Patents by Inventor Akira Ohtusuki

Akira Ohtusuki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Process for preparing retort-proof metal layer laminates for packaging foodstuffs using aluminum hydroxide-modified copolymers as adhesives
    Patent number: 4308084
    Abstract: A process for preparing a retort-proof laminate for packaging foodstuffs which comprises laminating an aluminum substrate to at least one polyolefin film selected from the group consisting of high density-polyethylene, polypropylene, ethylene-propylene copolymers and polybutene films using as an adhesive a specific polyolefin resin in melted state prepared by combining together (A) at least one member selected from the group consisting of high-density polyethylene, polypropylene ethylene-propylene copolymers and polybutene, (B) maleic anhydride and (C) aluminum hydroxide, and by rendering said specific polyolefin resin substantially free from unreacted maleic anhydride and low molecular weight maleic anhydide homopolymers.The process also includes preparing a retort-proof coated aluminum substrate for packaging foodstuffs which comprises coating an aluminum substrate with a layer formed from the above-described specific polyolefin resin and thereafter forming a suitable retort packaging container therefrom.
    Type: Grant
    Filed: September 17, 1980
    Date of Patent: December 29, 1981
    Assignee: Morton-Norwich Products, Inc.
    Inventors: Akira Ohtusuki, Taro Oyama, Atsuhiro Yamamoto, Ryosuke Suganuma