Patents by Inventor Akira Miyamae

Akira Miyamae has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7104703
    Abstract: The invention provides an optical transceiver which makes it possible to simplify a production process. An optical transceiver of the present invention includes an optical socket to mount an optical plug disposed at one end portion of an optical fiber); a light-condensing device; and an optical element to emit light in accordance with a supplied electrical signal and an optical element to generate an electrical signal in accordance with a received light signal; and a light-transmissive substrate to support the optical socket, the light-condensing device, and the optical elements so that the optical fiber, the light-condensing device, and the optical elements are aligned on an optical axis of the optical transceiver.
    Type: Grant
    Filed: June 24, 2003
    Date of Patent: September 12, 2006
    Assignee: Seiko Epson Corporation
    Inventors: Kimio Nagasaka, Akira Miyamae, Takeo Kaneko, Eiichi Fujii, Jun Amako, Tsugio Ide, Shojiro Kitamura
  • Patent number: 7103249
    Abstract: The invention provides an optical module that enables to increase the optical coupling efficiency without being dependent on the thickness of a substrate. The optical module, detachably coupled to a connector provided at one end side of an optical fiber, can include a substrate having a first hole, a translucent layer arranged so as to cover, at least, the first hole on one surface side of the substrate, and an optical element that is arranged inside the first hole and on the translucent layer and carries out transmission or reception of light signal to/from the optical fiber through the translucent layer.
    Type: Grant
    Filed: May 12, 2004
    Date of Patent: September 5, 2006
    Assignee: Seiko Epson Corporation
    Inventor: Akira Miyamae
  • Publication number: 20060165415
    Abstract: To provide the communication cable that enables to replace the communication media with an optical signal and increase the communication speed, while assuring the compatibility with the already-widespread telecommunication method. A communication cable used for connecting a plurality of electronic appliances, as well as for conducting communication of information with standardized telecommunication method, wherein the electric signal that is output from one of the electronic appliance is converted to the optical signal with one of the optical module, and is transmitted to the other optical module via the optical transmission medium, and then the optical signal is converted back to the electric signal with the other optical module and is output to the other electric appliance.
    Type: Application
    Filed: January 21, 2005
    Publication date: July 27, 2006
    Applicant: Seiko Epson Corporation
    Inventors: Kimio Nagasaka, Akira Miyamae, Paul Patterson
  • Patent number: 7070339
    Abstract: The invention provides a manufacturing method of an optical transceiver whereby the manufacturing process can be further simplified. A method to manufacture an optical transceiver includes: combining an optical socket and an assembling object to be assembled with the optical socket, where the optical socket includes a fitting hole to mount an optical plug holding an end portion of an optical fiber; mounting an optical head to photograph the assembling object in the fitting hole of the optical socket, and obtaining an image of the assembling object exposed to the fitting hole and reference position information in the photographed image display screen; a detecting a difference between the image of the assembling object and the reference position information; reducing the difference by moving the optical socket and the assembling object relative to each other based on the difference; and fixing the assembling object and the optical socket.
    Type: Grant
    Filed: June 24, 2003
    Date of Patent: July 4, 2006
    Assignee: Seiko Epson Corporation
    Inventors: Kimio Nagasaka, Akira Miyamae, Takeo Kaneko
  • Patent number: 7068889
    Abstract: The invention provides a compact, inexpensive optical communication module with high product reliability. In particular, the invention can include an optical communication module having a substrate with a through-hole into which an optical fiber can be inserted and removed, a light-transmissive resin film disposed on one side of the substrate and covering the through-hole, an electrically conductive film patterned on top of the light-transmissive resin film, and an optical element connected to the electrically conductive film, positioned with reference to the through-hole, and disposed above the through-hole so that light can be transmitted and received through the through-hole, and, where necessary, encapsulated with a sealant.
    Type: Grant
    Filed: March 5, 2004
    Date of Patent: June 27, 2006
    Assignee: Seiko Epson Corporation
    Inventors: Akira Miyamae, Kimio Nagasaka
  • Patent number: 7063467
    Abstract: An optical module may include precise guide pins formed in a transparent substrate or an optical transmission line support member. The precise guide pins may be inserted into corresponding precise guide holes within the transparent substrate or the optical transmission line support member to precisely align optical elements. The precise guide holes may be formed within one of the transparent substrate and the optical transmission line support member by positioning protruding portions of a jig within over-sized guide holes and filling a gap between the protruding portions of the jig and the respective over-sized guide holes with a filler material. Once the filler material is cured, the jig may be withdrawn leaving precisely positioned guide holes.
    Type: Grant
    Filed: January 22, 2004
    Date of Patent: June 20, 2006
    Assignee: Seiko Epson Corporation
    Inventors: Kimio Nagasaka, Akira Miyamae, Takeo Kaneko
  • Patent number: 7065275
    Abstract: The present invention provides a compact optic communications module. An optic communications module according to the invention can include a base including a portion defining a through-hole through a first plane to a second plane into which an optical fiber is inserted, a fiber optic piece located on the first plane side in the through-hole and whose axis length is shorter than the distance between the first plane and the second plane, a transparent resin film provided on the first plane of the base so as to cover the through-hole, a wiring film provided on at least one surface of the transparent resin film, and an optical element aligned on the optical axis of the fiber optic piece with the transparent resin film therebetween and coupled to the wiring film.
