mover and a second placer mover which respectively move the tray placers between the supply-side tray storage unit and the collection-side tray storage unit, in which a first movement shaft of the first placer mover and a second movement shaft of the second placer mover are disposed parallel to each other, lifting and lowering units which lift or lower the first tray placer and the second tray placer are provided, and interference between the placer movers does not occur.

Abstract: A component crimping apparatus includes a crimping tool that sucks a film-like component and presses a crimping section of the sucked film-like component against the substrate to crimp the film-like component to the substrate. The crimping tool includes a block holding portion that includes a guide member extending in one direction within a horizontal plane, first suction blocks that are provided movably along the guide member and that sucks an upper part of the crimping section of the film-like component, a second suction block that is provided movably along the guide member of the block holding portion and that sucks an upper part of a non-crimping section of the film-like component and a block fixation unit that fixes the first suction blocks and the second suction block to the guide member.

Abstract: A component bonding device includes a bonding tool which sucks a film-like component and which bonds the film-like component to a substrate. The bonding tool includes: a plurality of suction blocks, each of which has a suction hole for sucking the film-like component; and a suction block holding portion which has a block holding-available region capable of holding the plurality of suction blocks, and which holds the plurality of suction blocks so as to be arranged in a row in the block holding-available region. The suction block holding portion allows change of a holding position of at least one of the plurality of suction blocks to any desired position in the block holding-available region.

Abstract: While a substrate is placed on a substrate placement stage provided in a central substrate transfer unit, the substrate is transferred to a component loading operation unit, after operation for loading a component on the substrate has been performed by the component loading operation unit, the central substrate transfer unit is moved to the side of a first component crimping operation unit to thereby transfer the substrate that remains placed on the substrate placement stage to the first component crimping operation unit, and the component is crimped to the substrate by the first component crimping operation unit.

Abstract: Aims to provide an inspection apparatus and an inspection method for detecting an amount of misalignment of a component mounted on a panel through an ACF.

Abstract: An inspection apparatus and method for precisely detect an amount of misalignment of a component mounted on a panel through an adhesive which contains conductive particles. The inspection apparatus detects an amount of misalignment, from a predetermined mounting position, of a component mounted on a surface of a panel through an ACF, and includes: a visible light camera which captures an image of a panel recognition mark formed on the panel and a component recognition mark formed on the component; an obtaining unit which obtains, from the image captured by the camera, positions of feature points of the respective recognition marks; and a calculation unit which calculates an amount of misalignment of the feature point of the component recognition mark in the image captured by the camera from a predetermined position that is determined using the position of the feature point of the panel recognition mark as a reference.

Abstract: A panel is mounted on the stage while the one end electrode of the FPC (flexible board) is mounted on the mounting part of one surface of the panel and the other surface of the panel is facing upward. A mounting method includes bending the other end side of the flexible board, after holding the other end portion including the other end electrode, which is positionally adjusted based on the position recognition result of the mounting portion the press tool recognizing the position of the other end electrode, matching the positions of the mounting portion and the other end electrode by relative positional adjusting, and mounting the other end electrode on the mounting portion by temporarily pressing the other end electrode on the mounting portion.

Abstract: The present invention addresses the problem to provide a part mounting device and a part mounting method which precisely mount the both end electrodes of the flexible board to mounting portions of both surfaces of the panel and thereby realize a highly reliable mounting. A panel (1) is mounted on the stage (24) while the one end electrode (5) of the FPC (flexible board) (4) is mounted on the mounting part (2) of one surface of the panel (1) and the other surface of the panel (1) is facing upward.

Abstract: Aims to provide an inspection apparatus and an inspection method for detecting an amount of misalignment of a component mounted on a panel through an ACF.

Abstract: Aims to provide an inspection apparatus and an inspection method for precisely detecting an amount of misalignment of a component mounted on a panel through an adhesive which contains conductive particles. The inspection apparatus detects an amount of misalignment, from a predetermined mounting position, of a component mounted on a surface of a panel through an ACF, and includes: a visible light camera (306) which captures an image of a panel recognition mark formed on the panel and a component recognition mark formed on the component; an obtaining unit (448) which obtains, from the image captured by the camera (306), positions of feature points of the respective recognition marks; and a calculation unit (446) which calculates an amount of misalignment of the feature point of the component recognition mark in the image captured by the camera (306) from a predetermined position that is determined using the position of the feature point of the panel recognition mark as a reference.