Patents by Inventor Akira Sakurai
Akira Sakurai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9793826Abstract: In one form, a method of manufacturing a circuit device comprises providing a lead frame comprising a plurality of leads, each comprising an island portion, a bonding portion elevated from the island portion, a slope portion extending obliquely so as to connect the island portion and the bonding portion, and a lead portion extending from the bonding portion. The circuit elements are mounted on upper surfaces of the island portions, and are connected to corresponding bonding portions by wirings. Two leads are adapted to be connected to positive and negative sides of a power source, and another lead is an output lead for providing alternating-current power. Lower surfaces of the island portions are attached to an upper surface of a circuit board. The circuit board, the circuit elements, and the lead frame are encapsulated by a resin, so that the lead portions are not covered by the resin.Type: GrantFiled: January 22, 2016Date of Patent: October 17, 2017Assignee: Semiconductor Components Industries, LLCInventors: Shigeaki Mashimo, Fumio Horiuchi, Kiyoaki Kudo, Akira Sakurai, Yuhki Inagaki
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Patent number: 9748079Abstract: Provided is a cylindrical sputtering target material formed of copper or a copper alloy, in which an average value of the special grain boundary length ratios L?N/LN which are measured with respect to the outer peripheral surfaces of both end portions and the outer peripheral surface of the center portion in an axis O direction is set to be equal to or greater than 0.5, and each measured value is in a range of ±20% with respect to the average value of the special grain boundary length ratios L?N/LN, and the total amount of Si and C which are impurity elements is equal to or smaller than 10 mass ppm and the amount of O is equal to or smaller than 50 mass ppm.Type: GrantFiled: February 20, 2015Date of Patent: August 29, 2017Assignee: MITSUBISHI MATERIALS CORPORATIONInventors: Michiaki Ohto, Satoshi Kumagai, Akira Sakurai
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Patent number: 9722509Abstract: A circuit device comprises a circuit board and a plurality of leads each comprising an island portion, a bonding portion elevated from the island portion, and an oblique slope portion connecting the island portion and the bonding portion, and a plurality of circuit elements mounted on the island portions so as to be connected to corresponding bonding portions through wirings. Two leads are adapted to be connected to positive and negative electrodes of a direct-current power source, and yet another lead is an output lead adapted to output alternating-current power. One electrode provided on a transistor mounted on an island portion of the second input lead is connected to a bonding portion of the output lead through a wiring, and another electrode provided on a transistor mounted on an island portion of the output lead is connected to a bonding portion of the first input lead through a wiring.Type: GrantFiled: February 26, 2016Date of Patent: August 1, 2017Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCInventors: Shigeaki Mashimo, Fumio Horiuchi, Kiyoaki Kudo, Akira Sakurai, Yuhki Inagaki
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Publication number: 20170078193Abstract: A communication system comprises: a communication apparatus(es) that processes a packet(s) in accordance with externally set control information; and a control apparatus(es) that sets control information in the communication apparatus(es) to control the communication apparatus(es). A first control unit that sets control information in accordance with a first rule(s) and a second control unit that sets control information in accordance with a second rule(s) are arranged as the control apparatus(es), and the first and second control units control the communication apparatus(es) independently of each other.Type: ApplicationFiled: March 5, 2015Publication date: March 16, 2017Inventors: Zhenlong CUI, Kazuo TAKAGI, Akira SAKURAI, Motoaki OKUMURA
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Publication number: 20160248344Abstract: A circuit device comprises a circuit board and a plurality of leads each comprising an island portion, a bonding portion elevated from the island portion, and an oblique slope portion connecting the island portion and the bonding portion, and a plurality of circuit elements mounted on the island portions so as to be connected to corresponding bonding portions through wirings. Two leads are adapted to be connected to positive and negative electrodes of a direct-current power source, and yet another lead is an output lead adapted to output alternating-current power. One electrode provided on a transistor mounted on an island portion of the second input lead is connected to a bonding portion of the output lead through a wiring, and another electrode provided on a transistor mounted on an island portion of the output lead is connected to a bonding portion of the first input lead through a wiring.Type: ApplicationFiled: February 26, 2016Publication date: August 25, 2016Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCInventors: Shigeaki MASHIMO, Fumio HORIUCHI, Kiyoaki KUDO, Akira SAKURAI, Yuhki INAGAKI
