Abstract: An electronic component includes an insulating surrounding member surrounding the electronic element while allowing a first surface of the electronic element to be exposed from a second surface of the surrounding member. A wiring board faces a third surface comprising the first and second surfaces. An insulating joining member is interposed between the third surface and the wiring board and joins the third surface and the wiring board together. A conductive bump, located between the third surface and the wiring board, electrically connects the electronic element and the wiring board. The joining member has a first through hole that overlaps a vibration region in the first surface in perspective plan view. The joining member has a second through hole that accommodates the bump. At least a portion of at least one of the first through hole or the second through hole overlaps the second surface in perspective plan view.

Abstract: In an electronic component, a chip includes a vibrating functional part and a terminal on a first surface thereof. An intermediate member is stacked on the first surface. The intermediate member includes a first through hole above the functional part and surrounds the functional part in plan view. A lid is stacked on a surface of the intermediate member on the opposite side from the chip and closes the first through hole. A bonding member includes an upper end located on the opposite side of the lid from the intermediate member. The intermediate member surrounds the terminal as well as the functional part. The lid includes a second through hole overlapping the terminal out of the functional part and the terminal. The bonding member includes a center portion located inside the second through hole and a lower end located inside the first through hole and bonded to the terminal.

Abstract: An electronic element has a first surface, and an insulating surrounding member has a second surface and is in close contact with the electronic element and surrounds the electronic element while allowing the first surface to be exposed from the second surface. A wiring board faces a third surface constituted by the first surface and the second surface. An insulating joining member is interposed between the third surface and the wiring board and joins the third surface and the wiring board together. A conductive bump is located between the third surface and the wiring board and electrically connects the electronic element and the wiring board to each other. The joining member has a through hole that passes through the joining member from the third surface to the wiring board and that accommodates the bump. At least a portion of the through hole overlaps the second surface in perspective plan view.

Abstract: An electronic component includes an insulating surrounding member surrounding the electronic element while allowing a first surface of the electronic element to be exposed from a second surface of the surrounding member. A wiring board faces a third surface comprising the first and second surfaces. An insulating joining member is interposed between the third surface and the wiring board and joins the third surface and the wiring board together. A conductive bump, located between the third surface and the wiring board, electrically connects the electronic element and the wiring board. The joining member has a first through hole that overlaps a vibration region in the first surface in perspective plan view. The joining member has a second through hole that accommodates the bump. At least a portion of at least one of the first through hole or the second through hole overlaps the second surface in perspective plan view.

Abstract: An acoustic wave device of the present invention has a piezoelectric substrate, an excitation electrode arranged on the piezoelectric substrate, an electrode pad arranged on the piezoelectric substrate and electrically connected to the excitation electrode, and a cover arranged on the piezoelectric substrate so that a oscillation space is arranged between the cover and the excitation electrode. The cover has inside it a via conductor electrically connected to the electrode pad and is curved so that its surface facing the piezoelectric substrate approaches the excitation electrode side with respect to an upper surface of the piezoelectric substrate from a position of contact with the via conductor.

Abstract: An electronic component has a support member, an SAW element which is mounted on the support member with a space S therebetween and which has a facing surface which faces the support member, and a resin portion which covers the SAW element and which is provided so as to seal the space S. The SAW element has a piezoelectric substrate, an IDT provided on the facing surface of the piezoelectric board, an wiring (an outer wiring) which is provided on the facing surface of the piezoelectric board and extends from the IDT toward the periphery side of the piezoelectric board, and a dam member which is adjacent to a lateral edge portion of the wiring and which is provided locally relative to the circumferential direction which surrounds the IDT.

Abstract: An acoustic wave device of the present invention has a piezoelectric substrate, an excitation electrode arranged on the piezoelectric substrate, an electrode pad arranged on the piezoelectric substrate and electrically connected to the excitation electrode, and a cover arranged on the piezoelectric substrate so that a oscillation space is arranged between the cover and the excitation electrode. The cover has inside it a via conductor electrically connected to the electrode pad and is curved so that its surface facing the piezoelectric substrate approaches the excitation electrode side with respect to an upper surface of the piezoelectric substrate from a position of contact with the via conductor.

