Patents by Inventor Akira OOTA

Akira OOTA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10988589
    Abstract: Provided is a thermosetting resin composition which achieves both high heat resistance and high bending strength as a fiber-reinforced composite material, and also has rapid curability that enables high cycle press forming, thermal stability, and storage stability. The thermosetting resin composition of the present invention is a thermosetting resin composition comprising an epoxy resin, an epoxy resin curing agent, an imidazole compound, and an epoxy resin curing accelerator, in which the epoxy resin curing agent is dicyandiamide or a derivative thereof, and the epoxy resin curing accelerator comprises a urea derivative having two or more dimethylureido groups in a molecule.
    Type: Grant
    Filed: April 29, 2020
    Date of Patent: April 27, 2021
    Assignee: Mitsubishi Chemical Corporation
    Inventors: Takuya Teranishi, Masahiro Ichino, Akira Oota
  • Patent number: 10920027
    Abstract: The invention provides an epoxy resin composition that is easily B-staged despite containing an epoxy resin inherently difficult to B-stage, has a long pot life, has excellent processability and storage stability after B-staging, and make it possible to obtain a fiber-reinforced composite material having excellent flexural strength and flexural modulus. A molding material, including a thickened product of an epoxy resin composition; and a reinforcing fiber; wherein the epoxy resin composition including: a component (A): an aromatic epoxy resin; a component (B): an alicyclic diamine; a component (C): an epoxy resin curing agent that is not an alicyclic diamine; and a component (D): an aliphatic epoxy resin, wherein, when the viscosity at 25° C. immediately after preparation of the epoxy resin composition is taken as (a) and the viscosity at 25° C. after three hours from the preparation is taken as (b), the epoxy resin composition satisfies: (a)=0.1 to 25 Pa·s; (b)=0.1 to 25 Pa·s; and (b)/(a)?5.
    Type: Grant
    Filed: August 27, 2018
    Date of Patent: February 16, 2021
    Assignee: Mitsubishi Chemical Corporation
    Inventors: Akira Oota, Masahiro Ichino, Takuya Teranishi, Mitsuru Kutsuwada, Yusuke Watanabe, Natsumi Mukouzaka
  • Publication number: 20210009776
    Abstract: A prepreg contains: a reinforcing fiber material; and a resin composition with which the reinforcing fiber material is impregnated. The resin composition contains an epoxy resin, an amine curing agent, and an imidazole curing agent. An amount of the amine curing agent is less than or equal to 3.8 parts by mass, relative to 100 parts by mass of the epoxy resin, and a sum of the amount of the amine curing agent and an amount of the imidazole curing agent is less than or equal to 10 parts by mass, relative to 100 parts by mass of the epoxy resin. The fiber-reinforced composite material is a cured product of the prepreg.
    Type: Application
    Filed: July 10, 2020
    Publication date: January 14, 2021
    Applicant: Mitsubishi Chemical Corporation
    Inventors: Takuya TERANISHI, Satoshi OKAMOTO, Akira OOTA, Masahiro ICHINO
  • Publication number: 20200407886
    Abstract: Provided is a sheet molding compound having excellent thick portion-molding properties that can inhibit the occurrence of internal cracks even during the molding of a thick portion and enables a carbon fiber composite material molded article to be excellently released from a die. Also provided is a carbon fiber composite material molded article. The sheet molding compound of the present invention contains a fiber substrate (A) containing carbon fiber and a thermosetting resin composition (B), in which an average fiber length of the carbon fiber is 5 mm or more, and a volumetric molding shrinkage rate of the thermosetting resin composition (B) is 0.5% or more and 4.4% or less. Furthermore, the carbon fiber composite material molded article of the present invention has a thick portion having a thickness of 10 mm or more, in which the thick portion is formed of a cured material of the sheet molding compound of the present invention.
    Type: Application
    Filed: September 9, 2020
    Publication date: December 31, 2020
    Applicant: Mitsubishi Chemical Corporation
    Inventors: Yasuhiko NABESHIMA, Yasunori MURANO, Akira OOTA
  • Publication number: 20200255614
    Abstract: Provided is a thermosetting resin composition which achieves both high heat resistance and high bending strength as a fiber-reinforced composite material, and also has rapid curability that enables high cycle press forming, thermal stability, and storage stability. The thermosetting resin composition of the present invention is a thermosetting resin composition comprising an epoxy resin, an epoxy resin curing agent, an imidazole compound, and an epoxy resin curing accelerator, in which the epoxy resin curing agent is dicyandiamide or a derivative thereof, and the epoxy resin curing accelerator comprises a urea derivative having two or more dimethylureido groups in a molecule.
