Patents by Inventor Akira Takeishi
Akira Takeishi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9937881Abstract: A knuckle structure is provided with: a knuckle for rotatably supporting a drive shaft connected to the output shaft of a motor; and a grounding member having a grounding harness, the grounding member electrically connecting the knuckle and a vehicle body. The grounding member is connected to a grounding connection section provided on the protrusion of the knuckle and facing rearward of the vehicle. The grounding connection section is provided between a brake caliper extending in the front-rear direction of the vehicle and the knuckle.Type: GrantFiled: April 27, 2015Date of Patent: April 10, 2018Assignee: Honda Motor Co., Ltd.Inventors: Hiroki Tanaka, Akira Takeishi, Masahiko Komatsubara, Hiroaki Morikubo, Koichi Ono, Taro Genda
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Publication number: 20170259760Abstract: A knuckle structure is provided with: a knuckle for rotatably supporting a drive shaft connected to the output shaft of a motor; and a grounding member having a grounding harness, the grounding member electrically connecting the knuckle and a vehicle body. The grounding member is connected to a grounding connection section provided on the protrusion of the knuckle and facing rearward of the vehicle. The grounding connection section is provided between a brake caliper extending in the front-rear direction of the vehicle and the knuckle.Type: ApplicationFiled: April 27, 2015Publication date: September 14, 2017Inventors: Hiroki TANAKA, Akira TAKEISHI, Masahiko KOMATSUBARA, Hiroaki MORIKUBO, Koichi ONO, Taro GENDA
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Publication number: 20030076661Abstract: A bonding apparatus includes a bonding arm which is swayable about an axis, a horn which is fixed at the end of the bonding arm to perform ultrasonic bonding, a tool fixed on the horn, and a motor on the bonding arm at the opposite end to the horn. The bonding head both moves and bonds an electronic element.Type: ApplicationFiled: October 17, 2002Publication date: April 24, 2003Applicant: NEC CORPORATIONInventors: Kazuhito Murata, Akira Takeishi
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Patent number: 6516991Abstract: To remove the turbulence affecting the positioning control of a bonding head along the Z axis when a stage is moved in the XY direction, and to exercise accurate wire loop control, a feed forward compensator is provided for a control unit. The feed forward compensator calculates a reaction force, which is applied to a bonding head due to the acceleration generated during horizontal movement along the XY axes, based on the distance between the center of a rotary shaft and the center of gravity of the bonding arm, the mass of the bonding arm, and the acceleration generated when the XY stage is moved along the XY axes. The obtained reaction force is transmitted as a feed forward value to a controller, in order to offset the reaction force.Type: GrantFiled: October 23, 2001Date of Patent: February 11, 2003Assignee: NEC CorporationInventors: Akira Takeishi, Noriyuki Kubota
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Patent number: 6432325Abstract: An electron-emitting electrode for discharge lamps etc. uses an electron-emitting material which contains a first metal component selected from Ba, Sr and Ca and a second metal component selected from Ta, Zr, Nb, Ti and Hf and also contains oxynitride perovskite. The electron-emitting material has restrained evaporation during electric discharge and a high resistance to ion sputtering.Type: GrantFiled: March 2, 2000Date of Patent: August 13, 2002Assignee: TDK CorporationInventors: Munemitsu Hamada, Akira Takeishi, Makoto Takahashi, Dai Matsuoka, Masatada Yodogawa, Hiraku Harada
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Patent number: 6425801Abstract: A polishing process monitoring apparatus of a semiconductor wafer is provided, which is capable of monitoring correctly the process independent of various factors affecting optical measurement, such as the configuration, material, and size of a layered structure on the wafer, and the geometric shapes of patterns and their arrangement for respective semiconductor chips.Type: GrantFiled: June 1, 1999Date of Patent: July 30, 2002Assignee: NEC CorporationInventors: Akira Takeishi, Hideo Mitsuhashi, Katsuhisa Ohkawa, Yoshihiro Hayashi, Takahiro Onodera
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Patent number: 6383416Abstract: An electron-emitting material contains a first metal component selected from Ba, Sr and Ca and a second metal component selected from Ta, Zr, Nb, Ti and Hf and also contains oxynitride perovskite. The electron-emitting material has improved electron emission characteristics, restrained evaporation at elevated temperatures, and minimized consumption by ion sputtering. The electron-emitting material is prepared by firing a metal component-containing raw material disposed in proximity to carbon in a nitrogen gas-containing atmosphere to thereby create oxynitride perovskite.Type: GrantFiled: March 2, 2000Date of Patent: May 7, 2002Assignee: TDK CorporationInventors: Munemitsu Hamada, Akira Takeishi, Makoto Takahashi, Dai Matsuoka, Masatada Yodogawa, Hiraku Harada
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Publication number: 20020050507Abstract: To remove the turbulence affecting the positioning control of a bonding head along the Z axis when a stage is moved in the XY direction, and to exercise accurate wire loop control, a feed forward compensator is provided for a control unit. The feed forward compensator calculates a reaction force, which is applied to a bonding head due to the acceleration generated during horizontal movement along the XY axes, based on the distance between the center of a rotary shaft and the center of gravity of the bonding arm, the mass of the bonding arm, and the acceleration generated when the XY stage is moved along the XY axes. The obtained reaction force is transmitted as a feed forward value to a controller, in order to offset the reaction force.Type: ApplicationFiled: October 23, 2001Publication date: May 2, 2002Applicant: NEC CORPORATIONInventors: Akira Takeishi, Noriyuki Kubota
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Patent number: 5982088Abstract: A ceramic cathode fluorescent discharge lamp is provided including a pair of electrodes, a bulb plated with a fluorescent body on an inner surface of same, at least one of said pair of electrodes being a ceramic cathode having a bottomed cylindrical housing including an electron emission material of an aggregate type porous structure of conductive oxide having a first component consisting of at least one of Ba, Sr, and Ca, a second component consisting of at least one of Zr and Ti, and a third component consisting of at least one of Ta and Nb, said aggregate type porous structure having a surface plated with a conductive or semiconductive layer of at least one of carbide, nitride and oxide of Ta or Nb, rare gas being sealed in said bulb, and sealing pressure of said rare gas being in the range between 10 Torr and 170 Torr.Type: GrantFiled: November 13, 1997Date of Patent: November 9, 1999Assignee: TDK CorporationInventors: Munemitsu Hamada, Akira Takeishi, Haruo Taguchi, Takeshi Masuda, Yasutoshi Yamaguchi
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Patent number: 4885816Abstract: A washing apparatus, particularly for use on airplanes, comprising a carriage, a support, a mechanism connecting the carriage with the support for moving the support up and down on the carriage, a swing arm extending generally horizontally, a frame pivotably mounted on the swing arm and extending upwardly from the swing arm, a brush rotatably mounted on the upper end of the frame, and a mechanism connecting the swing arm to the support for swinging movement of the swing arm on the support. The apparatus may further include a cover at least partially surrounding the brush.Type: GrantFiled: August 4, 1988Date of Patent: December 12, 1989Assignees: Kawasaki Jukogyo Kabushiki, Japan Air Lines Co., Ltd.Inventors: Masayuki Hashimoto, Manabu Sakamoto, Taizo Tsutsui, Satoshi Satoh, Yukihiko Kouza, Keikichi Murakami, Tonokatsu Soga, Akira Takeishi, Teruhiko Takusagawa, Misao Hayashi