Patents by Inventor Akira Kuromaru

Akira Kuromaru has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Anti-short bonding pad structure
    Patent number: 4539582
    Abstract: A semiconductor device comprising a semiconductor substrate, a first insulating layer formed on the semiconductor substrate, a bonding pad formed on the first insulating layer, a conductive layer formed on the first insulating layer and adjacent to the bonding pad, and a second insulating layer formed to cover the conductive layer characterized in that the surface of the second insulating layer formed on and near the conductive layer is made at the same level as or lower than the surface of the bonding pad.
    Type: Grant
    Filed: September 11, 1984
    Date of Patent: September 3, 1985
    Assignee: Tokyo Shibaura Denki Kabushiki Kaisha
    Inventor: Akira Kuromaru