Abstract: Disclosed is a wire harness checker and a wire harness checking method, which are capable of determining whether a terminal of a terminal-fitted wire is adequately inserted in a connector housing, without contact with the wire and the terminal, objectively and reliably. Each of three pairs of sensor plates (20a, 20b; 30a, 30b; 40a, 40b) are disposed adjacent to an outer wall surface of a connector housing 10 in opposed relation to one another. An AC inspection signal is supplied to a terminal to be inserted into the connector housing 10, and detected from the terminal by each of the pairs of sensor plates (20a, 20b), (30a, 30b), (40a, 40b), to detect an insertion position of the terminal in the connector, in accordance with a relative value of each detection signal from the sensor plates, so as to determine adequacy of the insertion position.

Abstract: Disclosed is a conductor inspection apparatus capable of detecting a state of an inspection-target electric conductor with a high degree of accuracy in a non-contact manner. The inspection apparatus includes a signal supply section 510 for supplying an inspection signal to an inspection-target conductor 520, and two sensor plates 570, 580 disposed approximately parallel to each other in the vicinity of the conductor 520. The inspection apparatus is designed to inspect a configuration of the conductor 520 disposed opposed to the sensor plate 570, in accordance with a measured signal level from the sensor plate 570.

Abstract: Disclosed is a wire harness checker and a wire harness checking method, which are capable of determining whether a terminal of a terminal-fitted wire is adequately inserted in a connector housing, without contact with the wire and the terminal, objectively and reliably. Each of three pairs of sensor plates (20a, 20b; 30a, 30b; 40a, 40b) are disposed adjacent to an outer wall surface of a connector housing 10 in opposed relation to one another. An AC inspection signal is supplied to a terminal to be inserted into the connector housing 10, and detected from the terminal by each of the pairs of sensor plates (20a, 20b), (30a, 30b), (40a, 40b), to detect an insertion position of the terminal in the connector, in accordance with a relative value of each detection signal from the sensor plates, so as to determine adequacy of the insertion position.

Abstract: Disclosed is a conductor position inspection apparatus capable of detecting where an inspection-target electric conductor is located, with a high degree of accuracy in a non-contact manner. The inspection apparatus comprises a signal supply section 510 for supplying an AC inspection signal to an inspection-target conductor 520, two sensor plates 570, 580 disposed approximately parallel to each other in the vicinity of the conductor 520, a subtracter 550 for subjecting respective detected signal values from the sensor plates to subtraction, and a divider 560 for dividing the detected signal value from a selected one of the sensor plates by the subtraction result to normalize the detected signal value from the selected sensor plate so as to detect a relative ratio between the detected signal values from the sensor plates to obtain a value X corresponding a distance between the selected sensor plate and the conductor 520, as a detection result.

Abstract: Disclosed is a conductor inspection apparatus capable of capable of detecting a state of an inspection-target electric conductor with a high degree of accuracy in a non-contact manner. The inspection apparatus comprises a signal supply section 510 for supplying an inspection signal to an inspection-target conductor 520, and two sensor plates 570, 580 disposed approximately parallel to each other in the vicinity of the conductor 520. The inspection apparatus is designed to inspect a configuration of the conductor 520 disposed opposed to the sensor plate 570, in accordance with a measured signal level from the sensor plate 570.

Abstract: An inspection apparatus inspects an electronic circuit board on which a plurality of bonding pads and a plurality of pin pads are connected to each other through conductive patterns. A probe having a contact pin is moved on the electronic circuit board along a straight line substantially constituted by a terminal group without separating the contact pin from the surface of the electronic circuit board. This moving operation is a "wiping" operation. In the process of movement, an identifiable electrical signal is applied to the contact pin, and a return signal is detected at each pin pad. This return signal is compared with a reference signal obtained in advance by using a reference circuit board. A discontinuity or short in each conductive pattern is determined on the basis of the comparison result.