Abstract: A semiconductor device includes a wiring substrate including an opening formed to penetrate from a first main surface to a second main surface, and configured to include an insulating material, a metal substrate fixed to the wiring substrate to cover the opening from the second main surface side, a semiconductor chip fixed inside the opening on a main surface of the metal substrate, a resin disposed to cover the semiconductor chip from above the first main surface on the main surface, and formed of a material having a thermal expansion coefficient different from that of the wiring substrate, and an adhesive containing a metal paste disposed between a side surface of the wiring substrate and the main surface, and the resin, in which the adhesive is disposed on the main surface so that a thickness gradually increases from a center side of the opening to the side surface.

Abstract: A semiconductor device includes: a package having a top surface and a bottom surface; a semiconductor element arranged in the package; and a base which is arranged in the package and on which the semiconductor element is mounted. A top surface of the base is exposed to the top surface of the package, and a bottom surface of the base is exposed to the bottom surface of the package.

Abstract: A hot-air supply structure (1) comprises a hot air generator (20) and a housing (15) formed in the neighborhood of a hot-air inlet (81) of a molded component M in a die (10). A nozzle (21) is formed at the forward end of the hot-air generator, and an ejection port (211b) is formed on the side wall portion of the forward end needle unit (211) of the nozzle. The housing includes a support hole (151) in the nozzle, a relief hole (152), a flow path communication passage (153) and a bypass (154). The ejection port is movable between a first position to discharge the cool or warm air into the atmosphere through the bypass from the relief hole and a second position to introduce hot air into the flow path (8) of the molded component through the inlet (81) and the passage (153).

Abstract: The change-over device changes over, to one of three passages, between the runner groove connected to the injection nozzle and the communicating groove communicated with the mold side passage. At the first position, the second passage 372 is communicated with the communicating groove and the temperature of a flow of hot air is measured by the thermocouple and the flow is discharged into the atmosphere. At the second position, the runner groove and the communicating groove are communicated with each other when the runner groove and the communicating groove are open to the second passage 371 and resin material is injected into the mold. At the third position, the material in the injection passage and the material in the runner groove are deposited to each other when the injection passage is shut off from the communicating passage and the third passage 374 is communicated with the runner groove.

Abstract: The device includes: a runner block arranged at a position close to the injection port for resin material for secondary forming; and a slide core moved relatively with the runner block. In the runner block, a guide passage is formed which is communicated with a passage formed when pipe-shaped passages of the primary moldings are butted against each other. A heating medium passage or a resin material passage formed in the slide core are moved so that either the heating medium passage or the resin material passage can be selectively communicated with the guide passage formed in the runner block.

Abstract: The change-over device changes over, to one of three passages, between the runner groove connected to the injection nozzle and the communicating groove communicated with the mold side passage. At the first position, the second passage 372 is communicated with the communicating groove and the temperature of a flow of hot air is measured by the thermocouple and the flow is discharged into the atmosphere. At the second position, the runner groove and the communicating groove are communicated with each other when the runner groove and the communicating groove are open to the second passage 371 and resin material is injected into the mold. At the third position, the material in the injection passage and the material in the runner groove are deposited to each other when the injection passage is shut off from the communicating passage and the third passage 374 is communicated with the runner groove.

Abstract: A hot-air supply structure (1) comprises a hot air generator (20) and a housing (15) formed in the neighborhood of a hot-air inlet (81) of a molded component M in a die (10). A nozzle (21) is formed at the forward end of the hot-air generator, and an ejection port (211b) is formed on the side wall portion of the forward end needle unit (211) of the nozzle. The housing includes a support hole (151) in the nozzle, a relief hole (152), a flow path communication passage (153) and a bypass (154). The ejection port is movable between a first position to discharge the cool or warm air into the atmosphere through the bypass from the relief hole and a second position to introduce hot air into the flow path (8) of the molded component through the inlet (81) and the passage (153).

Abstract: The device includes: a runner block arranged at a position close to the injection port for resin material for secondary forming; and a slide core moved relatively with the runner block. In the runner block, a guide passage is formed which is communicated with a passage formed when pipe-shaped passages of the primary moldings are butted against each other. A heating medium passage or a resin material passage formed in the slide core are moved so that either the heating medium passage or the resin material passage can be selectively communicated with the guide passage formed in the runner block.