Patents by Inventor Akira Takarada

Akira Takarada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11718732
    Abstract: Provided is a resin composition, a filament and resin powder for a three-dimensional printer, a shaped object, and a production method for the shaped object, all of which make it easy to produce a shaped object and can improve, in shaping using a three-dimensional printer, the resistance to delamination of the shaped object and the resistance to warpage and shrinkage of the shaped object. A resin composition contains: inorganic fibers having an average fiber length of 1 ?m to 300 ?m and an average aspect ratio of 3 to 200; and a thermoplastic resin and serves as a shaping material for a three-dimensional printer.
    Type: Grant
    Filed: December 18, 2020
    Date of Patent: August 8, 2023
    Assignee: OTSUKA CHEMICAL CO., LTD
    Inventors: Kousuke Inada, Masagoro Okada, Akira Takarada
  • Publication number: 20210206947
    Abstract: Provided is a resin composition, a filament and resin powder for a three-dimensional printer, a shaped object, and a production method for the shaped object, all of which make it easy to produce a shaped object and can improve, in shaping using a three-dimensional printer, the resistance to delamination of the shaped object and the resistance to warpage and shrinkage of the shaped object. A resin composition contains: inorganic fibers having an average fiber length of 1 ?m to 300 ?m and an average aspect ratio of 3 to 200; and a thermoplastic resin and serves as a shaping material for a three-dimensional printer.
    Type: Application
    Filed: March 24, 2021
    Publication date: July 8, 2021
    Applicant: OTSUKA CHEMICAL CO., LTD.
    Inventors: Kousuke Inada, Masagoro Okada, Akira Takarada
  • Publication number: 20210115226
    Abstract: Provided is a resin composition, a filament and resin powder for a three-dimensional printer, a shaped object, and a production method for the shaped object, all of which make it easy to produce a shaped object and can improve, in shaping using a three-dimensional printer, the resistance to delamination of the shaped object and the resistance to warpage and shrinkage of the shaped object. A resin composition contains: inorganic fibers having an average fiber length of 1 ?m to 300 ?m and an average aspect ratio of 3 to 200; and a thermoplastic resin and serves as a shaping material for a three-dimensional printer.
    Type: Application
    Filed: December 18, 2020
    Publication date: April 22, 2021
    Applicant: OTSUKA CHEMICAL CO., LTD
    Inventors: Kousuke Inada, Masagoro Okada, Akira Takarada
  • Publication number: 20190177510
    Abstract: Provided is a resin composition, a filament and resin powder for a three-dimensional printer, a shaped object, and a production method for the shaped object, all of which make it easy to produce a shaped object and can improve, in shaping using a three-dimensional printer, the resistance to delamination of the shaped object and the resistance to warpage and shrinkage of the shaped object. A resin composition contains: inorganic fibers having an average fiber length of 1 ?m to 300 ?m and an average aspect ratio of 3 to 200; and a thermoplastic resin and serves as a shaping material for a three-dimensional printer.
    Type: Application
    Filed: August 23, 2017
    Publication date: June 13, 2019
    Applicant: OTSUKA CHEMICAL CO., LTD.
    Inventors: Kousuke Inada, Masagoro Okada, Akira Takarada
  • Patent number: 8302237
    Abstract: A boarding bridge is provided that has an inexpensive, trouble-free, and strong construction, that eliminates the level differences between the passage portions of adjacent passage sections, and can reduce the occurrence of passengers falling and the like. In the boarding bridge (1), a proximal end tunnel (7) and a distal end tunnel (9) are telescopically fit, and are extended and retracted by moving relative to each other in a longitudinal direction.
    Type: Grant
    Filed: January 21, 2009
    Date of Patent: November 6, 2012
    Assignee: Mitsubishi Heavy Industries Transportation Equipment Engineering & Service Co., Ltd.
    Inventors: Yasuaki Shimizu, Kenji Iwamoto, Akira Takarada, Kazunori Yamane
  • Patent number: 8074315
    Abstract: It is provided a connecting portion for a boarding bridge that eliminates the level difference between the doorway portion of the aircraft and the passage, reduces the anxiety of the passengers, and can be raised and lowered smoothly.
    Type: Grant
    Filed: January 21, 2009
    Date of Patent: December 13, 2011
    Assignee: Mitsubishi Heavy Industries Transportation Equipment Engineering & Service Co., Ltd.
    Inventors: Yukio Okahira, Kenji Iwamoto, Akira Takarada
  • Publication number: 20110000029
    Abstract: A boarding bridge is provided that has an inexpensive, trouble-free, and strong construction, that eliminates the level differences between the passage portions of adjacent passage sections, and can reduce the occurrence of passengers falling and the like. In the boarding bridge (1), a proximal end tunnel (7) and a distal end tunnel (9) are telescopically fit, and are extended and retracted by moving relative to each other in a longitudinal direction.
    Type: Application
    Filed: January 21, 2009
    Publication date: January 6, 2011
    Applicant: Mitsubishi Heavy Industries Transportation Equipment Engineering & Service Co., Ltd.
    Inventors: Yasuaki Shimizu, Kenji Iwamoto, Akira Takarada, Kazunori Yamane
  • Publication number: 20100325818
    Abstract: It is provided a connecting portion for a boarding bridge that eliminates the level difference between the doorway portion of the aircraft and the passage, reduces the anxiety of the passengers, and can be raised and lowered smoothly.
    Type: Application
    Filed: January 21, 2009
    Publication date: December 30, 2010
    Applicant: Mitsubishi Heavy Industries Transportation Equipment Engineering & Service Co., Ltd.
    Inventors: Yukio Okahira, Kenji Iwamoto, Akira Takarada