    Type: Application
    Filed: April 29, 2020
    Publication date: August 13, 2020
    Applicant: Mitsubishi Chemical Corporation
    Inventors: Takuya Teranishi, Masahiro Ichino, Akira Oota
  • Publication number: 20200140633
    Abstract: The invention provides an epoxy resin composition that is easily B-staged despite containing an epoxy resin inherently difficult to B-stage, has a long pot life, has excellent processability and storage stability after B-staging, and make it possible to obtain a fiber-reinforced composite material having excellent flexural strength and flexural modulus. A molding material, including a thickened product of an epoxy resin composition; and a reinforcing fiber; wherein the epoxy resin composition including: a component (A): an aromatic epoxy resin; a component (B): an alicyclic diamine; a component (C): an epoxy resin curing agent that is not an alicyclic diamine; and a component (D): an aliphatic epoxy resin, wherein, when the viscosity at 25° C. immediately after preparation of the epoxy resin composition is taken as (a) and the viscosity at 25° C. after three hours from the preparation is taken as (b), the epoxy resin composition satisfies: (a)=0.1 to 25 Pa·s; (b)=0.1 to 25 Pa·s; and (b)/(a)?5.
    Type: Application
    Filed: August 27, 2018
    Publication date: May 7, 2020
    Applicant: Mitsubishi Chemical Corporation
    Inventors: Akira OOTA, Masahiro ICHINO, Takuya TERANISHI, Mitsuru KUTSUWADA, Yusuke WATANABE, Natsumi MUKOUZAKA
  • Publication number: 20200087506
    Abstract: A molding material that enables acquirement of a fiber-reinforced composite material which has excellent demoldability from a mold and excellent surface appearance, which contaminates a mold surface after molding less, and which has excellent mechanical properties and heat resistance; and a fiber-reinforced composite material which has excellent demoldability from a mold and surface appearance, which contaminates a mold surface after molding less, and which has excellent mechanical properties and heat resistance, are provided. A molding material of the present invention includes a component (A): an epoxy resin; a component (B): an epoxy resin curing agent; a component (C): a compound that has a solubility parameter of 11.2 or less and a melting point of 115° C. or lower; and a reinforcement fiber.
    Type: Application
    Filed: November 19, 2019
    Publication date: March 19, 2020
    Applicant: Mitsubishi Chemical Corporation
    Inventors: Akira OOTA, Masahiro Ichino, Takuya Teranishi, Yusuke Watanabe, Natsumi Mukouzaka
  • Publication number: 20200055978
    Abstract: A sheet-molding compound comprising a thickened thermosetting resin composition and reinforcing fiber bundles. The thermosetting resin composition comprises components (A), (B) and (D). The content of component (D) is 10 parts by mass to 30 parts by mass with respect to 100 parts by mass of the total amount of epoxy resin. The final viscosity of the thickened thermosetting resin composition is 150 Pa·s to 20000 Pa·s, and the minimum viscosity is 2 Pa·s to 600 Pa·s, the final viscosity being higher than the minimum viscosity.
    Type: Application
    Filed: October 16, 2019
    Publication date: February 20, 2020
    Applicant: Mitsubishi Chemical Corporation
    Inventors: Akira OOTA, Masahiro Ichino, Takuya Teranishi, Tooru Kondou, Mitsuru Kutsuwada
  • Publication number: 20190366681
    Abstract: Provided is a fiber-reinforced composite material molded article including a thick portion having a thickness equal to or greater than 10 mm, in which the thick portion has an inner layer which is formed of a cured material of a composite material (A) containing reinforcing fiber and an epoxy resin and a surface layer which is formed of a cured material of a composite material (B) containing reinforcing fiber and a vinyl ester resin.
