Patents by Inventor Akira Tokuhiro

Akira Tokuhiro has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patterning of Substrates with Metal-Containing Particles
    Publication number: 20070134902
    Abstract: The present invention relates to process for patterning metal-containing particles on or in a substrate. The present invention also relates to a non-etched substrate having metal-containing particles patterned thereon.
    Type: Application
    Filed: December 8, 2006
    Publication date: June 14, 2007
    Applicant: THE CURATORS OF THE UNIVERSITY OF MISSOURI
    Inventors: Massimo Bertino, Nicholas Leventis, Akira Tokuhiro, Guohui Zhang