Abstract: A socket (10) for a semiconductor package having a plurality of solder balls (5) at its bottom surface. The socket (10) includes a socket body having a plurality of contacts (11) arranged in a shape to correspond in arrangement to the solder balls (5) of the semiconductor package. Each of the contacts (11) has a first and second contact piece contactable with the corresponding solder ball (5) while clamping the corresponding solder ball (5) from both side. The socket (10) includes a placing plate (13) capable of moving between a first position and a second position. The first, or semiconductor placing, position is where the semiconductor package is placed on the placing plate (13) without contact of the solder balls (5) of the semiconductor package with the first and second contact pieces, and the second, or contact, position is where the solder balls (5) of the placed semiconductor package are contactable with the corresponding first and second contact pieces.

Abstract: A socket (10) for a semiconductor package having a plurality of solder balls (5) at its bottom surface. The socket (10) includes a socket body having a plurality of contacts (11) arranged in a shape to correspond in arrangement to the solder balls (5) of the semiconductor package. Each of the contacts (11) has a first and second contact piece contactable with the corresponding solder ball (5) while clamping the corresponding solder ball (5) from both side. The socket (10) includes a placing plate (13) capable of moving between a first position and a second position. The first, or semiconductor placing, position is where the semiconductor package is placed on the placing plate (13) without contact of the solder balls (5) of the semiconductor package with the first and second contact pieces, and the second, or contact, position is where the solder balls (5) of the placed semiconductor package are contactable with the corresponding first and second contact pieces.

Abstract: An IC socket has a socket body with a plurality of terminal mounting holes, and terminals of electrical connector mounted in the terminal mounting holes and each of the terminals of electrical connector having a contact portion, a spring portion and a tail portion for performing a burn-in test of an IC package by mounting the IC package on the socket body so as to place a solder ball as a contact of the IC package corresponding to the contact portion and contacting the contact portion with the solder ball. The spring portion of each of the terminals of electrical connector is formed into meandering shape as a whole by stacking a plurality of r-shaped portions in series with alternately orienting each r-surface thereof in the opposite direction from the contact portion toward the tail portion.

Abstract: A socket is provided for burn-in testing of an integrated circuit package having electrical leads. The socket includes a socket body having an array of columns and rows of generally rectangular terminal-receiving cavities therein, each of the generally rectangular terminal-receiving cavities having a longitudinal direction corresponding to its longer dimension and a plurality of terminals disposed in the terminal-receiving cavities for contacting the leads of the integrated circuit package. Each column and row of the array includes a sequence of at least three adjacent cavities wherein for each cavity of the sequence other than the first and last, the longitudinal direction of the cavity is substantially perpendicular to the longitudinal direction of the two cavities in the sequence adjacent the cavity on either side.

Abstract: A socket is provided for an IC package having a plurality of contacts. The socket includes a body mounting a plurality of terminals and having a receptacle in the top thereof for receiving the IC package with the contacts in engagement with the terminals. At least one retainer/ejector member is mounted on the socket body adjacent the receptacle for movement relative to the body from a first position retaining the IC package in the receptacle and a second position at least partially ejecting the IC package from the receptacle. An actuator member is movably mounted on the socket body. The actuator member is operatively associated with the retainer/ejector member for moving the retainer/ejector member from its first position to its second position.

Abstract: A socket for burn-in testing of an integrated circuit package having electrical leads. The socket includes an outer socket housing and an inner socket housing slidably moveable relative to the outer housing between an upper limit position and a lower limit position, the inner housing for supporting the integrated circuit package thereon and having a plurality of terminal-receiving cavities therein. The socket further includes a plurality of terminals disposed in the terminal-receiving cavities of said inner housing for contacting the leads of the integrated circuit package, a cam mechanism for raising and lowering the inner housing between the upper limit position and lower limit position relative to the outer housing, and a latch mechanism for holding and releasing the integrated circuit package relative to the inner housing.

Abstract: An improved connecting terminal for an electromagnetic shield is provided for use with a printed circuit board. The printed circuit board is contained in a shielded casing having shielding walls to define compartments. The connecting terminal makes an electric connection between the ground pattern, the shielded inside and shielding walls of the shielded casing, thereby preventing an electromagnetic field from interfering with surrounding electric circuits. The connecting terminal comprises an elongated base strip having an undersurface to be soldered to a selected portion of the ground pattern and a pair of inwardly directed contact arms integrally connected to the opposite ends of the elongated base strip. Each contact arm makes contact with the shielded inside and shielding walls of the casing.

Abstract: Disclosed is an improved two-piece SIM card-receiving connector comprising a housing having terminals mounted therein, and a card holder having a card-receiving section for receiving the SIM card. The card holder is slidably mounted to the housing by way of ledges formed on side edges of the card holder guided within channels formed along both sides of the housing. The housing includes a lock lever having a latch projection extending therefrom. The latch projection engages a corresponding recess formed on the card holder to lock the card holder and housing in an assembled condition. The two-piece construction allows the housing to be easily and automatically assembled to an underlying circuit board, and the sliding assembly of the card holder to the housing provides "self-cleaning" of the terminals during both assembly and removal of the card holder to the housing.

Abstract: A card-receiving connector system for a miniature circuit card. A card holder receives a card, and a frame is adapted for locating the card holder in an operative position thereon and includes spring contacts mounted therein for engagement with electronic circuitry on the card. Complementary interengaging latches are provided between the frame and the card holder for holding the card holder in the operative position. An eject mechanism is mounted on the frame for ejecting the card holder from its operative position. An unlatching mechanism is operatively associated with the eject mechanism for unlatching the interengaging latches in response to movement of the eject mechanism. Lost motion is built into the eject mechanism to permit unlatching of the latches prior to ejecting the card holder from its operative position.