Patents by Inventor Akira Miyachi

Akira Miyachi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11248065
    Abstract: An active energy ray-curable resin composition which contains (A) inorganic oxide particles each having an organic functional group on the surface, (B) a siloxane oligomer which has at least one functional group selected from the group consisting of a (meth)acryloyl group, an epoxy group and a vinyl group, while having a weight average molecular weight of 200-3,000, (C) a polyfunctional (meth)acrylate having a specific structure, (D) a urethane (meth)acrylate having two or more (meth)acryloyl groups in each molecule, and (E) an ultraviolet absorbent.
    Type: Grant
    Filed: December 12, 2018
    Date of Patent: February 15, 2022
    Assignee: Mitsubishi Chemical Corporation
    Inventors: Akira Miyachi, Riina Kanbara, Masashi Serizawa
  • Patent number: 11021618
    Abstract: Provided are: a curable composition that makes it possible to form a cured film having excellent wear resistance and weather resistance; a laminate that is provided with the cured film; and an automobile headlamp lens. The curable composition makes it possible to obtain a cured film in which the relationship between a haze value (?Hx) that is obtained by a wear resistance test and a haze value (?Hy) that is obtained by a weather resistance test satisfies ?Hy??0.3 ?Hx+5.0 when a cured film having a thickness of 10 ?m is produced.
    Type: Grant
    Filed: March 30, 2015
    Date of Patent: June 1, 2021
    Assignee: Mitsubishi Chemical Corporation
    Inventors: Jun Ito, Masashi Serizawa, Hiroyuki Satou, Akira Miyachi, Riina Kanbara
  • Publication number: 20210032385
    Abstract: The present invention provides a curable composition which has a viscosity suitable for spray coating even at a high solid content and from which a cured product, on which precipitation of an ultraviolet absorber is suppressed and which has excellent weatherability and hot water resistance, is obtained, a cured product using the curable composition, and a stacked body. Provided is a curable composition including: a (meth)acrylate A; a urethane (meth)acrylate B; an ultraviolet absorber C; and a photopolymerization initiator D, in which the (meth)acrylate A has at least one of a dendrimer structure and a hyperbranched structure, a content of the (meth)acrylate A is 55 parts by mass to 95 parts by mass based on 100 parts by mass in total of the (meth)acrylate A and the urethane (meth)acrylate B, a content of the ultraviolet absorber C is 1.
    Type: Application
    Filed: October 16, 2020
    Publication date: February 4, 2021
    Applicant: Mitsubishi Chemical Corporation
    Inventors: Yuka IIDA, Akira MIYACHI, Takahiro MUKUDA
  • Publication number: 20190112409
    Abstract: An active energy ray-curable resin composition which contains (A) inorganic oxide particles each having an organic functional group on the surface, (B) a siloxane oligomer which has at least one functional group selected from the group consisting of a (meth)acryloyl group, an epoxy group and a vinyl group, while having a weight average molecular weight of 200-3,000, (C) a polyfunctional (meth)acrylate having a specific structure, (D) a urethane (meth)acrylate having two or more (meth)acryloyl groups in each molecule, and (E) an ultraviolet absorbent.
    Type: Application
    Filed: December 12, 2018
    Publication date: April 18, 2019
    Applicant: Mitsubishi Chemical Corporation
    Inventors: Akira MIYACHI, Riina KANBARA, Masashi SERIZAWA
  • Publication number: 20170183515
    Abstract: Provided are: a curable composition that makes it possible to form a cured film having excellent wear resistance and weather resistance; a laminate that is provided with the cured film; and an automobile headlamp lens. The curable composition makes it possible to obtain a cured film in which the relationship between a haze value (?Hx) that is obtained by a wear resistance test and a haze value (?Hy) that is obtained by a weather resistance test satisfies ?Hy??0.3 ?Hx+5.0 when a cured film having a thickness of 10 ?m is produced.
    Type: Application
    Filed: March 30, 2015
    Publication date: June 29, 2017
    Applicant: MITSUBISHI RAYON CO., LTD.
    Inventors: Jun ITO, Masashi SERIZAWA, Hiroyuki SATOU, Akira MIYACHI, Riina KANABARA
  • Patent number: 9597819
    Abstract: This method of cutting a high-hardness material with a multi-wire saw includes the steps of: (A) providing at least one ingot which includes a body portion 10a with two ends and a low-quality crystal portion 10e that is located at only one of the two ends of the body portion; (B) fixing the at least one ingot onto a fixing base; and (C) slicing the at least one ingot by moving the ingot with respect to a saw wire so that the saw wire does not contact with the low-quality crystal portion 10e of the at least one ingot but does contact with its body portion 10a.
    Type: Grant
    Filed: August 30, 2013
    Date of Patent: March 21, 2017
    Assignee: HITACHI METALS, LTD.
