Patents by Inventor Akira Nishi

Akira Nishi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • QUANTUM DEVICE
    Publication number: 20240136274
    Abstract: A quantum device capable of effectively cooling a quantum chip and an area (e.g., a space) therearound is provided. A quantum device includes a quantum chip and an interposer on which the quantum chip is located. The interposer includes an interposer substrate and an interposer wiring layer. The interposer wiring layer is disposed on a surface of the interposer substrate on a side on which the quantum chip is located. The interposer wiring layer includes, in at least a part thereof, a superconducting material layer formed of a superconducting material and a non-superconducting material layer formed of a non-superconducting material.
    Type: Application
    Filed: July 26, 2023
    Publication date: April 25, 2024
    Applicant: NEC Corporation
    Inventors: Katsumi KIKUCHI, Akira MIYATA, Suguru WATANABE, Takanori NISHI, Hideyuki SATOU, Kenji NANBA, Ayami YAMAGUCHI
  • Resin molded article, method for manufacturing the same, and printer
    Patent number: 10252453
    Abstract: A molded article has an exterior surface, a non-exterior surface, and a projecting or recessed portion provided on at least one of the exterior surface and the non-exterior surface. A repeated pattern of projections and/or recesses or a texture face, which serves to disturb the flow of resin, is provided on the non-exterior surface.
    Type: Grant
    Filed: January 23, 2017
    Date of Patent: April 9, 2019
    Assignee: Canon Kabushiki Kaisha
    Inventors: Yuta Moriya, Akira Nishi, Koki Kodaira
  • RESIN MOLDED ARTICLE, METHOD FOR MANUFACTURING THE SAME, AND PRINTER
    Publication number: 20170129150
    Abstract: A molded article has an exterior surface, a non-exterior surface, and a projecting or recessed portion provided on at least one of the exterior surface and the non-exterior surface. A repeated pattern of projections and/or recesses or a texture face, which serves to disturb the flow of resin, is provided on the non-exterior surface.
    Type: Application
    Filed: January 23, 2017
    Publication date: May 11, 2017
    Inventors: Yuta Moriya, Akira Nishi, Koki Kodaira
  • RESIN MOLDED ARTICLE, METHOD FOR MANUFACTURING THE SAME, AND PRINTER
    Publication number: 20120156429
    Abstract: A molded article has an exterior surface, a non-exterior surface, and a projecting or recessed portion provided on at least one of the exterior surface and the non-exterior surface. A repeated pattern of projections and/or recesses or a texture face, which serves to disturb the flow of resin, is provided on the non-exterior surface.
    Type: Application
    Filed: December 13, 2011
    Publication date: June 21, 2012
    Applicant: CANON KABUSHIKI KAISHA
    Inventors: Yuta Moriya, Akira Nishi, Koki Kodaira
  • Ultrasonic oscillator device and machine incorporating the device
    Patent number: 4168916
    Abstract: An ultrasonic oscillator device which has automatic gain control and which comprises a phase detector for detecting the phase difference between a load voltage and varying quantities indicating an operational condition of the load. The device further comprises a voltage control oscillator adapted to control an oscillating frequency through a direct current voltage corresponding to the phase difference. Further, the ultrasonic oscillator device is combined with a vibrator driven thereby and a small sized motor having a fan to forcedly cool the vibrator. The vibrator and the fan are accommodated in a housing, the size of which is made small, to produce a compact type machine.
    Type: Grant
    Filed: March 24, 1978
    Date of Patent: September 25, 1979
    Assignee: Stanley Electric Co., Ltd.
    Inventors: Shohachi Yamada, Akira Nishi, Kouichi Mishima, Youichiro Akanuma