Patents by Inventor Akira Miyachi
Akira Miyachi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11248065Abstract: An active energy ray-curable resin composition which contains (A) inorganic oxide particles each having an organic functional group on the surface, (B) a siloxane oligomer which has at least one functional group selected from the group consisting of a (meth)acryloyl group, an epoxy group and a vinyl group, while having a weight average molecular weight of 200-3,000, (C) a polyfunctional (meth)acrylate having a specific structure, (D) a urethane (meth)acrylate having two or more (meth)acryloyl groups in each molecule, and (E) an ultraviolet absorbent.Type: GrantFiled: December 12, 2018Date of Patent: February 15, 2022Assignee: Mitsubishi Chemical CorporationInventors: Akira Miyachi, Riina Kanbara, Masashi Serizawa
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Patent number: 11021618Abstract: Provided are: a curable composition that makes it possible to form a cured film having excellent wear resistance and weather resistance; a laminate that is provided with the cured film; and an automobile headlamp lens. The curable composition makes it possible to obtain a cured film in which the relationship between a haze value (?Hx) that is obtained by a wear resistance test and a haze value (?Hy) that is obtained by a weather resistance test satisfies ?Hy??0.3 ?Hx+5.0 when a cured film having a thickness of 10 ?m is produced.Type: GrantFiled: March 30, 2015Date of Patent: June 1, 2021Assignee: Mitsubishi Chemical CorporationInventors: Jun Ito, Masashi Serizawa, Hiroyuki Satou, Akira Miyachi, Riina Kanbara
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Publication number: 20210032385Abstract: The present invention provides a curable composition which has a viscosity suitable for spray coating even at a high solid content and from which a cured product, on which precipitation of an ultraviolet absorber is suppressed and which has excellent weatherability and hot water resistance, is obtained, a cured product using the curable composition, and a stacked body. Provided is a curable composition including: a (meth)acrylate A; a urethane (meth)acrylate B; an ultraviolet absorber C; and a photopolymerization initiator D, in which the (meth)acrylate A has at least one of a dendrimer structure and a hyperbranched structure, a content of the (meth)acrylate A is 55 parts by mass to 95 parts by mass based on 100 parts by mass in total of the (meth)acrylate A and the urethane (meth)acrylate B, a content of the ultraviolet absorber C is 1.Type: ApplicationFiled: October 16, 2020Publication date: February 4, 2021Applicant: Mitsubishi Chemical CorporationInventors: Yuka IIDA, Akira MIYACHI, Takahiro MUKUDA
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Publication number: 20190112409Abstract: An active energy ray-curable resin composition which contains (A) inorganic oxide particles each having an organic functional group on the surface, (B) a siloxane oligomer which has at least one functional group selected from the group consisting of a (meth)acryloyl group, an epoxy group and a vinyl group, while having a weight average molecular weight of 200-3,000, (C) a polyfunctional (meth)acrylate having a specific structure, (D) a urethane (meth)acrylate having two or more (meth)acryloyl groups in each molecule, and (E) an ultraviolet absorbent.Type: ApplicationFiled: December 12, 2018Publication date: April 18, 2019Applicant: Mitsubishi Chemical CorporationInventors: Akira MIYACHI, Riina KANBARA, Masashi SERIZAWA
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Publication number: 20170183515Abstract: Provided are: a curable composition that makes it possible to form a cured film having excellent wear resistance and weather resistance; a laminate that is provided with the cured film; and an automobile headlamp lens. The curable composition makes it possible to obtain a cured film in which the relationship between a haze value (?Hx) that is obtained by a wear resistance test and a haze value (?Hy) that is obtained by a weather resistance test satisfies ?Hy??0.3 ?Hx+5.0 when a cured film having a thickness of 10 ?m is produced.Type: ApplicationFiled: March 30, 2015Publication date: June 29, 2017Applicant: MITSUBISHI RAYON CO., LTD.Inventors: Jun ITO, Masashi SERIZAWA, Hiroyuki SATOU, Akira MIYACHI, Riina KANABARA
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Patent number: 9597819Abstract: This method of cutting a high-hardness material with a multi-wire saw includes the steps of: (A) providing at least one ingot which includes a body portion 10a with two ends and a low-quality crystal portion 10e that is located at only one of the two ends of the body portion; (B) fixing the at least one ingot onto a fixing base; and (C) slicing the at least one ingot by moving the ingot with respect to a saw wire so that the saw wire does not contact with the low-quality crystal portion 10e of the at least one ingot but does contact with its body portion 10a.Type: GrantFiled: August 30, 2013Date of Patent: March 21, 2017Assignee: HITACHI METALS, LTD.Inventors: Sadahiko Kondo, Akira Miyachi, Toshihiko Hatanaka
