Abstract: An object of the present invention is to provide an industrially advantageous method for producing a bisimide dicarboxylic acid, which uses substantially no solvent and requires no granulation after completion of the reaction.

Abstract: The present invention is to provide a polyamide-imide which has a high regularity of molecular structure and few branched structures, does not contain hydrogen halide, is not required to be separated and purified in post processes, and can be suitably used as a film, a varnish, or a molding material; raw material salt of polyamide-imide and production method thereof. The polyamide-imide has a repeating unit represented by the general formula (1): in which R1, R2 represent independently a divalent residue having an aromatic ring, an aliphatic ring or an aliphatic hydrocarbon; R3, R4 represent independently a trivalent residue having an aromatic ring or an aliphatic ring; and an hydrogen atom bonding to the respective rings may be replaced by another atom or an atomic group.

Abstract: In a speaker damper, art sections are disposed on warp reference lines and warp reference lines. Straight sections are disposed so as to intersect intermediate reference lines at right angles. By adopting this configuration, wave parts can be adjusted so that they are less likely to expand/contract on the warp reference lines and the warp reference lines in comparison with related-art concentric circular wave parts. Further, the wave parts can be adjusted so that they are more likely to expand/contract on the intermediate reference lines. In this way, the speaker damper can perform uniform vibrating motions throughout the entire speaker damper with a simple configuration.

Abstract: A speaker system includes a first loudspeaker, a second loudspeaker, and a panel. The second loudspeaker is provided in front of the first loudspeaker and outputs a sound in a frequency range different from that of the first loudspeaker. The panel is provided on a front surface of the second loudspeaker. The panel includes a peripheral portion provided along an outer periphery of a diaphragm of the second loudspeaker. In the peripheral portion, at least one through-hole penetrating the panel in a sound output direction of the first and second loudspeakers is formed along an outer peripheral direction.

Abstract: The present invention provides fibrous copper microparticles suppressed in the occurrence of irregularities on the surface thereof and the aggregates of the fibrous copper microparticles having an average crystallite diameter controlled so as to fall within a specific range. In the fibrous copper microparticles of the present invention, the number of fibrous copper microparticles each including one or more irregularities each having a dimensional difference of 0.02 ?m or more, in a range of 1 ?m in the lengthwise direction of a fibrous body, between the maximum diameter portion of the fibrous body and the minimum diameter portion of the fibrous body falling in a diameter dimension range of 0.01 to 0.5 ?m, and each having a length of 1 ?m or more is 10 or less per 100 of the fibrous copper microparticles.

Abstract: Fibrous copper microparticles having a minor axis of 1 ?m or less and an aspect ratio of 10 or more, wherein the content of the copper particles having a minor axis of 0.3 ?m or more and an aspect ratio of 1.5 or less is 0.1 or less copper particle per one fibrous copper microparticle.

Abstract: The present invention provides coated fibrous copper microparticles, wherein the coated fibrous copper microparticles are fibrous copper microparticles each at least partially coated with a metal other than copper, and the length and the aspect ratio of the fibrous copper microparticles are 1 ?m or more and 10 or more, respectively.

Abstract: An object of the present invention, which was made to solve the problems above, is to provide a polyimide precursor resin composition superior in transparency allowing reduction of the residual volatile material rate during molding and giving a polyimide resin composition (e.g., polyimide film) superior in mechanical properties and transparency even when a cheaper polyamide-imide is used.

Abstract: An object of the present invention, which was made to solve the problems above, is to provide a polyimide precursor resin composition superior in transparency allowing reduction of the residual volatile material rate during molding and giving a polyimide resin composition (e.g., polyimide film) superior in mechanical properties and transparency even when a cheaper polyamide-imide is used.

Abstract: To provide a speaker unit capable of being thinned much further. A speaker unit 1 includes a voice coil 6 through which an input signal is passed, a voice coil bobbin 5 for converting the input signal flowing through the voice coil 6 into a mechanical reciprocating movement, a diaphragm 2 connected to either one side of said voice coil bobbin 5 in the reciprocating vibration direction; and a damper not connected to the voice coil bobbin 5 and connected to an outer edge portion of the diaphragm 2 and suppressing a rolling phenomenon of the voice coil bobbin 5.

Abstract: The present invention provides a substrate for a flexible printed wiring board including an adhesive layer containing an epoxy resin composition, insulating layers respectively stacked on both sides of the adhesive layer and formed with a pair of films containing a nonthermoplastic polyimide resin, and conductor layers respectively disposed on the outer surfaces of the films. The total thickness of the insulating layers respectively stacked on both sides of the adhesive layer is 10 to 100 ?m and 2 to 10 times the thickness of the adhesive layer. The mutual adhesion strength between the insulating layers through the intermediary of the adhesive layer is 7.0 N/cm or more.

