Abstract: An insulating substrate has an insulating plate, an obverse metal pattern, and a reverse metal pattern. A semiconductor chip is mounted on the obverse metal pattern of the insulating substrate. A main terminal is joined to a main electrode on an upper surface of the semiconductor chip. A signal terminal is connected to a control electrode on the upper surface of the semiconductor chip by a wire. A sealing resin seals the insulating substrate, the semiconductor chip, the wire, and a part of the main terminal and a part of the signal termina. The reverse metal pattern protrudes from a lower surface of the sealing resin. A side surface and a lower surface of the reverse metal pattern are exposed from the sealing resin. An exposed surface of the reverse metal pattern is modified and hardened. The reverse metal pattern has a convex shape which bulges downward.

Abstract: An image forming apparatus capable of executing a single-sided recording mode in which an image is recorded on one side of a recording medium and a double-sided recording mode in which an image is recorded on both sides of the recording medium, the image forming apparatus includes: a first temperature adjustment device that adjusts a temperature of the recording medium; an inkjet head that ejects ink onto a surface of the recording medium; a reverse unit that reverses front and back surfaces of the recording medium by switching a conveying direction of the recording medium when the double-sided recording mode is executed; a second temperature adjustment device that controls the temperature of the recording medium in which the front and back surfaces are reversed; and a control device that controls at least one of the first and second temperature adjustment devices.

Abstract: Disclosed is an image forming apparatus including a conveyance section, an attraction section, an image forming section, and a hardware processor. The conveyance section includes conveyance surfaces on each of which a sheet can be placed and that conveys the sheet placed thereon. The attraction section that attracts the sheet onto the conveyance surfaces by sucking air from suction holes. The image forming section forms an image on the sheet. When a decrease of an attraction force by the attraction section is caused in executing a print job, the hardware processor causes one or more of the conveyance surfaces to suck and convey a non-print job sheet and then causes the one or more of the conveyance surfaces to consecutively suck and convey a print job sheet, and does not perform image formation on the non-print job sheet and performs the image formation on the print job sheet.

Abstract: A semiconductor device in which occurrence of peeling between a filling member and a metal terminal is suppressed is obtained. The semiconductor device includes: an insulating substrate having a front surface and a back surface, and having a semiconductor element joined to the front surface; a base plate joined to the back surface of insulating substrate; a case member surrounding insulating substrate; a filling member having an upper surface, covering insulating substrate, and filling a region surrounded by base plate and case member; and a metal member having a plate shape that leans toward an upper surface side of filling member inside filling member, has one end joined to the front surface of insulating substrate and another end separated from an inner wall of case member, and is exposed from the upper surface of filling member.

Abstract: An image forming apparatus capable of executing a single-sided recording mode in which an image is recorded on one side of a recording medium and a double-sided recording mode in which an image is recorded on both sides of the recording medium, the image forming apparatus includes: a first temperature adjustment device that adjusts a temperature of the recording medium; an inkjet head that ejects ink onto a surface of the recording medium; a reverse unit that reverses front and back surfaces of the recording medium by switching a conveying direction of the recording medium when the double-sided recording mode is executed; a second temperature adjustment device that controls the temperature of the recording medium in which the front and back surfaces are reversed; and a control device that controls at least one of the first and second temperature adjustment devices.

Abstract: A semiconductor device includes: semiconductor elements and; a lead frame including a mount having an upper surface over which the semiconductor elements and are mounted; a sealing resin sealing the lead frame and the semiconductor elements and so that outer leads and of the lead frame protrude outwardly; and a resin wall located on an inner lead between the outer lead and the mount of the lead frame. A vertical thickness of the resin wall is greater than a vertical thickness from a lower surface of the sealing resin to a lower end of the lead frame.

Abstract: A mold die includes a resin injection gate through which fluid resin serving as mold resin is injected toward a cavity, a resin reservoir to store the fluid resin flowing through the cavity, and a resin reservoir gate. The resin reservoir is provided on the side opposite to the side on which the resin injection gate is arranged with the cavity interposed. The resin reservoir gate communicatively connects the cavity and the resin reservoir. The opening cross-sectional area of the resin reservoir gate is smaller than the opening cross-sectional area of the resin injection gate.

Abstract: In a semiconductor device, lead frame includes a die pad. The die pad includes a mounting surface and a back surface. The mounting surface includes first and second mounting regions. The back surface includes first and second back regions. The first and second semiconductor elements are mounted on the first and second mounting regions, respectively. The first and second back regions are located on opposite sides from the first and second mounting regions, respectively. The mold resin has the first semiconductor element, the second semiconductor element, and the die pad encapsulated therein and is in direct contact with the second back region. The insulation sheet is disposed on the first back region to be exposed outside the mold resin, the insulation sheet having a thermal conductivity higher than a thermal conductivity of the mold resin.

Abstract: A semiconductor device in which occurrence of peeling between a filling member and a metal terminal is suppressed is obtained. The semiconductor device includes: an insulating substrate having a front surface and a back surface, and having a semiconductor element joined to the front surface; a base plate joined to the back surface of insulating substrate; a case member surrounding insulating substrate; a filling member having an upper surface, covering insulating substrate, and filling a region surrounded by base plate and case member; and a metal member having a plate shape that leans toward an upper surface side of filling member inside filling member, has one end joined to the front surface of insulating substrate and another end separated from an inner wall of case member, and is exposed from the upper surface of filling member.

