Akira Murata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
Abstract: An apparatus for mounting a siphon tapping tube onto a tap hole mounting part of a converter vessel has a lower car and an upper car, which are placed on a ladle car which travels beneath a converter vessel, the lower car and the upper car being capable of travelling in the direction of the travel of the ladle car and in the direction perpendicular to that of the travel of the ladle car, respectively, a loading table mounted on the upper car, which is guided by an upright support frame and being capable of moving upward and downward with a siphon tapping tube loaded on the table, and bolt tightening and untightening units which are provided on the loading table in positions corresponding to the respective bolt hole set positions in the flange of the siphon tapping tube and are capable of receiving mounting bolts. TV camera is provided on the upper car, allowing the operator to monitor the tap hole mounting part.
Abstract: A circuit board including resistors on one surface of a board or substrate having through hole conductors arranged in a lattice like fashion. At least one electrode is formed on a surface of the resistors, at least one electrode being formed by removing a portion of a surface of the board or substrate coaxially with the through hole conductors thereby forming substantially disk-shaped resistors.
Abstract: In connecting an electronic circuit part such as a semiconductor or other part to a substrate for mounting the part with solder, the solder is composed of a high-melting-point solder portion which is subjected to working such as rolling and heat treatment in order to break the cast structure thereof, and a smaller volume of low-melting-point solder portions. The high-melting-point solder portion is connected to both the electronic circuit substrate and the electronic circuit part through the low-point-melting solder portions.This method enables interconnection between objects to be connected without impairing the high ductility and toughness of the high-melting-point solder which is subjected to working and heat treatment. This soldering method ensures highly reliable manufacture of miniaturized high density circuits, such as LSI.
Abstract: Continuous casting facilities generally including a pair of moulds with a rail on each side thereof. Self-propelled tundish cars each carrying a tundish with a detachable immersion nozzle ride on the rails. The apparatus includes a truck running on the rail opposite the operator's side of the moulds connectable with one of the tundish cars and carrying an immersion nozzle exchanger. A connecting piece feeder, a powder feeder, and an immersion nozzle preheater are also mountable on the truck. Equipment interferences are eliminated by the specific structures and the operator's view of the moulds is not obstructed.
Abstract: A monoazo compound of the formula, ##STR1## wherein X is hydrogen atom or lower alkyl group; Z is hydrogen atom, halogen atom, alkyl group, acylamino group, benzoylamino group or alkylsulfonylamino group; R.sub.1, R.sub.2, R.sub.3 and R.sub.4 independently are hydrogen atom or alkyl group, provided that R.sub.1, R.sub.2, R.sub.3 and R.sub.4 cannot simultaneously be hydrogen atoms; and R.sub.5 is hydrogen atom, alkyl group, substituted alkyl group, alkenyl group, cycloalkyl group, aralkyl group or phenyl group.
July 18, 1983
Date of Patent:
July 16, 1985
Research Association of Dyestuff Manufacturers
Abstract: Apparatus and method for producing zirconium by reducing zirconium halides in the presence of a reducing agent and an inert gas. The zirconium halide is mostly reduced while being in the solid state. The apparatus permits successive reduction and vaccum distillation in one batch.