Abstract: A sensor chip of an embodiment of the present disclosure includes: a semiconductor substrate including a pixel array section in which a plurality of pixels is arranged in an array; a light receiving element provided in the semiconductor substrate for each of the pixels and including a multiplier region in which avalanche multiplication of carriers is caused by a high electric field region; and a first pixel separation section provided between the pixels, the first pixel separation section extending from one surface of the semiconductor substrate toward another surface thereof opposed to the one surface, and having a bottom in the semiconductor substrate.

Abstract: A sensor chip according to an embodiment of the present disclosure includes a pixel. The pixel includes a photoelectric converter, a light reflector, and a light collector. The photoelectric converter includes a light entering surface which light enters and a multiplication region in which avalanche multiplication of carriers is caused by a high electric-field region. The light reflector is provided to oppose a surface, of the photoelectric converter, on an opposite side to the light entering surface. The light collector is provided between the photoelectric converter and the light reflector.

Abstract: A semiconductor device includes a package substrate, a semiconductor chip and a solder bump. The semiconductor chip is disposed on the package substrate. The package substrate includes a first electrode pad, and a first insulating film formed such that the first insulating film exposes a first portion of a surface of the first electrode pad. The semiconductor chip includes a second electrode pad and a second insulating film formed such that the second insulating film exposes a second portion of a surface of the second electrode pad. The second electrode pad is formed on the first electrode pad through the solder bump. L2/L1 is 0.63 or more in a cross section passing through the first electrode pad, the solder bump and the second electrode pad. A first length of the first portion and a second length of the second portion are defined as L1 and L2, respectively.

Abstract: An image forming apparatus includes an image reading device, a holding member that is rod-like, and an image forming device having an image forming unit that forms an image on a sheet, and having a wall part having a hole. The image reading device reads an image on a document, is provided on the image forming device, and rotates around a rotation shaft openable and closable with respect to the image forming device. The holding member has one end attached on the image reading device, and holds the image reading device opened with respect to the image forming device when another end of the holding member is inserted into the hole formed in the wall part. The holding member includes a first regulation part that comes into contact with a lower surface of the wall part to regulate detachment of the other end of the holding member from the hole.

Abstract: A sheet discharging apparatus includes a discharge unit and a stacking portion. The stacking portion includes a first supporting portion including a first part and a second part provided with an interval therebetween in a width direction of the sheets, and configured to support a first sheet having a width larger than the interval between the first part and the second part, and a second supporting portion provided at a position between the first part and the second part in the width direction and below the first supporting portion in a gravity direction, and configured to support a second sheet having a width smaller than the interval. The second supporting portion includes a recess portion where the second supporting portion is recessed in the gravity direction to be lower than a height at which the second supporting portion comes into contact with a lower surface of the second sheet.

Abstract: A semiconductor device including a multilayer wiring layer comprising a first wiring, a first insulating film formed on the multilayer wiring layer and having a first opening exposing a portion of the first wiring, a second insulating film formed on the first insulating film and having a second opening continuing with the first opening, and an inductor formed of the first wiring, and a second wiring electrically connected with the first wiring through a via formed in the first opening. A side surface of the via contacts with the first insulating film, and does not contact with the second insulating film.

Abstract: An image reading apparatus includes a rotatable feeding member, an image portion, a feeding guide, a first driven rolling member, and a second driven rolling member. The first driven rolling member and a second driven rolling member provided downstream of the first driven rolling member with respect to a sheet feeding direction are provided in overlapping directions as seen in an axial direction of the rotatable feeding member and are provided in non-overlapping directions as seen in the sheet feeding direction.

Abstract: A sensor includes a first substrate including at least a first pixel. The first pixel includes an avalanche photodiode to convert incident light into electric charge and includes an anode and a cathode. The cathode is in a well region of the first substrate. The first pixel includes an isolation region that isolates the well region from at least a second pixel that is adjacent to the first pixel. The first pixel includes a hole accumulation region between the isolation region and the well region. The hole accumulation region is electrically connected to the anode.

Abstract: A semiconductor device includes a package substrate, a semiconductor chip and a solder bump. The semiconductor chip is disposed on the package substrate. The package substrate includes a first electrode pad, and a first insulating film formed such that the first insulating film exposes a first portion of a surface of the first electrode pad. The semiconductor chip includes a second electrode pad and a second insulating film formed such that the second insulating film exposes a second portion of a surface of the second electrode pad. The second electrode pad is formed on the first electrode pad through the solder bump. L2/L1 is 0.63 or more in a cross section passing through the first electrode pad, the solder bump and the second electrode pad. A first length of the first portion and a second length of the second portion are defined as L1 and L2, respectively.

Abstract: An in-vehicle control apparatus controls a plurality of repeaters included in an in-vehicle network assembled in a vehicle, based on a control scenario(s) associated with states of the vehicle and control contents, each of which is set in a corresponding one of the plurality of repeaters.

