Patents by Inventor Akira Kugita

Akira Kugita has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of manufacturing semiconductor device
    Patent number: 7884027
    Abstract: A method of manufacturing a semiconductor device includes subjecting a semiconductor substrate having an aluminum film formed thereabove to a processing to at least partially expose a surface of the aluminum film, and carrying out a surface processing to remove an after-processing residue that remains on the exposed surface of the aluminum film. The surface processing includes treating the exposed surface of the aluminum film with a first liquid chemical containing an anion component and then with an alkaline, second liquid chemical.
    Type: Grant
    Filed: October 31, 2006
    Date of Patent: February 8, 2011
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Yoshihiro Uozumi, Takashi Hirayama, Akira Kugita
  • Method of manufacturing semiconductor device
    Publication number: 20070105378
    Abstract: A method of manufacturing a semiconductor device includes subjecting a semiconductor substrate having an aluminum film formed thereabove to a processing to at least partially expose a surface of the aluminum film, and carrying out a surface processing to remove an after-processing residue that remains on the exposed surface of the aluminum film. The surface processing includes treating the exposed surface of the aluminum film with a first liquid chemical containing an anion component and then with an alkaline, second liquid chemical.
    Type: Application
    Filed: October 31, 2006
    Publication date: May 10, 2007
    Inventors: Yoshihiro Uozumi, Takashi Hirayama, Akira Kugita