Abstract: Provided is a polishing composition capable of speeding up a mirror polishing in terms of polishing rate and the like, improving the smoothness and the flatness of a wafer surface of a semiconductor wafer after the mirror polishing, enabling mirror finishing with high processing accuracy, and having excellent storage stability. The polishing composition is for polishing a polishing target including a group III-V compound as a constituent component, and includes colloidal silica, an oxidizing agent, an oxidation accelerator for accelerating the oxidation reaction on the surface of the polishing target by the oxidizing agent, a stabilizer for controlling the accelerating action of the oxidation reaction on the surface of the polishing target by the oxidation accelerator, and water.

Abstract: Embodiments provide a polishing composition containing colloidal silica, pulverized wet-process silica particles, and a water-soluble polymer compound. According to at leaset one embodiment, the water-soluble polymer compound is a copolymer containing a structural unit derived from an unsaturated aliphatic carboxylic acid and a structural unit derived from an unsaturated amide.

Abstract: Embodiments provide a polishing composition for a magnetic disk substrate containing colloidal silica, a water-soluble polymer, and water. The water-soluble polymer compound is a copolymer containing a monomer having a carboxylic acid group, a monomer having an amide group, and a monomer having a sulfonic acid group as essential monomers. The water-soluble polymer compound has a weight average molecular weight of 1,000 to 1,000,000.

Abstract: Embodiments provide a polishing composition for a magnetic disk substrate containing colloidal silica, a water-soluble polymer, and water. The water-soluble polymer compound is a copolymer containing a monomer having a carboxylic acid group, a monomer having an amide group, and a monomer having a sulfonic acid group as essential monomers. The water-soluble polymer compound has a weight average molecular weight of 1,000 to 1,000,000.

Abstract: Embodiments provide a polishing composition containing colloidal silica, pulverized wet-process silica particles, and a water-soluble polymer compound. According to at leaset one embodiment, the water-soluble polymer compound is a copolymer containing a structural unit derived from an unsaturated aliphatic carboxylic acid and a structural unit derived from an unsaturated amide.

Abstract: Embodiments of the invention provide a polishing composition including colloidal silica having an average particle size of 5 to 200 nm and pulverized wet-process silica particles having an average particle size of 0.1 to 1.0 ?m, wherein a value of the ratio of the average particle size of the wet-process silica particles to that of the colloidal silica is from 2.0 to 30.0. The polishing composition, according to various embodiments, achieves a high polishing rate and has a good surface smoothness, without the use of alumina particles.

Abstract: Embodiments of the invention provide a polishing composition including colloidal silica, pulverized wet-process silica particles, and a water-soluble polymer compound, wherein the water-soluble polymer compound is a polymer or copolymer having a constituent unit derived from an unsaturated aliphatic carboxylic acid. Various embodiments achieve a high polishing rate and obtain a good surface smoothness and end-face shape without the use of alumina particles.

Abstract: Embodiments of the invention provide a polishing composition including colloidal silica having an average particle size of 5 to 200 nm and pulverized wet-process silica particles having an average particle size of 0.1 to 1.0 ?m, wherein a value of the ratio of the average particle size of the wet-process silica particles to that of the colloidal silica is from 2.0 to 30.0. The polishing composition, according to various embodiments, achieves a high polishing rate and has a good surface smoothness, without the use of alumina particles.

Abstract: Embodiments of the invention provide a polishing composition including colloidal silica, pulverized wet-process silica particles, and a water-soluble polymer compound, wherein the water-soluble polymer compound is a polymer or copolymer having a constituent unit derived from an unsaturated aliphatic carboxylic acid. Various embodiments achieve a high polishing rate and obtain a good surface smoothness and end-face shape without the use of alumina particles.