Abstract: The present disclosure relates to a sensor chip and an electronic apparatus each of which enables carriers generated through photoelectric conversion to be efficiently used. At least one or more avalanche multiplication regions multiplying carriers generated through photoelectric conversion are provided in each of a plurality of pixel regions in a semiconductor substrate, and light incident on the semiconductor substrate is condensed by an on-chip lens. Then, a plurality of on-chip lenses is arranged in one pixel region. The present technology, for example, can be applied to a back-illuminated type CMOS image sensor.

Abstract: An image reading apparatus includes an original tray, an original feeding portion, an original reading portion, an original discharging portion, an original discharge tray, an extension tray, and a rotation guide. A stacking surface of the original discharge tray is provided with an opening through which the rotation guide is capable of passing when the rotation guide rotates from a first position to a second position. In a state in which the extension tray is held at a pulled-out position, the rotation guide is rotatable relative to the extension tray from the first position toward the second position. In a state in which the extension tray is held at an accommodated position, the rotation guide is rotatable from the first position toward the second position by passing through the opening.

Abstract: An improved device capable of releasing a drug in response to stimuli such as a glucose concentration is provided. Provided is a drug delivery device, including a porous body such as a hollow fiber having biocompatibility and drug permeability, a stimuli-responsive gel composition filling inside of the porous body, and a drug surrounded by the gel composition inside of the porous body.

Abstract: This technology relates to a solid-state image sensor configured to make smaller the chip size of a CIS that uses an organic photoelectric conversion film, and to an electronic apparatus. A solid-state image sensor according to a first aspect of this technology is characterized in that it includes a first substrate and a second substrate stacked one on top of the other and a first organic photoelectric conversion film formed on the first substrate and that a latch circuit is formed on the second substrate. This technology may be applied to back-illuminated CISs, for example.

Abstract: The present disclosure relates to a sensor chip and an electronic apparatus each of which enables carriers generated through photoelectric conversion to be efficiently used. At least one or more avalanche multiplication regions multiplying carriers generated through photoelectric conversion are provided in each of a plurality of pixel regions in a semiconductor substrate, and light incident on the semiconductor substrate is condensed by an on-chip lens. Then, a plurality of on-chip lenses is arranged in one pixel region. The present technology, for example, can be applied to a back-illuminated type CMOS image sensor.

Abstract: In a method of manufacturing a semiconductor device according to one embodiment, after a semiconductor wafer including a non-volatile memory, a bonding pad and an insulating film comprised of an organic material is provided, a probe needle is contacted to a surface of the bonding pad located in a second region, and a data is written to the non-volatile memory. Here, the insulating film is formed by performing a first heat treatment to the organic material. Also, after a second heat treatment is performed to the semiconductor wafer, and the non-volatile memory to which the data is written is checked, a barrier layer and a first solder material are formed on the surface of the bonding pad located in a first region by using an electroplating method. Further, a bump electrode is formed in the first region by performing a third heat treatment to the first solder material.

Abstract: An image reading apparatus includes a rotatable feeding member, an image portion, a feeding guide, a first driven rolling member, and a second driven rolling member. The first driven rolling member and a second driven rolling member provided downstream of the first driven rolling member with respect to a sheet feeding direction are provided in overlapping directions as seen in an axial direction of the rotatable feeding member and are provided in non-overlapping directions as seen in the sheet feeding direction.

Abstract: Provided is a sensor that is highly accurate while ensuring reduced power consumption. A sensor is an electronic circuit that includes a sensor element, an analog filter, an A/D converter, and first and second electronic circuit. The analog filter filters a waveform that includes a sensor signal from the sensor element and noise based on a servo signal. The A/D converter converts the waveform filtered by the analog filter into a first digital signal. The first electronic circuit includes a digital filter and acquires a second digital signal by performing signal processing including at least a filtering process on the servo signal by using the digital filter. The second electronic circuit acquires a third digital signal by subtracting the second digital signal from the first digital signal. A setting for the signal processing for acquiring the second digital signal is changed on the basis of the third digital signal.

Abstract: A sugar-responsive gel that is highly resistant to temperature changes, and a sugar-responsive drug delivery device including such a gel. The sugar-responsive gel, which comprises a gel composition including a monomer having a hydroxyl group in addition to a phenylboronic-acid-based monomer, can exhibit suitable temperature resistance. A sugar-responsive drug delivery device including such a sugar-responsive gel is less susceptible to the effects of temperature changes, and therefore can prevent undesirable excessive delivery of a drug such as insulin.

Abstract: Provided is a toner including toner particles. The toner particles has a volume particle diameter distribution index on a side of the largest diameter (GSDv (90/50)) of 1.26 or less; a number particle diameter distribution index on a side of the smallest diameter (GSDp (50/10)) of 1.28 or less; GSDv (90/50)/GSDp (50/10) of from 0.96 to 1.01; and an average circularity of 0.95 or more and 1.00 or less.