Abstract: The electronic device is provided with a wiring board, a piezoelectric element (electronic component) which is mounted on an upper surface (front surface) of the wiring board so as to make its functional surface (major surface) face the upper surface, and a resin part which is adhered to a side surfaces of the piezoelectric element and to the wiring board and seals a facing space between the upper surface of the wiring board and the functional surface of the piezoelectric element. Further, the resin part is recessed in shape relative to the facing space.

Abstract: The electronic device is provided with a wiring board, a piezoelectric element (electronic component) which is mounted on an upper surface (front surface) of the wiring board so as to make its functional surface (major surface) face the upper surface, and a resin part which is adhered to a side surfaces of the piezoelectric element and to the wiring board and seals a facing space between the upper surface of the wiring board and the functional surface of the piezoelectric element. Further, the resin part is recessed in shape relative to the facing space.

Abstract: An electronic component has a support member, an SAW element which is mounted on the support member with a space S therebetween and which has a facing surface which faces the support member, and a resin portion which covers the SAW element and which is provided so as to seal the space S. The SAW element has a piezoelectric substrate, an IDT provided on the facing surface of the piezoelectric board, an wiring (an outer wiring) which is provided on the facing surface of the piezoelectric board and extends from the IDT toward the periphery side of the piezoelectric board, and a dam member which is adjacent to a lateral edge portion of the wiring and which is provided locally relative to the circumferential direction which surrounds the IDT.

Abstract: A multilayer circuit board (1) includes resin bases (101 to 10N) stacked while placing separators (121 to 12N?1) in between, interconnect patterns (111 to 11N) respectively formed on one surface of each of the resin bases (101 to 10N), and electro-conductive bumps (201 to 20N?1) which electrically connect the interconnect patterns (111 to 11N). The resin bases (101 to 10N) and the separators (121 to 12N?1) are heat-bonded, the separators (121 to 12N?1) are composed of a first thermoplastic resin material having a first glass transition temperature, and the resin bases (101 to 10N) are composed of a second thermoplastic resin material having a second glass transition temperature higher than the first glass transition temperature.

Abstract: A multilayer circuit board (1) includes resin bases (101 to 10N) stacked while placing separators (121 to 12N?1) in between, interconnect patterns (111 to 11N) respectively formed on one surface of each of the resin bases (101 to 10N), and electro-conductive bumps (201 to 20N?1) which electrically connect the interconnect patterns (111 to 11N). The resin bases (101 to 10N) and the separators (121 to 12N?1) are heat-bonded, the separators (121 to 12N?1) are composed of a first thermoplastic resin material having a first glass transition temperature, and the resin bases (101 to 10N) are composed of a second thermoplastic resin material having a second glass transition temperature higher than the first glass transition temperature.

Abstract: A flexible wiring unit (100) includes a flexible substrate (50) having flexibility in a longitudinal direction, including a signal line (30) for transmitting and receiving signals to and from an external circuit, a front insulating layer (20) and a back insulating layer (40) holding the signal line therebetween, and a shield layer (10) provided on an upper face of the front insulating layer (20); a non-conductive substrate spacer (62) provided so as to oppose a lower face of the back insulating layer (40); and a support member (61) that sustains a longitudinal end portion of the flexible substrate (50); and the other longitudinal end portion is movable. A distance (Y) between a back face of the substrate spacer (62) and the signal line (30) in a state where the flexible substrate (50) is in contact with a surface of the substrate spacer (62) is longer than a distance (X) between a lower face of the shield layer (10) and the signal line (30).