    Inventors: Sadahiko Kondo, Akira Miyachi, Toshihiko Hatanaka
  • Publication number: 20170015774
    Abstract: Provided is an active energy ray-curable resin composition with which it is possible to form a cured film, having outstanding scratch resistance, hardness, and weather resistance, on the surface of a molded resin article for an automobile headlamp lens. The active energy ray-curable resin composition is used to form a cured film on the surface of a molded resin article for an automobile headlamp lens and comprises (A) 10-70% by mass of a mono- or poly-pentaerythritol poly(meth)acrylate compound having a specific structure, (B) 10-50% by mass of a urethane(meth)acrylate compound having at least two (meth)acryloyloxy groups, at least one amido group, and at least two urethane bonds, and (C) 20-80% by mass of a poly[(meth)acryloyloxyalkyl]isocyanurate compound having a specific structure.
    Type: Application
    Filed: March 9, 2015
    Publication date: January 19, 2017
    Applicant: MITSUBISHI RAYON CO., LTD.
    Inventors: Akira MIYACHI, Hiroyuki SATOU
  • Publication number: 20150202700
    Abstract: In a method of cutting a high-hardness material with a multi-wire saw, an ingot of the high-hardness material is sliced into a plurality of wafers by cutting the ingot at multiple points simultaneously with the multi-wire saw. The method comprises repeating a run cycle of reciprocating motion of a wire of the multi-wire saw so that the relationships (1) c1?20, given C1=b/a and (2) 0.35?c2?1.55, given c2=d/a are satisfied, where a is a maximum total contact length defined as a sum of the lengths of the ingot as projected onto multiple cut points when projecting the ingot onto the wire in a direction in which the ingot is going to be cut, b is a continuous travel distance of the wire, and d is a length of the wire newly fed in each said run cycle.
    Type: Application
    Filed: January 14, 2015
    Publication date: July 23, 2015
    Inventors: Sadahiko KONDO, Akira MIYACHI
  • Publication number: 20150183132
    Abstract: This method of cutting a high-hardness material with a multi-wire saw includes the steps of: (A) providing at least one ingot which includes a body portion 10a with two ends and a low-quality crystal portion 10e that is located at only one of the two ends of the body portion; (B) fixing the at least one ingot onto a fixing base; and (C) slicing the at least one ingot by moving the ingot with respect to a saw wire so that the saw wire does not contact with the low-quality crystal portion 10e of the at least one ingot but does contact with its body portion 10a.
    Type: Application
    Filed: August 30, 2013
    Publication date: July 2, 2015
    Inventors: Sadahiko Kondo, Akira Miyachi, Toshihiko Hatanaka
  • Patent number: 7025054
    Abstract: A method of cutting a rare-earth alloy with a wire saw, obtained by fixing abrasive grains on a core wire with a resin layer, includes the step of moving the wire saw while a portion of the rare-earth alloy being machined with the wire saw is immersed in a coolant, which is mainly composed of water and has a surface tension of about 25 mN/m to about 60 mN/m at about 25° C., thereby cutting the rare-earth alloy. In the wire saw, an average distance between two of the abrasive grains, which are adjacent to each other in a length direction, is about 150% to less than about 400% of the average grain size of the abrasive grains, an average height of portions of the abrasive grains, protruding from the surface of the resin layer, is about 70% or less of the average grain size of the abrasive grains, and a thickness deviation percentage of the resin layer with respect to the core wire is about 40%.
    Type: Grant
    Filed: February 26, 2003
    Date of Patent: April 11, 2006
    Assignee: Neomax Co., Ltd.
    Inventors: Sadahiko Kondo, Akira Miyachi, Hazime Ishida
  • Patent number: 6945242
    Abstract: A method of cutting a rare-earth alloy with a wire 20, on which abrasive grains are fixed with a resin layer provided on the outer surface of a core wire, includes the steps of: providing a wire, of which the surface is coated with a lubricant including a glycol, by reeling the wire up in a pair of reel bobbins 40a and 40b; reeling the wire off one of the reel bobbins and letting the wire travel on a plurality of rollers 10a, 10b and 10c; and cutting the rare-earth alloy with the traveling wire while a portion of the rare-earth alloy being cut with the wire is supplied with a first coolant which is mainly composed of water. As a result, the life of a wire can be extended when a rare-earth alloy is cut with a wire saw machine using a coolant which is mainly composed of water.
    Type: Grant
    Filed: October 15, 2002
    Date of Patent: September 20, 2005
    Assignee: Neomax Co., Ltd.
