Abstract: A first storage system compresses data relating to read and write by a primary site and stores the data in a first physical volume. A second storage system compresses data relating to read and write by a secondary site and stores the data in a second physical volume. When performing replication for transferring the data stored in the first physical volume of the first storage system to the second storage system and storing the data in the second physical volume, the first storage system and the second storage system determine, based on a compression scheme executable by the first storage system and a compression scheme executable by the second storage system, a compression scheme to be applied to transfer target data and transfer the transfer target data compressed by the determined compression scheme.

Abstract: The resin material 336 is arranged in a first region 421 surrounded by the fin base 440, the inclined portion 343 of the cover member 340, and the outermost peripheral heat dissipation fins 334 arranged on the outermost peripheral side. Then, the resin material 336 is caused to protrude to the first region 421. That is, the resin material 336 is arranged in the first region 421. In a cross section perpendicular to the refrigerant flow direction (Y direction), a cross-sectional area of the first region 421 is larger than an average cross-sectional area 423 of the adjacent heat dissipation fins 331. Then, a cross-sectional area of a second region 422 formed between the resin material 336 arranged in the first region 421 and the outermost peripheral heat dissipation fin 334 arranged on the outermost peripheral side is smaller than the average cross-sectional area 423 of the heat dissipation fins.

Abstract: A method for assisting in cell isolation from a biological tissue section includes: obtaining cell images that are each an image of cells isolated from the biological tissue section, the biological tissue section being soaked in a solution containing an enzyme; calculating, from the cell images, a number of the cells isolated from the biological tissue section as an indicator of the cell isolation from the biological tissue section; and visualizing a temporal change in the indicator on the basis of a history of the indicator.

Abstract: An electronic component includes: a body having a first surface; and a plurality of electrodes disposed on the first surface. Each of the plurality of electrodes includes a base electrode and a plating film covering the base electrode. The plurality of electrodes include: first-class electrodes individually disposed on the first surface and connected to each other by a wiring line passing through an inside of the body; and a second-class electrode individually disposed on the first surface and not connected to other electrodes of the plurality of electrodes. On the first surface, a second region in which the second-class electrode is disposed more protrudes than a first region in which each of the first-class electrodes is disposed.

Abstract: A wireless base station executes first processing, in response to the reception of the radio wave from the wireless terminal, the wireless base station determines the active utilization of the wireless communication service by the wireless terminal on the basis of the past connection record information of the wireless terminal. There is a second processing in a case where the wireless terminal is a terminal that cannot expect active use of the wireless communication service. In the second processing, the wireless base station allocates a communication resource to the wireless terminal under a condition of a predetermined connection operation by the wireless terminal. The third processing is a process in a case where the wireless terminal is a terminal that can expect active use of the wireless communication service. In the third processing, the wireless base station allocates a communication resource to the wireless terminal without a predetermined connection operation.

Abstract: A power semiconductor device includes an insulating substrate on which a first conductor layer is arranged on one surface, a first conductor that is connected to the first conductor layer via a first connecting material, and a semiconductor element that is connected to the first conductor via a first connecting material. When viewed from a direction perpendicular to an electrode surface of the semiconductor element, the first conductor includes a peripheral portion formed larger than the semiconductor element. A first recess is formed in the peripheral portion so that a thickness of the first connecting material becomes thicker than other portions.

Abstract: A semiconductor module includes a semiconductor device that includes first and second fin bases having first and second connecting portions and a resin for sealing the outer peripheral side surfaces of first to fourth conductors, and a flow path forming body connected to the first and second connecting portions of the first and second fin bases. A first elastically deformed portion, which is elastically deformed, is provided such that a distance in a thickness direction between the outer peripheral ends of the first and second connecting portions becomes smaller than a distance in a thickness direction between intermediate portions of the first and second connecting portions. The resin is filled between the first and second connecting portions of the first and second fin bases are filled with the resin therebetween.

Abstract: A wireless communication monitoring system for monitoring a hardware failure of a wireless communication unit of a wireless communication device using a remote monitoring control device, in which the wireless communication device transmits or receives a predetermined radio signal to or from a monitoring device added or attached to the host device to perform a life and death check for checking an operation, and the remote monitoring control device detects a hardware failure of the wireless communication unit of the wireless communication device on the basis of a result of the life and death check received from the wireless communication device. This makes it possible to detect a failure that cannot be detected from information obtained from a device state request to a wireless communication device of the related art.

