Abstract: To provide a component placement apparatus capable of preventing free operation of a mounting head within the movable region from being restricted as well as improving the mounting takt time.

Abstract: A method by which the height of an electronic component sucked and held by a nozzle can be detected with high accuracy and high efficiency is a component height measurement method applied to a mounter (100) equipped with a transfer head (8) having a component-sucking-and-holding nozzle (21), for transferring a component P and mounting the component P onto a board (3), and includes: lowering the component P to within the high-accuracy range of a first line sensor (13) for measuring the height of the component P; and measuring the height of the component P using the first line sensor (13).

Abstract: To provide a component placement apparatus capable of preventing free operation of a mounting head within the movable region from being restricted as well as improving the mounting takt time.

Abstract: A method for detecting a condition of a nozzle member of a multi-nozzle type component mounting head, in which it is determined that a nozzle is pressed against a load cell when the difference between a measured vertical position of the nozzle and a reference positional information of the nozzle is equal to or greater than a determined value and the measured vertical position of the nozzle is at a lower level position than the reference positional information, and when it is determined that the nozzle is pressed against the load cell, measuring the output value of the load cell.

Abstract: It is an object to provide a method by which the height of an electronic component sucked and held by a nozzle can be detected with high accuracy and high efficiency. This method is a component height measurement method applied to a mounter (100) equipped with a transfer head (8) having a component-sucking-and-holding nozzle (21), for transferring a component P and mounting the component P onto a board (3), and includes: lowering the component P to within the high-accuracy range of a first line sensor (13) for measuring the height of the component P; and measuring the height of the component P using the first line sensor (13).

Abstract: An apparatus for mounting components provided with a multi-nozzle type component mounting head for moving vertically includes a plurality of movable parts linearly arranged; a plurality of nozzles respectively connected to tip parts of the movable parts; a height detector for detecting positions of the plurality of movable parts; a light projector provided on an extension of an arrangement of the plurality of nozzles; a light receiver provided at a position opposed to the light projector, wherein all of the plurality of nozzles are made to stand-by on an upper side of an optical axis L from the light projector, an arbitrary one of the nozzles is made to descend, and at a timing when the light receiver detects that light shielding of the light from the light projector is switched by the tip part of the nozzle, a vertical position of the movable part is measured by the height detector.

Abstract: An apparatus has a holder that receives a component from a component supply and then places the component on a substrate. In operation, it is determined whether the holder would make an interference with another component already mounted on the substrate. If this judgement is affirmative, mounting of the component held by the holder is prohibited. If, on the other hand, this judgement is negative, the component held by the holder is mounted onto the substrate.

Abstract: An apparatus has a holder that receives a component from a component supply and then places the component on a substrate. In operation, it is determined whether the holder would make an interference with another component already mounted on the substrate. If this judgement is affirmative, mounting of the component held by the holder is prohibited. If, on the other hand, this judgement is negative, the component held by the holder is mounted onto the substrate.

Abstract: Adjustment of image pickup conditions through alternative selection of two cameras different in resolution, adjustment of image lightness of a to-be-recognized component based on component information of the component, and performing control allows an image of the component to be picked up by either one of the cameras under the image pickup conditions.

Abstract: An apparatus has a holder that receives a component from a component supply and then places the component on a substrate. In operation, it is determined whether the holder would make an interference with another component already mounted on the substrate. If this judgement is affirmative, mounting of the component held by the holder is prohibited. If, on the other hand, this judgement is negative, the component held by the holder is mounted onto the substrate.

Abstract: An apparatus has a holder that receives a component from a component supply and then places the component on a substrate. In operation, it is determined whether the holder would make an interference with another component already mounted on the substrate. If this judgement is affirmative, mounting of the component held by the holder is prohibited. If, on the other hand, this judgement is negative, the component held by the holder is mounted onto the substrate.

Abstract: An apparatus has a holder that receives a component from a component supply and then places the component on a substrate. In operation, it is determined whether the holder would make an interference with another component already mounted on the substrate. If this judgement is affirmative, mounting of the component held by the holder is prohibited. If, on the other hand, this judgement is negative, the component held by the holder is mounted onto the substrate.

Abstract: A component recognizing method, and an apparatus for executing the method, for applying light to leads on a mounting surface of an electronic component and executing positional detection of the leads by a height detecting section, comprising a 3-D sensor, on the basis of light reflected from the leads. The method includes limiting a region to be measured by the height detection section so that light reflected from objects behind or near the leads is excluded from the region and processing light reflected from the region, thereby removing the reflected light from objects behind or near the lead.

Abstract: An apparatus has a holder that receives a component from a component supply and then places the component on a substrate. In operation, it is determined whether the holder makes an interference with another component mounted on the substrate. If the judgement is affirmative, an mounting of the component held by the holder is prohibited. If, on the other hand, the judgement is negative, the component held by the holder is mounted on the substrate.

Abstract: An electronic component mounting device permits recognition of an electronic component for precise mounting. A recognizing device includes a line camera having a one-dimensional CCD array, a shutter camera having a shutter function, and a device for selecting either the line camera or the shutter camera depending on the size or shape of the electronic components. The electronic components are recognized by image data obtained by a selected one of the cameras while the electronic component is moving along a movement path of a mounting head towards a mounting location.