    Inventors: Sadahiko Kondo, Akira Miyachi, Hazime Ishida
  • Publication number: 20050155595
    Abstract: A method of cutting a rare-earth alloy with a wire saw, obtained by fixing abrasive grains on a core wire with a resin layers, includes the step of moving the wire saw while a portion of the rare-earth alloy being machined with the wire saw is immersed in a coolant, which is mainly composed of water and has a surface tension of about 25 mN/m to about 60 mN/m at about 25° C., thereby cutting the rare-earth alloy. In the wire saw, an average distance between two of the abrasive grains, which are adjacent to each other in a length direction, is about 150% to less than about 400% of the average grain size of the abrasive grains, an average height of portions of the abrasive grains, protruding from the surface of the resin layer, is about 70% or less of the average grain size of the abrasive grains, and a thickness deviation percentage of the resin layer with respect to the core wire is about 40%.
    Type: Application
    Filed: February 26, 2003
    Publication date: July 21, 2005
    Applicant: NEOMAX CO., LTD.
    Inventors: Sadahiko Kondo, Akira Miyachi, Hazime Ishida
  • Patent number: 6896595
    Abstract: A method for cutting a rare earth alloy using a wire with abrasive grains fixed to a core wire, including the step of cutting the rare earth alloy with the wire traveling in a state that a portion of the rare earth alloy to be cut with the wire is immersed in a coolant containing water as the main component, the coolant having a surface tension at 25° C. in a range of 25 mN/m to 60 mN/m.
    Type: Grant
    Filed: June 28, 2004
    Date of Patent: May 24, 2005
    Assignee: Neomax Co., Ltd.
    Inventors: Sadahiko Kondo, Akira Miyachi, Hazime Ishida
  • Patent number: 6837778
    Abstract: A method for cutting a rare earth alloy using a wire with abrasive grains fixed to a core wire, including the step of cutting the rare earth alloy with the wire traveling in a state that a portion of the rare earth alloy to be cut with the wire is immersed in a coolant containing water as the main component, the coolant having a surface tension at 25° C. in a range of 25 mN/m to 60 mN/m.
    Type: Grant
    Filed: November 23, 2001
    Date of Patent: January 4, 2005
    Assignee: Neomax Co., LTD
    Inventors: Sadahiko Kondo, Akira Miyachi, Hazime Ishida
  • Publication number: 20040255924
    Abstract: A method of cutting a rare-earth alloy with a wire 20, on which abrasive grains are fixed with a resin layer provided on the outer surface of a core wire, includes the steps of: providing a wire, of which the surface is coated with a lubricant including a glycol, by reeling the wire up in a pair of reel bobbins 40a and 40b; reeling the wire off one of the reel bobbins and letting the wire travel on a plurality of rollers 10a, 10b and 10c; and cutting the rare-earth alloy with the traveling wire while a portion of the rare-earth alloy being cut with the wire is supplied with a first coolant which is mainly composed of water. As a result, the life of a wire can be extended when a rare-earth alloy is cut with a wire saw machine using a coolant which is mainly composed of water.
    Type: Application
    Filed: April 15, 2004
    Publication date: December 23, 2004
    Inventors: Sadahiko Kondo, Akira Miyachi, Hazime Ishida
  • Publication number: 20040231134
    Abstract: A method for cutting a rare earth alloy using a wire with abrasive grains fixed to a core wire, including the step of cutting the rare earth alloy with the wire traveling in a state that a portion of the rare earth alloy to be cut with the wire is immersed in a coolant containing water as the main component, the coolant having a surface tension at 25° C. in a range of 25 mN/m to 60 mN/m.
    Type: Application
    Filed: June 28, 2004
    Publication date: November 25, 2004
    Applicant: Sumitomo Special Metals Co., Ltd.
    Inventors: Sadahiko Kondo, Akira Miyachi, Hazime Ishida
  • Patent number: 6443143
    Abstract: A method for cutting a rare earth alloy of the invention using a wire having abrasive grains stuck thereon is disclosed. The method includes the step of cutting the rare earth alloy while supplying a cutting fluid having a predetermined kinematic viscosity between the wire and the rare earth alloy. The method further includes the step of varying the temperature of a supplied amount of fresh cutting fluid in order to control the kinematic viscosity of the cutting fluid.
    Type: Grant
    Filed: September 14, 2000
    Date of Patent: September 3, 2002
    Assignee: Sumitomo Special Metals Co., Ltd.
    Inventors: Hazime Ishida, Sadahiko Kondo, Akira Miyachi
  • Publication number: 20020115390
    Abstract: A method for cutting a rare earth alloy using a wire with abrasive grains fixed to a core wire, including the step of cutting the rare earth alloy with the wire traveling in a state that a portion of the rare earth alloy to be cut with the wire is immersed in a coolant containing water as the main component, the coolant having a surface tension at 25° C. in a range of 25 mN/m to 60 mN/m.
    Type: Application
    Filed: November 23, 2001
    Publication date: August 22, 2002
    Inventors: Sadahiko Kondo, Akira Miyachi, Hazime Ishida