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Publication number: 20160211247Abstract: In one form, a method of manufacturing a circuit device comprises providing a lead frame comprising a plurality of leads, each comprising an island portion, a bonding portion elevated from the island portion, a slope portion extending obliquely so as to connect the island portion and the bonding portion, and a lead portion extending from the bonding portion. The circuit elements are mounted on upper surfaces of the island portions, and are connected to corresponding bonding portions by wirings. Two leads are adapted to be connected to positive and negative sides of a power source, and another lead is an output lead for providing alternating-current power. Lower surfaces of the island portions are attached to an upper surface of a circuit board. The circuit board, the circuit elements, and the lead frame are encapsulated by a resin, so that the lead portions are not covered by the resin.Type: ApplicationFiled: January 22, 2016Publication date: July 21, 2016Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCInventors: Shigeaki MASHIMO, Fumio HORIUCHI, Kiyoaki KUDO, Akira SAKURAI, Yuhki INAGAKI
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Publication number: 20160203959Abstract: Provided is a cylindrical sputtering target material formed of copper or a copper alloy, in which an average value of the special grain boundary length ratios L?N/LN which are measured with respect to the outer peripheral surfaces of both end portions and the outer peripheral surface of the center portion in an axis O direction is set to be equal to or greater than 0.5, and each measured value is in a range of ±20% with respect to the average value of the special grain boundary length ratios L?N/LN, and the total amount of Si and C which are impurity elements is equal to or smaller than 10 mass ppm and the amount of O is equal to or smaller than 50 mass ppm.Type: ApplicationFiled: February 20, 2015Publication date: July 14, 2016Applicant: MITSUBISHI MATERIALS CORPORATIONInventors: Michiaki OHTO, Satoshi KUMAGAI, Akira SAKURAI
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Publication number: 20160194749Abstract: A manufacturing method of a cylindrical sputtering target material formed of copper or a copper alloy is provided, the method including: a continuous casting step of casting a cylindrical ingot having an average crystal grain diameter equal to or smaller than 20 mm using a continuous casting machine or a semi-continuous casting machine; and a cold working step and a heat treatment step of repeatedly performing cold working and a heat treatment with respect to the cylindrical ingot, to form the cylindrical sputtering target material in which an average crystal grain diameter of an outer peripheral surface is from 10 ?m to 150 ?m and a proportion of the area of crystal grains having a crystal grain diameter more than double the average crystal grain diameter is less than 25% of the entire crystal area.Type: ApplicationFiled: February 20, 2015Publication date: July 7, 2016Applicant: MITSUBISHI MATERIALS CORPORATIONInventors: Akira SAKURAI, Satoshi KUMAGAI, Takashi SONOHATA, Michiaki OHTO
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Publication number: 20160172167Abstract: In a copper material for a high-purity copper sputtering target of the present invention, a purity of Cu excluding O, H, N, and C is in a range of 99.999980 mass % or higher and 99.999998 mass % or lower, an amount of Al is 0.005 ppm by mass or less, and an amount of Si is 0.05 ppm by mass or less.Type: ApplicationFiled: July 8, 2014Publication date: June 16, 2016Inventors: Akira SAKURAI, Yu GU, Yuji SATO, Satoshi KUMAGAI
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Patent number: 9369359Abstract: A transmission source node transmits diagnostic frames where a TTL value is set to the number of hops that is counted until an intermediate node. A relay node decrements the TTL value of the received diagnostic frames, counts the number of diagnostic frames where the decremented TTL value is 0, and recognizes continuity between the transmission source node and the relay node based on the number of transmitted diagnostic frames transmitted from the transmission source node and the number of diagnostic frames where the decremented TTL value is 0.Type: GrantFiled: September 10, 2012Date of Patent: June 14, 2016Assignee: NEC CORPORATIONInventors: Masaki Umayabashi, Akira Sakurai, Zhenlong Cui