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Publication number: 20170015774Abstract: Provided is an active energy ray-curable resin composition with which it is possible to form a cured film, having outstanding scratch resistance, hardness, and weather resistance, on the surface of a molded resin article for an automobile headlamp lens. The active energy ray-curable resin composition is used to form a cured film on the surface of a molded resin article for an automobile headlamp lens and comprises (A) 10-70% by mass of a mono- or poly-pentaerythritol poly(meth)acrylate compound having a specific structure, (B) 10-50% by mass of a urethane(meth)acrylate compound having at least two (meth)acryloyloxy groups, at least one amido group, and at least two urethane bonds, and (C) 20-80% by mass of a poly[(meth)acryloyloxyalkyl]isocyanurate compound having a specific structure.Type: ApplicationFiled: March 9, 2015Publication date: January 19, 2017Applicant: MITSUBISHI RAYON CO., LTD.Inventors: Akira MIYACHI, Hiroyuki SATOU
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Publication number: 20150202700Abstract: In a method of cutting a high-hardness material with a multi-wire saw, an ingot of the high-hardness material is sliced into a plurality of wafers by cutting the ingot at multiple points simultaneously with the multi-wire saw. The method comprises repeating a run cycle of reciprocating motion of a wire of the multi-wire saw so that the relationships (1) c1?20, given C1=b/a and (2) 0.35?c2?1.55, given c2=d/a are satisfied, where a is a maximum total contact length defined as a sum of the lengths of the ingot as projected onto multiple cut points when projecting the ingot onto the wire in a direction in which the ingot is going to be cut, b is a continuous travel distance of the wire, and d is a length of the wire newly fed in each said run cycle.Type: ApplicationFiled: January 14, 2015Publication date: July 23, 2015Inventors: Sadahiko KONDO, Akira MIYACHI
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Publication number: 20150183132Abstract: This method of cutting a high-hardness material with a multi-wire saw includes the steps of: (A) providing at least one ingot which includes a body portion 10a with two ends and a low-quality crystal portion 10e that is located at only one of the two ends of the body portion; (B) fixing the at least one ingot onto a fixing base; and (C) slicing the at least one ingot by moving the ingot with respect to a saw wire so that the saw wire does not contact with the low-quality crystal portion 10e of the at least one ingot but does contact with its body portion 10a.Type: ApplicationFiled: August 30, 2013Publication date: July 2, 2015Inventors: Sadahiko Kondo, Akira Miyachi, Toshihiko Hatanaka
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Patent number: 7025054Abstract: A method of cutting a rare-earth alloy with a wire saw, obtained by fixing abrasive grains on a core wire with a resin layer, includes the step of moving the wire saw while a portion of the rare-earth alloy being machined with the wire saw is immersed in a coolant, which is mainly composed of water and has a surface tension of about 25 mN/m to about 60 mN/m at about 25° C., thereby cutting the rare-earth alloy. In the wire saw, an average distance between two of the abrasive grains, which are adjacent to each other in a length direction, is about 150% to less than about 400% of the average grain size of the abrasive grains, an average height of portions of the abrasive grains, protruding from the surface of the resin layer, is about 70% or less of the average grain size of the abrasive grains, and a thickness deviation percentage of the resin layer with respect to the core wire is about 40%.Type: GrantFiled: February 26, 2003Date of Patent: April 11, 2006Assignee: Neomax Co., Ltd.Inventors: Sadahiko Kondo, Akira Miyachi, Hazime Ishida
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Patent number: 6945242Abstract: A method of cutting a rare-earth alloy with a wire 20, on which abrasive grains are fixed with a resin layer provided on the outer surface of a core wire, includes the steps of: providing a wire, of which the surface is coated with a lubricant including a glycol, by reeling the wire up in a pair of reel bobbins 40a and 40b; reeling the wire off one of the reel bobbins and letting the wire travel on a plurality of rollers 10a, 10b and 10c; and cutting the rare-earth alloy with the traveling wire while a portion of the rare-earth alloy being cut with the wire is supplied with a first coolant which is mainly composed of water. As a result, the life of a wire can be extended when a rare-earth alloy is cut with a wire saw machine using a coolant which is mainly composed of water.Type: GrantFiled: October 15, 2002Date of Patent: September 20, 2005Assignee: Neomax Co., Ltd.Inventors: Sadahiko Kondo, Akira Miyachi, Hazime Ishida