Abstract: No consideration is given to heat transferred from a semiconductor module to a capacitor via a bus bar module. The heat generated by a semiconductor module (1) is transferred to a bus bar module (3) via a DC terminal (1A) of the semiconductor module (1). As illustrated in FIG. 4(B), the heat transferred to the bus bar module 3 is then transferred to the pressing member 5 via the annular conductor 8 and the bolt 5A. Since the pressing member 5 is in close contact with the second cooler 2B, the heat transferred to the pressing member 5 is cooled by the second cooler 2B. On the other hand, the heat transferred to the convex portion 6A of the housing 6 is transferred to the first cooler 2A via the housing 6 and cooled. As a result, in the configuration in which a capacitor (4) is connected to the semiconductor module (1) via the bus bar module (3), the heat transferred from the semiconductor module (1) to the capacitor (4) can be suppressed.

Abstract: An electrical device body connectable to a battery pack, includes a drive part, and a terminal part. The terminal part having a positive input terminal electrically connected to the drive part, a negative input terminal electrically connected to the drive part, and a short circuit element having a first terminal part, a second terminal part, and a connection part connecting the first terminal part and the second terminal part, wherein the positive input terminal and the negative input terminal are disposed on an upper side of the terminal part and the short circuit element is disposed on a lower side of the terminal part in an upper-lower direction, the positive input terminal and the negative input terminal being apart from each other in a left-right direction crossing the upper-lower direction.

Abstract: A battery pack houses first and second cell units that are composed of a plurality of cells, and has a positive electrode power source terminal and a negative electrode power source terminal. This battery pack is provided with a series connector capable of connecting, in series, the first and second cell units and a parallel connector capable of connecting, in parallel, the first and second cell units, and is capable of switching between a parallel connection voltage and a series connection voltage. In the case of attachment to the high voltage electrical device body, the series connector becomes conductive and the parallel connector pair is cut off by the action of the series/parallel switching terminal. In the case of attachment to a low voltage electrical device body, the state is returned to an initial state, the series connector is cut off, and the parallel connector pair becomes conductive.

Abstract: In order that the output voltage of a battery pack can be switched and the battery pack can be shared among different voltage electric appliances, this battery pack has a switching mechanism that switches outputting a low voltage by parallel connection of two cell units or outputting a high voltage by series connection of the two cell units, said two cell units each being composed of a plurality of cells connected in series, wherein the switching mechanism is configured from a change-over switch having an operation lever (452). The change-over switch is embedded in a battery pack (400), and an operator is able to manually switch outputting 18 V by setting the operation lever (452) at a first position or outputting 36 V by setting the operation lever (452) at a second position.

Abstract: The resin material 336 is arranged in a first region 421 surrounded by the fin base 440, the inclined portion 343 of the cover member 340, and the outermost peripheral heat dissipation fins 334 arranged on the outermost peripheral side. Then, the resin material 336 is caused to protrude to the first region 421. That is, the resin material 336 is arranged in the first region 421. In a cross section perpendicular to the refrigerant flow direction (Y direction), a cross-sectional area of the first region 421 is larger than an average cross-sectional area 423 of the adjacent heat dissipation fins 331. Then, a cross-sectional area of a second region 422 formed between the resin material 336 arranged in the first region 421 and the outermost peripheral heat dissipation fin 334 arranged on the outermost peripheral side is smaller than the average cross-sectional area 423 of the heat dissipation fins.

Abstract: An object of the present invention is to provide a power semiconductor device capable of improving seismic resistance while suppressing a decrease in assembly efficiency. According to the present invention, a power semiconductor device 1 includes an element installation conductor 2 including a first conductor portion 20a that is made of metal and is used for installing a power semiconductor element 300, a second conductor portion 20b that is made of metal and forms one or more main terminals 2a for transmitting a current to the power semiconductor element 300, and one or more control terminals 2b for transmitting a switching control signal to the power semiconductor element 300, and a third conductor portion 20c that is made of metal and is provided at a tip portion of the control terminal 2b.