    Type: Application
    Filed: July 30, 2019
    Publication date: December 5, 2019
    Applicant: Mitsubishi Chemical Corporation
    Inventors: Yasuhiko NABESHIMA, Yasunori MURANO, Akira OOTA
  • Patent number: 10494475
    Abstract: A sheet-molding compound comprising a thickened thermosetting resin composition and reinforcing fiber bundles. The thermosetting resin composition comprises components (A), (B) and (D). The content of component (D) is 10 parts by mass to 30 parts by mass with respect to 100 parts by mass of the total amount of epoxy resin. The final viscosity of the thickened thermosetting resin composition is 150 Pa·s to 20000 Pa·s, and the minimum viscosity is 2 Pa·s to 600 Pa·s, the final viscosity being higher than the minimum viscosity.
    Type: Grant
    Filed: May 13, 2016
    Date of Patent: December 3, 2019
    Assignee: Mitsubishi Chemical Corporation
    Inventors: Akira Oota, Masahiro Ichino, Takuya Teranishi, Tooru Kondou, Mitsuru Kutsuwada
  • Patent number: 10363724
    Abstract: A resin composition including an epoxy resin (A), a curing agent (B), and vinyl polymer particles (C), in which the contained amount of epoxy resin (a1) having a molecular weight of 100-480 is 30-90 parts by mass per 100 parts by mass of the epoxy resin (A), the contained amount of epoxy resin (a2) having a molecular weight of 2,000-40,000 is 10-70 parts by mass per 100 parts by mass of the epoxy resin (A), the contained amount of the vinyl polymer particles (C) is 2-30 parts by mass per 100 parts by mass of the epoxy resin (A), and the instantaneous maximum thickening value of the vinyl polymer particles obtained by the following method is 0.3-5.0 Pa·s/° C.
    Type: Grant
    Filed: October 14, 2015
    Date of Patent: July 30, 2019
    Assignee: Mitsubishi Chemical Corporation
    Inventors: Takuya Teranishi, Akira Oota, Masahiro Ichino, Toru Kondo
  • Publication number: 20190185612
    Abstract: Provided is a thermosetting resin composition (C) of which curing can be started at a relatively low temperature in a short time and a cured product exhibits high heat resistance, the thermosetting resin composition (C) comprising an epoxy resin; an epoxy resin curing agent; and an epoxy resin curing accelerator, wherein the epoxy resin curing agent contains an imidazole-based curing agent 1 which is not encapsulated in a microcapsule and a curing agent 2 which is encapsulated in a microcapsule, and the epoxy resin curing accelerator comprises a urea derivative.
    Type: Application
    Filed: February 21, 2019
    Publication date: June 20, 2019
    Applicant: Mitsubishi Chemical Corporation
    Inventors: Takuya TERANISHI, Masahiro Ichino, Kazuhisa Ikeda, Akira Oota
  • Publication number: 20180142057
    Abstract: A sheet-molding compound comprising a thickened thermosetting resin composition and reinforcing fiber bundles. The thermosetting resin composition comprises components (A), (B) and (D). The content of component (D) is 10 parts by mass to 30 parts by mass with respect to 100 parts by mass of the total amount of epoxy resin. The final viscosity of the thickened thermosetting resin composition is 150 Pa·s to 20000 Pa·s, and the minimum viscosity is 2 Pa·s to 600 Pa·s, the final viscosity being higher than the minimum viscosity.
    Type: Application
    Filed: May 13, 2016
    Publication date: May 24, 2018
    Applicant: Mitsubishi Chemical Corporation
    Inventors: Akira OOTA, Masahiro ICHINO, Takuya TERANISHI, Tooru KONDOU, Mitsuru KUTSUWADA
  • Publication number: 20170282516
    Abstract: A resin composition including an epoxy resin (A), a curing agent (B), and vinyl polymer particles (C), in which the contained amount of epoxy resin (a1) having a molecular weight of 100-480 is 30-90 parts by mass per 100 parts by mass of the epoxy resin (A), the contained amount of epoxy resin (a2) having a molecular weight of 2,000-40,000 is 10-70 parts by mass per 100 parts by mass of the epoxy resin (A), the contained amount of the vinyl polymer particles (C) is 2-30 parts by mass per 100 parts by mass of the epoxy resin (A), and the instantaneous maximum thickening value of the vinyl polymer particles obtained by the following method is 0.3-5.0 Pa·s/° C.
    Type: Application
    Filed: October 14, 2015
    Publication date: October 5, 2017
    Applicant: Mitsubishi Rayon Co., Ltd.
    Inventors: Takuya TERANISHI, Akira OOTA, Masahiro ICHINO, Toru KONDO