    Type: Grant
    Filed: May 21, 2004
    Date of Patent: June 20, 2006
    Assignee: Seiko Epson Corporation
    Inventor: Akira Miyamae
  • Publication number: 20060093964
    Abstract: The present invention provides a manufacturing method capable of obtaining minute structures. In order to achieve this, as shown in FIG. 1, a process target material (108) is exposed and the shape thereof is changed by relatively shifting a laser beam or electronic beam (101) against such process target material (108) and simultaneously repeating irradiation in an intermittent manner. Here, a plurality of minute convex or concave shapes are formed on the process target material (108) by employing a branching element (103) for branching a single beam (108) into a plurality of beams (106, 107); a parallel element (104) for converting said plurality of beams into beams which respectively advance in parallel; and a condensing element (105) for condensing the plurality of beams to the process target material (108) and generating a plurality of minute spots thereon.
    Type: Application
    Filed: December 12, 2005
    Publication date: May 4, 2006
    Applicant: SEIKO EPSON CORPORATION
    Inventors: Kimio Nagasaka, Akira Miyamae, Hiroyasu Kaseya
  • Patent number: 7027381
    Abstract: The laser patterning device of this invention comprises a turntable on which is placed a processed member, and which rotates the member; a linear slider; a laser serving as a light source; an optical system, mounted on the slider, which condenses the laser light to form a laser spot on a substrate; and an optical modulator which changes the optical intensity of the laser spot. By performing laser patterning of a prescribed pattern on the processed member while moving the optical system mounted on the slider, while rotating the processed member by means of the turntable, a pattern having fine gray scales in the depth direction can be drawn with high precision and in a short amount of time.
    Type: Grant
    Filed: November 6, 2000
    Date of Patent: April 11, 2006
    Assignee: Seiko Epson Corporation
    Inventors: Kimio Nagasaka, Hiroyasu Kaseya, Akira Miyamae
  • Patent number: 7005246
    Abstract: Minute structures are obtained by exposing a process target material and changing the shape thereof by relatively shifting a laser beam or electron beam against the process target material and simultaneously repeating irradiation in an intermittent manner. A plurality of minute convex or concave shapes are formed on the process target material by employing a branching element for branching a single beam into a plurality of beams; a parallel element for converting said plurality of beams into beams which respectively advance in parallel; and a condensing element for condensing the plurality of beams to the process target material and generating a plurality of minute spots thereon.
    Type: Grant
    Filed: March 14, 2002
    Date of Patent: February 28, 2006
    Assignee: Seiko Epson Corporation
    Inventors: Kimio Nagasaka, Akira Miyamae, Hiroyasu Kaseya
  • Publication number: 20050238294
    Abstract: An optical connector comprising a male connector that supports one end of an optical transmission medium, and a female connector composed to be engageable with the male connector. The female connector includes a photoelectric conversion module having a function that mutually converts an electrical signal and an optical signal, and a first housing that accommodates the photoelectric conversion module and has an opening that communicates with the photoelectric conversion module accommodated, and the male connector has at least one portion that is inserted in the housing of the female connector through the opening, a plug having a function to optically connect the optical transmission medium and the photoelectric conversion module and provided at one end of the optical transmission medium, and a second housing that has an enclosure section provided around the plug while maintaining a space from the plug, and accommodates the plug.
    Type: Application
    Filed: April 11, 2005
    Publication date: October 27, 2005
    Inventors: Kimio Nagasaka, Akira Miyamae
  • Publication number: 20050157986
    Abstract: To provide methods for manufacturing optical modules that can reduce their manufacturing cost.
    Type: Application
    Filed: December 10, 2004
    Publication date: July 21, 2005
    Applicant: Seiko Epson Corporation
    Inventor: Akira Miyamae
  • Patent number: 6872498
    Abstract: The present invention provides a pattern drawing device that enables drawing with reduced operational processing loading of the associated CPU. Thus, in a pattern drawing device for forming a plurality of tracks disposed concentrically on a substrate to produce a two-dimensional pattern, a basic pixel sequence is prepared and used repeatedly in forward (positive) and/or reverse (negative) order to produce symmetric portions of the two-dimensional pattern.
    Type: Grant
    Filed: July 17, 2002
    Date of Patent: March 29, 2005
    Assignee: Seiko Epson Corporation
    Inventors: Kimio Nagasaka, Akira Miyamae, Eiichi Fujii
  • Patent number: 6866969
    Abstract: Provided is a photomask enabling accurate tone representation. This photomask has a transparent substrate (42), and a phase grating structured from a plurality of grooves of a fixed pitch (P) formed on said substrate, wherein at least either the depth or width of the respective grooves of the phase grating is made to bear the exposure pattern. And, when the wavelength of the exposed light of the aligner employing the photomask is set to ?, and the incident side numerical aperture of the imaging system lens is set to NAi, P<?/NAi. Thereby, the grating will no longer be imaged, and the exposure pattern represented with the depth or width of the respective grooves of the phase grating will be transcribed on to a light sensitive material.
