Abstract: A light emitting diode package comprising a substrate electrically connectable to an external unit with a reduced height. A flexible PCB for electrical connection between a light emitting diode and the external unit is directly connected to a light emitting element. The direct connection is conducted by applying a conductive resin to an electrode on the flexible PCB, on which the light emitting element is mounted; mounting the light emitting element; curing the conductive resin in a high-temperature furnace. The present invention requires neither a lead frame for electrical connection of the light emitting element to the flexible PCB nor a rigid PCB for supporting the flexible PCB, thus reducing the total height of the light emitting diode package.

Abstract: A socket in which a light-emitting diode can be attached and detached as needed close to the structure for holding a camera module. Socket comprises a spring contact part for contacting the leads or electrodes of the light-emitting diode, and an anchor for anchoring such that the direction of a dome section has a predetermined relationship with the camera module.

Abstract: A Light-emitting diode which comprises a pair of metal plate leads connected to a light-emitting element. The pair of metal plate leads comprise, at the edges of the metal plates, surface mounting-type connecting parts that connect facing the pads of a circuit substrate. Furthermore, the light-emitting diode comprises a support member that has a part, other than leads, that contacts the circuit substrate so that it can be positioned on the circuit substrate with stability during the reflow process.

Abstract: A light-emitting device which comprises as one unit a semiconductor light-emitting element; a first liquid for condensing the light from the semiconductor light-emitting element; a second liquid that is separate from but contacts the first liquid; an airtight space in which at least first liquid and second liquid are disposed; and first and second electrodes to which voltage is applied so as to change the shape of the interface between first liquid and second liquid and adjust the condensed state of the light from semiconductor light-emitting element.

Abstract: A light emitting diode comprises light-emitting elements inside a cup structure and a lens part that condenses the light from these elements. Light-emitting element placed at the center along the optical axis of the lens emits an outgoing beam of light with a narrow directional angle along this optical axis, and light-emitting element placed away from the optical axis emits an outgoing beam of light in an oblique direction. The light-emitting elements are individually turned on and off in accordance with the distance of the subject to be photographed.

Abstract: It is to be made easy to arrange light emitting diodes, each including a lens having a hemispherical light emitting surface, and cover the base of the light emitting diodes with resin material. A light emitting diode 1 has a light emitting element 2, a lead section 3 that supplies power to the light emitting element 2, a base 4 that covers the lead section 3, a lens 5 having a convex light emitting surface and connected to the base 4 to cover the light emitting element 2, and a step section 6 disposed such that it surrounds the outer side of the lens 5, part of the step 6 having a different width. The step section 6 has a height that defines the amount of resin material enough to cover the lead section 3. There is also provided a light emitting diode display device 10 using a plurality of such light emitting diodes.

Abstract: [Problem to be Solved]It is to be made easy to arrange light emitting diodes, each including a lens having a hemispherical light emitting surface, and cover the base of the light emitting diodes with resin material. [Solution] A light emitting diode 1 has a light emitting element 2, a lead section 3 that supplies power to the light emitting element 2, a base 4 that covers the lead section 3, a lens 5 having a convex light emitting surface and connected to the base 4 to cover the light emitting element 2, and a step section 6 disposed such that it surrounds the outer side of the lens 5, part of the step 6 having a different width. The step section 6 has a height that defines the amount of resin material enough to cover the lead section 3. There is also provided a light emitting diode display device 10 using a plurality of such light emitting diodes.

Abstract: A light emitting diode package comprising a substrate electrically connectable to an external unit with a reduced height. A flexible PCB for electrical connection between a light emitting diode and the external unit is directly connected to a light emitting element. The direct connection is conducted by applying a conductive resin to an electrode on the flexible PCB, on which the light emitting element is mounted; mounting the light emitting element; curing the conductive resin in a high-temperature furnace. The present invention requires neither a lead frame for electrical connection of the light emitting element to the flexible PCB nor a rigid PCB for supporting the flexible PCB, thus reducing the total height of the light emitting diode package.

Abstract: In one embodiment, an opto-electronic package includes a substrate, a cavity, mounting pads and transverse walls interspersed along the cavity, pads separated by transverse walls, and transverse walls being lower than cavity-defining walls; and LED dice mounted to the pads. In another embodiment, a system is disclosed for backlighting an LCD screen. The system includes an opto-electronic package having a substrate; LED dice mounted to the substrate; an encapsulant disposed over LED dice; and a light guide having an input portion to receive light provided by LED dice, the input portion in attachment to encapsulant, and an output portion configured to transmit light to LCD screen. In yet another embodiment, a method of manufacturing an opto-electronic package includes: fabricating a substrate; attaching LED dice to the substrate; electrically connecting each LED dice to an outer portion of the substrate; and disposing encapsulant over the LED dice.

Abstract: In an embodiment, there is disclosed an opto-electronic package, comprising a substrate, a plurality of light emitting diode (LED) dice, and at least one lens disposed between the cavity-defining walls and having a maximum height remaining within an aperture of an elongate cavity of the substrate. In an embodiment, there is disclosed a system for backlighting an LCD screen, the system comprising an opto-electronic package and a light guide. A method of manufacturing an opto-electronic package is disclosed, the method comprising fabricating a substrate, attaching a plurality of light emitting diode (LED) dice to the base of the substrate within the cavity, and disposing at least one lens between the cavity-defining walls and entirely within the aperture of the elongate cavity.