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Patent number: 9275930Abstract: In a hybrid integrated circuit device of the present invention, leads are fixedly attached on the upper surface of a circuit board. The lead includes an island portion, a slope portion, and a lead portion. A transistor and a diode are mounted on the upper surface of the island portion. Electrodes provided on the upper surfaces of the transistor and the diode are connected to a bonding portion through a fine metal wire. The bonding portion of the lead is disposed at a higher position than the island portion. Thus, the fine metal wires connected to the bonding portion are separated from each other.Type: GrantFiled: September 23, 2011Date of Patent: March 1, 2016Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCInventors: Shigeki Mashimo, Fumio Horiuchi, Kiyoaki Kudo, Akira Sakurai, Yuhki Inagaki
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Patent number: 9264332Abstract: In a transmission system capable of measuring packet loss ratio between arbitrary devices upon a transmission path without increasing bandwidth of an OAM frame band, a plurality of transmission devices which have been disposed upon a transmission path are provided with a frame analysis unit which receives data frames so as to analyze the type of the data frames, a count processing unit which stores the number of received frames included in the data frames into storage module provided beforehand, an output line end portion which outputs the data frames, and an OAM processing unit which calculates the packet loss ratio in the transmission path using the number of received frames. The frame analysis unit has a function which, if the data frames are OAM frames, copies the data frames and the OAM processing unit has a function which calculates the packet loss ratio using the copied OAM frames.Type: GrantFiled: June 12, 2012Date of Patent: February 16, 2016Assignee: NEC CORPORATIONInventors: Akira Sakurai, Hiroshi Tanaka, Masaki Umayabashi
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Publication number: 20150207673Abstract: A communication device communicates with a counterpart device via a working path or any of a plurality of backup paths. The communication device includes: a plurality of selection units which select either one of two paths, the plurality of selection units including a main selection unit and an auxiliary selection unit being different from the main selection unit; and a path determination unit which determines a path selected by one of the plurality of selection units which has last performed path selection to be a path to be used for communicating with the counterpart device. The main selection unit selects one path from between the working path and one of the plurality of backup paths. The auxiliary selection unit selects one path from between a path selected by one selection unit of the plurality of selection units and one of the plurality of backup paths, the one selection unit being different from the auxiliary selection unit.Type: ApplicationFiled: May 28, 2013Publication date: July 23, 2015Inventors: Zhenlong Cui, Kazuo Takagi, Akira Sakurai
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Patent number: 9077629Abstract: A communication device includes a receiving unit configured to receive a frame via a connected packet network, a transmitting unit configured to transmit the received frame and a self-originating frame to the packet network, a monitoring unit configured to monitor a flow rate of the transmitted frames, a transmission cycle setting unit configured to cause a transmission cycle of the self-originating OAM frame to be a predetermined transmission cycle set for a normal condition when the flow rate of the frames is greater than or equal to a predetermined threshold, and a transmission cycle calculating unit configured to calculate a transmission cycle of the OAM frame that can compensate for a shortfall in the number of the transmitted frames, the transmission cycle calculating unit being configured to cause the calculated transmission cycle to be a transmission cycle of the self-originating OAM frame when the flow rate of the frames is less than the predetermined threshold.Type: GrantFiled: July 22, 2011Date of Patent: July 7, 2015Assignee: NEC CORPORATIONInventors: Kohei Okazaki, Akira Sakurai
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Patent number: 9014188Abstract: This communication system is equipped with a plurality of transceiver devices each composed of a transmission device that transmits unit data and a reception device that receives unit data from the transmission device. The transmission devices are connected in series. Each of the transmission devices stores identification information for identifying the device itself. The transmission device accepts unit data from a front stage side. The transmission device generates identification information for identifying one of the transmission devices from information included in the accepted unit data, in accordance with a predetermined generation process. In a case that the generated identification information corresponds to the stored identification information, the transmission device transmits the accepted unit data to the reception device.Type: GrantFiled: November 13, 2009Date of Patent: April 21, 2015Assignee: NEC CorporationInventors: Taiki Kanai, Akira Sakurai, Atsuya Yamashita, Hiroaki Nakajima