Abstract: A signal line (2) is formed on one surface of a base substrate (1), and a cover lay film (3) is laminated further. A plurality of projections (4) made of an insulating material are formed at substantially regular intervals vertically and laterally on an upper surface of the above-mentioned cover lay film and a ground layer (5), for example, made of a silver paste is formed on the above-mentioned cover lay film except for the arranged position of each of the above-mentioned projections. In this case, a film thickness of the ground layer made of said conductive paste is formed to be less than a height of a top of said projection arranged at an insulating layer, so that an openings (gaps) substantially in the shape of a mesh can be formed at the ground layer made of the conductive paste because of the existence of the projection. Thus, it is possible to provide a circuit board achieving the similar effect to that of a ground plane having gaps substantially in the shape of a mesh.

Abstract: A reciprocating motion of a head unit produces a change in front-to-back length of the lower face of a flexible substrate opposing a metal base. However, between the lower face of the flexible substrate and the upper face of the metal base opposing each other, a non-conductive substrate spacer of a predetermined plate thickness is constantly interposed. Such structure suppresses fluctuation in impedance of the flexible substrate arising from fluctuation in capacitance between the flexible substrate and the metal base, within a predetermined range. Consequently, with the structure that the moving heat unit is connected to the flexible substrate, a communication error of the flexible substrate, can be prevented.

Abstract: A surface acoustic wave device is disclosed, which comprises a surface acoustic wave element including a lithium tantalate piezoelectric substrate 10 with one principal surface thereof formed with an IDT electrode 11, a connector electrode 12 and a periphery sealing electrode 13, and a base substrate 2 formed with an electrode 21 for connection to the element connected to the connector electrode 12 through a solder bump component 3 and a periphery sealing conductor film 22 joined to the periphery sealing electrode 13 thorough a solder sealing component 4. For the solder bump component 3 and the solder sealing component 4, a Sn—Sb based or Sn—Ag based lead-free solder containing 90% or more Sn is used, and the thermal expansion coefficient of the base substrate 2 is set in the range of 9-20 pm/° C.

Abstract: Thickness of a pressure-detecting piezoelectric substrate (2) that is thinner than that of a supporting piezoelectric substrate (3) and that has a surface acoustic wave element for pressure detection (7a) on its lower surface is mounted on the supporting piezoelectric substrate (3) having a surface acoustic wave element for reference (4a) on its upper surface. A sealing member (5) is provided between the supporting piezoelectric substrate (3) and the pressure-detecting piezoelectric substrate (1). The surface acoustic wave element for pressure detection (7a) and the surface acoustic wave element for reference (4a) can be disposed in a space (S) enclosed with the pressure-detecting piezoelectric substrate (1) and the sealing member (5). It is possible to provide a small-sized pressure sensor device (1) that can perform temperature compensation and that has high reliability.

Abstract: Thickness of a pressure-detecting piezoelectric substrate (2) that is thinner than that of a supporting piezoelectric substrate (3) and that has a surface acoustic wave element for pressure detection (7a) on its lower surface is mounted on the supporting piezoelectric substrate (3) having a surface acoustic wave element for reference (4a) on its upper surface. A sealing member (5) is provided between the supporting piezoelectric substrate (3) and the pressure-detecting piezoelectric substrate (1). The surface acoustic wave element for pressure detection (7a) and the surface acoustic wave element for reference (4a) can be disposed in a space (S) enclosed with the pressure-detecting piezoelectric substrate (1) and the sealing member (5). It is possible to provide a small-sized pressure sensor device (1) that can perform temperature compensation and that has high reliability.

Abstract: A surface acoustic wave device is disclosed, which comprises a surface acoustic wave element including a lithium tantalate piezoelectric substrate 10 with one principal surface thereof formed with an IDT electrode 11, a connector electrode 12 and a periphery sealing electrode 13, and a base substrate 2 formed with an electrode 21 for connection to the element connected to the connector electrode 12 through a solder bump component 3 and a periphery sealing conductor film 22 joined to the periphery sealing electrode 13 thorough a solder sealing component 4. For the solder bump component 3 and the solder sealing component 4, a Sn—Sb based or Sn—Ag based lead-free solder containing 90% or more Sn is used, and the thermal expansion coefficient of the base substrate 2 is set in the range of 9–20 pm/° C.