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Publication number: 20050155595Abstract: A method of cutting a rare-earth alloy with a wire saw, obtained by fixing abrasive grains on a core wire with a resin layers, includes the step of moving the wire saw while a portion of the rare-earth alloy being machined with the wire saw is immersed in a coolant, which is mainly composed of water and has a surface tension of about 25 mN/m to about 60 mN/m at about 25° C., thereby cutting the rare-earth alloy. In the wire saw, an average distance between two of the abrasive grains, which are adjacent to each other in a length direction, is about 150% to less than about 400% of the average grain size of the abrasive grains, an average height of portions of the abrasive grains, protruding from the surface of the resin layer, is about 70% or less of the average grain size of the abrasive grains, and a thickness deviation percentage of the resin layer with respect to the core wire is about 40%.Type: ApplicationFiled: February 26, 2003Publication date: July 21, 2005Applicant: NEOMAX CO., LTD.Inventors: Sadahiko Kondo, Akira Miyachi, Hazime Ishida
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Patent number: 6896595Abstract: A method for cutting a rare earth alloy using a wire with abrasive grains fixed to a core wire, including the step of cutting the rare earth alloy with the wire traveling in a state that a portion of the rare earth alloy to be cut with the wire is immersed in a coolant containing water as the main component, the coolant having a surface tension at 25° C. in a range of 25 mN/m to 60 mN/m.Type: GrantFiled: June 28, 2004Date of Patent: May 24, 2005Assignee: Neomax Co., Ltd.Inventors: Sadahiko Kondo, Akira Miyachi, Hazime Ishida
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Patent number: 6837778Abstract: A method for cutting a rare earth alloy using a wire with abrasive grains fixed to a core wire, including the step of cutting the rare earth alloy with the wire traveling in a state that a portion of the rare earth alloy to be cut with the wire is immersed in a coolant containing water as the main component, the coolant having a surface tension at 25° C. in a range of 25 mN/m to 60 mN/m.Type: GrantFiled: November 23, 2001Date of Patent: January 4, 2005Assignee: Neomax Co., LTDInventors: Sadahiko Kondo, Akira Miyachi, Hazime Ishida
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Publication number: 20040255924Abstract: A method of cutting a rare-earth alloy with a wire 20, on which abrasive grains are fixed with a resin layer provided on the outer surface of a core wire, includes the steps of: providing a wire, of which the surface is coated with a lubricant including a glycol, by reeling the wire up in a pair of reel bobbins 40a and 40b; reeling the wire off one of the reel bobbins and letting the wire travel on a plurality of rollers 10a, 10b and 10c; and cutting the rare-earth alloy with the traveling wire while a portion of the rare-earth alloy being cut with the wire is supplied with a first coolant which is mainly composed of water. As a result, the life of a wire can be extended when a rare-earth alloy is cut with a wire saw machine using a coolant which is mainly composed of water.Type: ApplicationFiled: April 15, 2004Publication date: December 23, 2004Inventors: Sadahiko Kondo, Akira Miyachi, Hazime Ishida
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Publication number: 20040231134Abstract: A method for cutting a rare earth alloy using a wire with abrasive grains fixed to a core wire, including the step of cutting the rare earth alloy with the wire traveling in a state that a portion of the rare earth alloy to be cut with the wire is immersed in a coolant containing water as the main component, the coolant having a surface tension at 25° C. in a range of 25 mN/m to 60 mN/m.Type: ApplicationFiled: June 28, 2004Publication date: November 25, 2004Applicant: Sumitomo Special Metals Co., Ltd.Inventors: Sadahiko Kondo, Akira Miyachi, Hazime Ishida
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Patent number: 6443143Abstract: A method for cutting a rare earth alloy of the invention using a wire having abrasive grains stuck thereon is disclosed. The method includes the step of cutting the rare earth alloy while supplying a cutting fluid having a predetermined kinematic viscosity between the wire and the rare earth alloy. The method further includes the step of varying the temperature of a supplied amount of fresh cutting fluid in order to control the kinematic viscosity of the cutting fluid.Type: GrantFiled: September 14, 2000Date of Patent: September 3, 2002Assignee: Sumitomo Special Metals Co., Ltd.Inventors: Hazime Ishida, Sadahiko Kondo, Akira Miyachi
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Publication number: 20020115390Abstract: A method for cutting a rare earth alloy using a wire with abrasive grains fixed to a core wire, including the step of cutting the rare earth alloy with the wire traveling in a state that a portion of the rare earth alloy to be cut with the wire is immersed in a coolant containing water as the main component, the coolant having a surface tension at 25° C. in a range of 25 mN/m to 60 mN/m.Type: ApplicationFiled: November 23, 2001Publication date: August 22, 2002Inventors: Sadahiko Kondo, Akira Miyachi, Hazime Ishida