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Publication number: 20140347979Abstract: An AIS management table 14 is storing entries having, as fields, an input port connected to a section, a section endpoint serving as an input destination, a path over which an AIS frame is to be output, and an output port connected to a section. When a failure is detected in a section, an AIS processing unit 19 searches an AIS management table 14 using, as a key, an input port or section endpoint involved in the location of the failure, inserts retrieved path information into an AIS frame for failure detection, and determines that a retrieved output port is the output destination of the AIS frame. A frame transfer unit 12 receives the AIS frame and information about the output port from the AIS processing unit 19 and transmits the AIS frame from the output port to an adjacent section.Type: ApplicationFiled: June 5, 2012Publication date: November 27, 2014Applicant: NEC CORPORATIONInventors: Hiroshi Tanaka, Masaki Umayabashi, Akira Sakurai
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Patent number: 8897308Abstract: A node according to the present invention is used in an MPLS (Multi Protocol Label Switching) network, and the node includes an input unit which receives an OAM (Operation Administration and Maintenance) frame including TTL (Time To Live) from outside of the node and an output unit which transmits an OAM frame to outside of the node, wherein the input unit sets the TTL to a specific value and transmits the received OAM frame to the output unit in case a termination destination which an OAM frame received from outside indicates is the node and the received OAM frame is to be transmitted to the output unit and the output unit terminates an OAM frame transmitted from the input unit.Type: GrantFiled: November 2, 2010Date of Patent: November 25, 2014Assignee: NEC CorporationInventors: Zhenlong Cui, Hiroyuki Takagi, Masaki Umayabashi, Kazuo Takagi, Akira Sakurai, Hiroshi Tanaka
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Publication number: 20140341044Abstract: A transmission source node transmits diagnostic frames where a TTL value is set to the number of hops that is counted until an intermediate node. A relay node decrements the TTL value of the received diagnostic frames, counts the number of diagnostic frames where the decremented TTL value is 0, and recognizes continuity between the transmission source node and the relay node based on the number of transmitted diagnostic frames transmitted from the transmission source node and the number of diagnostic frames where the decremented TTL value is 0.Type: ApplicationFiled: September 10, 2012Publication date: November 20, 2014Applicant: NEC CORPORATIONInventors: Masaki Umayabashi, Akira Sakurai, Zhenlong Cui
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Patent number: 8837506Abstract: A data transfer device 210 is equipped with a plurality of communication ports 211a and 211b, a communication establishment processor 212, and a communication maintenance processor 213. The communication establishment processor 212 transmits and receives communication establishing information for establishing communication with an external device connected via the communication port to and from the external device. The communication maintenance processor 213 is configured to operate independently of the communication establishment processor 212 and, every time a predetermined transmission period elapses, transmits communication maintaining information for maintaining the establishment of communication with the external device, to the external device.Type: GrantFiled: November 13, 2009Date of Patent: September 16, 2014Assignee: NEC CorporationInventors: Atsuya Yamashita, Tsutomu Mieno, Hiroaki Nakajima, Akira Sakurai
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Publication number: 20140146686Abstract: In a transmission system capable of measuring packet loss ratio between arbitrary devices upon a transmission path without increasing bandwidth of an OAM frame band, a plurality of transmission devices which have been disposed upon a transmission path are provided with a frame analysis unit which receives data frames so as to analyze the type of the data frames, a count processing unit which stores the number of received frames included in the data frames into storage module provided beforehand, an output line end portion which outputs the data frames, and an OAM processing unit which calculates the packet loss ratio in the transmission path using the number of received frames. The frame analysis unit has a function which, if the data frames are OAM frames, copies the data frames and the OAM processing unit has a function which calculates the packet loss ratio using the copied OAM frames.Type: ApplicationFiled: June 12, 2012Publication date: May 29, 2014Inventors: Akira Sakurai, Hiroshi Tanaka, Masaki Umayabashi