Abstract: The invention provides a film carrier tape for mounting electronic devices thereon, which film carrier tape enables reliable formation of a predetermined wiring pattern in a pattern-forming region and lower production cost. The film carrier tape of the present invention for mounting electronic devices thereon, including an insulating film serving as a tape substrate, and a wiring pattern formed of a conductor layer provided on a surface of the insulating film, the insulating film having a plurality of sprocket holes provided along respective side of longitudinal edges of the wiring pattern, wherein the shortest distance between said sprocket holes and corresponding edges of said wiring pattern is less than 0.7 mm. Thus, production cost of the film carrier tape can be reduced. The invention also provides a method of manufacturing the film carrier tape.

Abstract: The invention provides a film carrier tape for mounting electronic devices thereon, which film carrier tape enables reliable formation of a predetermined wiring pattern in a pattern-forming region and lower production cost. The film carrier tape of the present invention for mounting electronic devices thereon, including an insulating film serving as a tape substrate, and a wiring pattern formed of a conductor layer provided on a surface of the insulating film, the insulating film having a plurality of sprocket holes provided along respective side of longitudinal edges of the wiring pattern, wherein the shortest distance between said sprocket holes and corresponding edges of said wiring pattern is less than 0.7 mm. Thus, production cost of the film carrier tape can be reduced. The invention also provides a method of manufacturing the film carrier tape.