Abstract: There is provided a flexible circuit board 22 that, when deposited on another flexible circuit board 40, causes no gap to occur between wiring films 4a, 4a, of the flexible circuit board 40. Moreover, a plurality of flexible circuit boards are deposited on one another to provide a flexible multi-layer wiring circuit board having no gaps between the flexible circuit boards and having less bowing. In the flexible circuit board 22, the thickness of a bonding layer 16, 16a, on the opposed side of a bowing metallic member 2, of an inter-layer insulating film 10 where which bumps 6 are formed is greater than the thickness of a bonding layer on the side of metallic member 2. When the flexible circuit board 22 is deposited on the other flexible circuit board 40 to form a flexible multi-layer wiring circuit board 50, the bonding layer 16, 16a can be filled between the wiring films 4a, 4a, so that the flexible multi-layer wiring circuit board 50 has no gaps and a less bowing.

Abstract: The present invention provides a substrate for a flexible printed wiring board including an adhesive layer containing an epoxy resin composition, insulating layers respectively stacked on both sides of the adhesive layer and formed with a pair of films containing a nonthermoplastic polyimide resin, and conductor layers respectively disposed on the outer surfaces of the films. The total thickness of the insulating layers respectively stacked on both sides of the adhesive layer is 10 to 100 ?m and 2 to 10 times the thickness of the adhesive layer. The mutual adhesion strength between the insulating layers through the intermediary of the adhesive layer is 7.0 N/cm or more.

Abstract: A method for preparing a substrate for a flexible print wiring board having a polyimide based resin layer wherein a solution of a polyimide based resin precursor is directly applied on an electrically conducting material to form a polyimide based resin precursor layer and then the precursor layer is cured by heating to prepare a polyimide based resin layer, characterized in that a solution of a polyimide based resin precursor B, which is one of solutions of two types of polyimide based resin precursors, is directly applied on an electrically conducting material and then, on the resultant layer is applied a solution of a polyimide based resin precursor A which allows resolving the residual strain generated in the polyimide based resin formed by the curing of the above polyimide based resin precursor B.

Abstract: The object of the present invention is to provide a polyimide precursor solution having a good coating workability. Another object of the present invention is to provide transfer and fixing parts such as a polyimide seamless belt and the like produced from said polyimide precursor solution. Said polyimide precursor solution is produced by dissolving said polyimide precursor which is a homopolymer or copolymer of a polyamide acid in a solvent mixture of one or more kind(s) of solvent having a lower boiling point under 100° C., and one or more kind(s) of solvent having a higher boiling point of 100° C. or more, wherein said higher boiling point solvent (s) is (are) contained in said solvent mixture in an amount of 5 to 55% by weight.

Abstract: A method for preparing a substrate for a flexible print wiring board having a polyimide based resin layer wherein a solution of a polyimide based resin precursor is directly applied on an electrically conducting material to form a polyimide based resin precursor layer and then the precursor layer is cured by heating to prepare a polyimide based resin layer, characterized in that a solution of a polyimide based resin precursor B, which is one of solutions of two types of polyimide based resin precursors, is directly applied on an electrically conducting material and then, on the resultant layer is applied a solution of a polyimide based resin precursor A which allows resolving the residual strain generated in the polyimide based resin formed by the curing of the above polyimide based resin precursor B.

Abstract: An enamel remover, which contains acetone, ethylene carbonate, and a monohydric lower alcohol at a specific ratio, has a notable effect for removing enamel painted on nails and has no stimulant odor in use. In addition, it does not damage nails or skin.

Abstract: A transparent or translucent cleansing composition in the form of gel or liquid includes (A) a hydrophilic nonionic surfactant, (B) an amphoteric surfactant, (C) a water-soluble compound containing at least one hydroxyl group, (D) a liquid oil and (E) water. The cleansing composition provides an agreeable feeling during use, is excellent in spreadability and slidability upon application to the skin, and is good in penetrability into minute parts of the skin. It also avoids ready increase in viscosity even when additional water is mixed therein, can be used in massaging the skin while keeping it smooth to the touch during its application, is suitable for use even in wet environments, such as a bathroom, and can be removed with ease from the skin using only water, so that the base component does not remain on the skin. The composition is excellent in detergency and rinsability and gives users a refreshed feeling after use. The composition is also stable during long term storage, even at elevated temperatures.

Abstract: A polyol fatty acid ester having mixed acid groups is produced by reacting a partial ester of a polyol and a branched fatty acid with a a straight chain fatty acid or a lower alcohol ester thereof in the presence of a lipase. The obtained glyceride mixture contains a large amount of diglyceride having a branched, saturated fatty acid group and a straight chain, saturated fatty acid group.

Abstract: A detergent composition which comprises the following components (A) and (B):(A) a fluorine-containing polymer having a perfluoroalkyl group and an alkyl group in the molecule, and(B) a liquid oil base.The present detergent composition is capable of quickly and effectively removing not only ordinary make-up cosmetics but also fluorine-containing cosmetics which are difficult to be removed by conventional detergent compositions.