Abstract: A semiconductor laminate film includes a silicon substrate and a semiconductor layer formed on the silicon substrate and containing silicon and germanium. The semiconductor layer having a surface roughness Rms of 1 nm or less. Further, the semiconductor layer satisfies the following relationship t?0.881×x?4.79 where t represents a thickness (nm) of the semiconductor layer, and x represents a ratio of the number of germanium atoms to a sum of the number of silicon atoms and the number of germanium atoms in the semiconductor layer. Also, the semiconductor layer being a mixed crystal semiconductor layer containing silicon and germanium.

Abstract: A laminated electronic component includes an element body formed by laminating an insulating layer and having a bottom surface used as a mounting surface, and a bottom surface electrode formed on the bottom surface of the element body and containing glass and a sintered metal. The bottom surface electrode includes a first electrode layer and a second electrode layer formed on the element body side from the first electrode layer, an edge portion of the second electrode layer is covered with an overcoat layer which is a part of the element body, the first electrode layer is laminated on the second electrode layer with the overcoat layer interposed therebetween, and a content of glass in the first electrode layer is larger than a content of glass in the second electrode layer.

Abstract: A laminated electronic component includes an element body formed by laminating an insulating layer and having a bottom surface used as a mounting surface, and side surfaces configured to extend to intersect the bottom surface, and a bottom surface electrode formed on the bottom surface of the element body, wherein the bottom surface electrode includes a first electrode layer and a second electrode layer formed on the element body side from the first electrode layer, the first electrode layer is a resin electrode laminated to cover the second electrode layer, and has a stretched portion configured to extend to the side surface, and a width dimension of the stretched portion is smaller than a width dimension of the first electrode layer on the bottom surface.

Abstract: A laminated electronic component includes an element body formed by laminating an insulating layer and having a bottom surface used as a mounting surface, and a bottom surface electrode formed on the bottom surface of the element body and containing glass and a sintered metal, wherein the bottom surface electrode includes a first electrode layer and a second electrode layer formed on the element body side from the first electrode layer, an edge portion of the second electrode layer is covered with an overcoat layer which is a part of the element body, the first electrode layer is laminated on the second electrode layer with the overcoat layer interposed therebetween, and a content of glass in the first electrode layer is larger than a content of glass in the second electrode layer.

Abstract: In a photosensitive conductive paste containing photosensitive organic components, conductor powder, and quartz powder, melting of the quartz powder does not occur or is very unlikely to occur in a heat treatment step, and in the heat treatment step, it functions sufficiently to bring shrinkage rates and shrinkage behaviors of both of a conductor layer and an element body layer closer to each other when they shrink, and thus generation of voids can be inhibited when it is used for manufacturing a laminated coil component.

Abstract: Problem to be Solved by the Invention: To provide a adhesive tape for electronic component fabrication, having extremely high antistatic performance, superior adherence between an antistatic layer and a adhesive layer, does not cause corrosion of a magnetic head that is comprised of a metal such as pure copper or the like, and alumina to occur, and which is easier to be released again.

Abstract: The invention provides a nonmagnetic ceramic comprising 5% to 40% by weight of .alpha.-quartz and 5% to 60% by weigth of zinc silicate dispersed in 35% to 75% by weight of borosilicate glass as a matrix, the borosilicate glass having SiO.sub.2 and B.sub.2 O.sub.3 contents: SiO.sub.2 =70 to 90% by weight and B.sub.2 O.sub.3 =10 to 30% by weight. Using the nonmagnetic ceramic, multilayer ceramic inductors are obtained. When the ceramic is used as ceramic multilayer parts having an inductor section, it has a low dielectric constant and good characteristics in the high-frequency region, allows for low-temperature firing enabling the use of silver electrodes, prevents chip deformation and crack occurrence upon sintering, and provides a higher mechanical strength.