Patents by Inventor Akira Onozawa

Akira Onozawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated circuit card and a method of manufacturing the same
    Patent number: 7176060
    Abstract: A multi-function structure of a plug-in universal IC card is to be promoted and the manufacturing cost is to be reduced. The body of the plug-in UICC is constructed of a molding resin. A tape substrate and a chip mounted on one side of the tape substrate are sealed in the interior of the molding resin. A side opposite to the chip mounting side of the tape substrate is exposed to the exterior of the molding resin and constitutes a surface portion of the plug-in UICC. Contact patterns serving as external terminals of the plug-in UICC are formed on the surface of the tape substrate exposed to the exterior of the molding resin. In the plug-in UICC whose body is constructed of molding resin, cracking of the chip can be prevented effectively even in the case where the chip is large-sized.
    Type: Grant
    Filed: July 30, 2004
    Date of Patent: February 13, 2007
    Assignee: Renesas Technology Corp.
    Inventors: Nobuaki Yamada, Kazunari Suzuki, Bunshi Kuratomi, Hiroaki Tanaka, Akira Onozawa
  • Integrated circuit card and a method of manufacturing the same
    Publication number: 20050052851
    Abstract: A multi-function structure of a plug-in universal IC card is to be promoted and the manufacturing cost is to be reduced. The body of the plug-in UICC is constructed of a molding resin. A tape substrate and a chip mounted on one side of the tape substrate are sealed in the interior of the molding resin. A side opposite to the chip mounting side of the tape substrate is exposed to the exterior of the molding resin and constitutes a surface portion of the plug-in UICC. Contact patterns serving as external terminals of the plug-in UICC are formed on the surface of the tape substrate exposed to the exterior of the molding resin. In the plug-in UICC whose body is constructed of molding resin, cracking of the chip can be prevented effectively even in the case where the chip is large-sized.
    Type: Application
    Filed: July 30, 2004
    Publication date: March 10, 2005
    Inventors: Nobuaki Yamada, Kazunari Suzuki, Bunshi Kuratomi, Hiroaki Tanaka, Akira Onozawa