Abstract: In a semiconductor device, lead frame includes a die pad. The die pad includes a mounting surface and a back surface. The mounting surface includes first and second mounting regions. The back surface includes first and second back regions. The first and second semiconductor elements are mounted on the first and second mounting regions, respectively. The first and second back regions are located on opposite sides from the first and second mounting regions, respectively. The mold resin has the first semiconductor element, the second semiconductor element, and the die pad encapsulated therein and is in direct contact with the second back region. The insulation sheet is disposed on the first back region to be exposed outside the mold resin, the insulation sheet having a thermal conductivity higher than a thermal conductivity of the mold resin.

Abstract: A semiconductor device includes: semiconductor elements and; a lead frame including a mount having an upper surface over which the semiconductor elements and are mounted; a sealing resin sealing the lead frame and the semiconductor elements and so that outer leads and of the lead frame protrude outwardly; and a resin wall located on an inner lead between the outer lead and the mount of the lead frame. A vertical thickness of the resin wall is greater than a vertical thickness from a lower surface of the sealing resin to a lower end of the lead frame.

Abstract: A sheet feeding apparatus which includes a sheet loading tray for stacking sheets; a suction and conveyance section which is placed above stacked sheets on the sheet loading tray and sucks and conveys a sheet in the sheet conveying direction; an air blowing section which blows air at the stacked sheets on the sheet loading tray and causes the sheet to float up; and a skew correction section which corrects a skew of the sheet conveyed by the suction and conveyance section.

Abstract: An air-suction sheet supplying device includes a sheet stacking plate to stack recording sheets; an air-suction duct, arranged to face a top surface of the recording sheet stacked on the sheet stacking plate, and having an air-suction opening with a predetermined width; a belt member, rotatably arranged so as to cover the air-suction opening, and having plural areas having various distributions of suction holes in a direction perpendicular to a conveying direction; a driving section to rotate the belt member; a detecting section to detect a position of the belt member in a rotating direction; and a control section to operate the driving section so as to set a starting position of suction work, in a conveying direction of the belt member, on an area having suitable distribution of the suction holes, based on information detected by the detecting section.

Abstract: A sheet feeding apparatus which includes: a sheet loading tray for stacking sheets; a suction and conveyance section placed above stacked sheets on the sheet loading tray and sucks and conveys a sheet in the sheet conveying direction; an air blowing section which blows air at the stacked sheets on the sheet loading tray and causes the sheet to float up; a skew correction section which is provided with a pair of conveyance rollers, and corrects a skew of the sheet being conveyed by the suction and conveyance section; and a control section which controls a force of sucking the sheet, wherein the control section changes the force of sucking the sheet from a first level to a second level that is lower than the first level, before a leading edge of the sheet butts against a pair of conveyance rollers of the skew correction section.

Abstract: A sheet feeding apparatus which includes a sheet loading tray for stacking sheets; a suction and conveyance section which is placed above stacked sheets on the sheet loading tray and sucks and conveys a sheet in the sheet conveying direction; an air blowing section which blows air at the stacked sheets on the sheet loading tray and causes the sheet to float up; and a skew correction section which corrects a skew of the sheet conveyed by the suction and conveyance section.

Abstract: A sheet feeding apparatus is provided with a sheet feeding device 60, a first air blow device 40 to blow air towards a side edge of a sheet bundle and a sheet side regulation member 71. The sheet side edge regulation member is provided with an air outlet 72 to blow air towards the side edge of the sheet bundle and an exhaust outlet 73 to exhaust air accumulated between a sheet separated from the sheet bundle and the sheet bundle.

Abstract: A sheet feeding device includes: a sheet feeding tray adapted to stack a sheet bundle including a plurality of sheets thereon; a blowing section which blows air against a leading edge of the sheet bundle in a sheet conveyance direction from a front side of the sheet conveyance direction; a sticking and conveying section which sticks an uppermost sheet stacked on the sheet feeding tray by air sucking, and feeds the uppermost sheet to a conveyance roller; a sucking duct provided inside the sticking and conveying section, which is divided into a plurality of ducts in the sheet conveyance direction; and an intercepting member which intercepts at least one of the plurality of divided ducts.

Abstract: A sheet feeding apparatus which includes: a sheet loading tray for stacking sheets; a suction and conveyance section placed above stacked sheets on the sheet loading tray and sucks and conveys a sheet in the sheet conveying direction; an air blowing section which blows air at the stacked sheets on the sheet loading tray and causes the sheet to float up; a skew correction section which is provided with a pair of conveyance rollers, and corrects a skew of the sheet being conveyed by the suction and conveyance section; and a control section which controls a force of sucking the sheet, wherein the control section changes the force of sucking the sheet from a first level to a second level that is lower than the first level, before a leading edge of the sheet butts against a pair of conveyance rollers of the skew correction section.

Abstract: A sheet feeding apparatus which includes a sheet loading tray for stacking sheets; a suction and conveyance section which is placed above stacked sheets on the sheet loading tray and sucks and conveys a sheet in the sheet conveying direction; an air blowing section which blows air at the stacked sheets on the sheet loading tray and causes the sheet to float up; and a skew correction section which corrects a skew of the sheet conveyed by the suction and conveyance section.

Abstract: A sheet feeding apparatus which includes a sheet loading tray for stacking sheets; a suction and conveyance section which is placed above stacked sheets on the sheet loading tray and sucks and conveys a sheet in the sheet conveying direction; an air blowing section which blows air at the stacked sheets on the sheet loading tray and causes the sheet to float up; and a skew correction section which corrects a skew of the sheet conveyed by the suction and conveyance section.