Abstract: A sheet-shaped member 440 including a resin insulating layer 441 and a metal foil 442 is used. The sheet-shaped member 440 is deformed following warpage or step difference in a second conductor plate 431 and a fourth conductor plate 433, and therefore, the thickness of the resin insulating layer 441 can be set to a constant thickness of, for example, 120 ?m capable of securing insulation properties. By plastically deforming a metal-based heat conduction member 450 having a thickness of, for example, 120 ?m interposed between the sheet-shaped member 440 and a cooling member 340, the thickness of the metal-based heat conduction member 450 is changed to absorb the warpage or step difference generated in the second conductor plate 431 and the fourth conductor plate 433. This results in remarkable improvement in heat dissipation as compared with a case where the conductor plates are brought into contact with the cooling member 340 via an insulating layer alone.

Abstract: No consideration is given to heat transferred from a semiconductor module to a capacitor via a bus bar module. The heat generated by a semiconductor module (1) is transferred to a bus bar module (3) via a DC terminal (1A) of the semiconductor module (1). As illustrated in FIG. 4(B), the heat transferred to the bus bar module 3 is then transferred to the pressing member 5 via the annular conductor 8 and the bolt 5A. Since the pressing member 5 is in close contact with the second cooler 2B, the heat transferred to the pressing member 5 is cooled by the second cooler 2B. On the other hand, the heat transferred to the convex portion 6A of the housing 6 is transferred to the first cooler 2A via the housing 6 and cooled. As a result, in the configuration in which a capacitor (4) is connected to the semiconductor module (1) via the bus bar module (3), the heat transferred from the semiconductor module (1) to the capacitor (4) can be suppressed.

Abstract: Detection accuracy of a collector sense in detecting a voltage is improved. A power module 300 has a first conductor 410 and a second conductor 411 to which a plurality of active elements 317 and 315 configuring upper and lower arm circuits are connected. In addition, the power module 300 has an AC side terminal 320B protruding from one side 301a, a positive electrode side terminal 315B and a negative electrode side terminal 319B which protrude from the other side 301b, an intermediate electrode portion 414 that connects the first conductor 410 and the second conductor 411 to each other, and a collector sense wiring 452a in which a collector electrode of an active element 157 and the first conductor 410 are connected to each other via a sense connection portion 415.

Abstract: An inductance reduction effect is improved by reducing the distortion of an inductance loop generated when a switching element is turned on and off. An upper arm circuit portion (201U) and a lower arm circuit portion (201L) are provided so as to be shifted in the second direction orthogonal to the first direction in which the upper arm circuit portion (201U) and the lower arm circuit portion (201L) are separated from each other, and at least a part of a snubber circuit connection portion region (202) constituted by a positive electrode terminal portion (181), a negative electrode terminal portion (155), and a snubber element (30) is provided in the first region generated by shifting the upper arm circuit portion (201U) from the lower arm circuit portion (201L) in the second direction.

Abstract: Providing an electric tool with excellent cooling efficiency. An electric tool includes: a housing 2; a motor 3; a fan 34; a sensing portion 41; a switching portion 42; and a circuit board 40. The motor 3 is accommodated in the housing 2. The motor 3 includes a stator 33, a rotor 32, and a rotating shaft 31. The rotor 32 is rotatable relative to the stator 33. The rotating shaft 31 is rotatable together with the rotor 32. The fan 34 is configured to generate a cooling air flow inside the housing 2. The sensing portion 41 is configured to detect a rotated position of the rotor 32. The switching portion 41 controls a rotation of the rotor 32. The sensing portion 41 and the switching portion 42 are mounted on the circuit board 40.

Abstract: A power tool has a fan guide for straightening the flow of cooling air generated by a fan, wherein the branching passages through are provided for causing a portion of the cooling air drawn into the fan from a ventilation hole to diverge from a flow toward an exhaust port formed on a bearing guide side, and the portion of the cooling air flows toward an inlet and thereby circulates inside a housing. The branching passages through provided to the fan guide are formed so as to be inclined in the same direction as a circumferential direction so that air path resistance during actual operation (in an intermediate-speed region) does not increase.