    Type: Grant
    Filed: September 30, 2002
    Date of Patent: March 15, 2005
    Assignee: Seiko Epson Corporation
    Inventors: Akira Miyamae, Kimio Nagasaka
  • Publication number: 20050025435
    Abstract: The invention provides an optical module that enables to increase the optical coupling efficiency without being dependent on the thickness of a substrate. The optical module, detachably coupled to a connector provided at one end side of an optical fiber, can include a substrate having a first hole, a translucent layer arranged so as to cover, at least, the first hole on one surface side of the substrate, and an optical element that is arranged inside the first hole and on the translucent layer and carries out transmission or reception of light signal to/from the optical fiber through the translucent layer.
    Type: Application
    Filed: May 12, 2004
    Publication date: February 3, 2005
    Applicant: SEIKO EPSON CORPORATION
    Inventor: Akira Miyamae
  • Publication number: 20050008302
    Abstract: The present invention provides a compact optic communications module. An optic communications module according to the invention can include a base including a portion defining a through-hole through a first plane to a second plane into which an optical fiber is inserted, a fiber optic piece located on the first plane side in the through-hole and whose axis length is shorter than the distance between the first plane and the second plane, a transparent resin film provided on the first plane of the base so as to cover the through-hole, a wiring film provided on at least one surface of the transparent resin film, and an optical element aligned on the optical axis of the fiber optic piece with the transparent resin film therebetween and coupled to the wiring film.
    Type: Application
    Filed: May 21, 2004
    Publication date: January 13, 2005
    Applicant: Seiko Epson Corporation
    Inventor: Akira Miyamae
  • Publication number: 20050002618
    Abstract: The invention provides an optical module that can reduce its cost. An optical module to which an optical fiber is detachably inserted, includes: a substrate with an aperture to which the optical fiber is inserted; a flexible printed circuit board disposed on one surface of the substrate and including: a base member with an opening in a corresponding location to the aperture; an interconnection layer disposed on at least one surface of the base member); and a connection section including a part of the interconnection layer exposed through the opening; and an optical element disposed within the opening of the flexible printed circuit board, and connected to the connection section, the optical element performing one of transmission and reception of an optical signal with the optical fiber.
    Type: Application
    Filed: May 13, 2004
    Publication date: January 6, 2005
    Applicant: Seiko Epson Corporation
    Inventors: Akira Miyamae, Kimio Nagasaka
  • Publication number: 20040252951
    Abstract: The invention provides an optical transceiver which can further simplify a manufacturing process. An optical transceiver of the present invention includes: an optical socket to attach an optical plug provided at one end of an optical fiber; a light condensing device to condense light; an electro optical element that emits light according to a supplied electrical signal or generates an electrical signal according to a supplied light reception signal; and a light transmitting substrate supporting the optical socket, the light condensing device, and the electro optical element so that an optical fiber, the light condensing device and the electro optical element are aligned on an optical axis.
    Type: Application
    Filed: May 12, 2004
    Publication date: December 16, 2004
    Applicant: Seiko Epson Corporation
    Inventors: Kimio Nagasaka, Akira Miyamae, Takeo Kaneko, Hitoshi Nakayama, Shojiro Kitamura
  • Publication number: 20040234210
    Abstract: To provide a technology, which enable carrying out an optical position alignment precisely and easily in apparatus and the like used in optical communication, a method of manufacturing an optical module includes forming a guide pin in either a transparent substrate or an optical transmission line support member; forming a guide hole, in which the guide pin is to be inserted, to the other one of the transparent substrate and the optical transmission line support member such that the diameter of the guide hole is made larger as compared with the diameter of the hole; arranging a jig having a protruding portion, of which diameter is substantially the same as the diameter of the guide pin, over the transparent substrate such that the protruding portion is being inserted into the guide hole; filling the gap between the protruding portion and the guide hole with a filler material, which is cured by carrying out a predetermined processing; adjusting a position of the jig; curing the filler material, which is filled
    Type: Application
    Filed: January 22, 2004
    Publication date: November 25, 2004
    Applicant: SEIKO EPSON CORPORATION
    Inventors: Kimio Nagasaka, Akira Miyamae, Takeo Kaneko
  • Publication number: 20040223703
    Abstract: The invention provides a compact, inexpensive optical communication module with high product reliability. In particular, the invention can include an optical communication module having a substrate with a through-hole into which an optical fiber can be inserted and removed, a light-transmissive resin film disposed on one side of the substrate and covering the through-hole, an electrically conductive film patterned on top of the light-transmissive resin film, and an optical element connected to the electrically conductive film, positioned with reference to the through-hole, and disposed above the through-hole so that light can be transmitted and received through the through-hole, and, where necessary, encapsulated with a sealant.
    Type: Application
    Filed: March 5, 2004
    Publication date: November 11, 2004
    Applicant: SEIKO EPSON CORPORATION
    Inventors: Akira Miyamae, Kimio Nagasaka