Abstract: A light-emitting diode with no fluctuations in optical properties and good sealing properties, and a simple production method for producing this light-emitting diode. The light-emitting diode has a base comprising a cup part on which the light-emitting diode is placed, a resin material introduced into cup part, and a lens member placed on top of a cup for focusing light emitted by a light-emitting diode chip. A layer of fluorescent material, which converts the wavelength of at least some of the light from the light-emitting diode chip, is applied to the inner convex face of the lens member. When the lens member is attached to the base, the inner convex face deforms the resin material and air and excess resin material can be pushed to the outside.

Abstract: In one embodiment, an opto-electronic package includes a substrate, a cavity, mounting pads and transverse walls interspersed along the cavity, pads separated by transverse walls, and transverse walls being lower than cavity-defining walls; and LED dice mounted to the pads. In another embodiment, a system is disclosed for backlighting an LCD screen. The system includes an opto-electronic package having a substrate; LED dice mounted to the substrate; an encapsulant disposed over LED dice; and a light guide having an input portion to receive light provided by LED dice, the input portion in attachment to encapsulant, and an output portion configured to transmit light to LCD screen. In yet another embodiment, a method of manufacturing an opto-electronic package includes: fabricating a substrate; attaching LED dice to the substrate; electrically connecting each LED dice to an outer portion of the substrate; and disposing encapsulant over the LED dice.

Abstract: A light-emitting device which comprises as one unit a semiconductor light-emitting element; a first liquid for condensing the light from the semiconductor light-emitting element; a second liquid that is separate from but contacts the first liquid; an airtight space in which at least first liquid and second liquid are disposed; and first and second electrodes to which voltage is applied so as to change the shape of the interface between first liquid and second liquid and adjust the condensed state of the light from semiconductor light-emitting element.

Abstract: A light-emitting diode with no fluctuations in optical properties and good sealing properties, and a simple production method for producing this light-emitting diode. The light-emitting diode has a base comprising a cup part on which the light-emitting diode is placed, a resin material introduced into cup part, and a lens member placed on top of a cup for focusing light emitted by a light-emitting diode chip. A layer of fluorescent material, which converts the wavelength of at least some of the light from the light-emitting diode chip, is applied to the inner convex face of the lens member. When the lens member is attached to the base, the inner convex face deforms the resin material and air and excess resin material can be pushed to the outside.

Abstract: A light emitting diode comprises light-emitting elements inside a cup structure and a lens part that condenses the light from these elements. Light-emitting element placed at the center along the optical axis of the lens emits an outgoing beam of light with a narrow directional angle along this optical axis, and light-emitting element placed away from the optical axis emits an outgoing beam of light in an oblique direction. The light-emitting elements are individually turned on and off in accordance with the distance of the subject to be photographed.

Abstract: A Light-emitting diode which comprises a pair of metal plate leads connected to a light-emitting element. The pair of metal plate leads comprise, at the edges of the metal plates, surface mounting-type connecting parts that connect facing the pads of a circuit substrate. Furthermore, the light-emitting diode comprises a support member that has a part, other than leads, that contacts the circuit substrate so that it can be positioned on the circuit substrate with stability during the reflow process.

Abstract: A socket in which a light-emitting diode can be attached and detached as needed close to the structure for holding a camera module. Socket comprises a spring contact part for contacting the leads or electrodes of the light-emitting diode, and an anchor for anchoring such that the direction of a dome section has a predetermined relationship with the camera module.

Abstract: A light-emitting diode having a first lead with a cup part in which a light-emitting element is held, a second lead in juxtaposition with the first lead, and a resin molding enclosing the tips of first and second leads. Flag-shaped protrusions are formed in the middle of first and second leads. The region from the cup part of first lead to flag-shaped protrusion is relatively wide and continuous and concave parts are formed along the side edges at a height near the bottom end of cup part of first lead.

Abstract: A light-emitting diode includes a cup component, a plurality of electrical conducting traces formed on a surface of the cup component using an MID means, a light-emitting diode chip mounted on the cup component and electrically connected to at least a first and second electrical conducting trace of the plurality of electrical conducting traces, and a first connection part connected to at least the first and second electrical conducting traces for providing electrical connections to external circuitry. The light emitting diode may also include a protective element that electrically protects the light-emitting diode chip, and the connection part may include first and second leads connected electrically to the first and second electrical conducting traces, respectively. The cup component, light emitting diode chip, protective element, leads and other components may be assembled together and molded and sealed with resin.

Abstract: A light-emitting diode with which the LED chip will not be destroyed comprises an LED chip 40 mounted on plate-shaped wiring means 60 inside a light-emitting diode. Wiring means 60 comprises conductive paths 61 and 62 that electrically lead to a pair of opposing surfaces. The top surface is used for mounting the LED chip. Part of the conductive paths 61, 62 are connected electrically to LED chip 40, extending from the position where the LED is mounted to leads 21 and 22, to which they are connected by soldering. LED chip 40 is supported by being held inside concave part 23 in one lead 21 at this time.