Patents by Inventor Akira Torigoe

Akira Torigoe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Contact
    Patent number: 10317290
    Abstract: A contact preventing a plurality of current paths joining together and having a contact main body having a wire fixing portion and a contacting member which is a member formed separately from the contact main body is provided. The contact has a contact main body having a wire fixing portion to which a wire is fixed and a contacting member formed separately from the contact main body and configured to be connected to the wire and contact with a mating contact. A portion of the contact main body, contacting with the contacting member has an insulation layer.
    Type: Grant
    Filed: July 19, 2017
    Date of Patent: June 11, 2019
    Assignee: Tyco Electronics Japan G.K.
    Inventors: Keita Terajima, Eiichiro Takemasa, Akira Torigoe
  • Contact
    Publication number: 20180024012
    Abstract: A contact preventing a plurality of current paths joining together and having a contact main body having a wire fixing portion and a contacting member which is a member formed separately from the contact main body is provided. The contact has a contact main body having a wire fixing portion to which a wire is fixed and a contacting member formed separately from the contact main body and configured to be connected to the wire and contact with a mating contact. A portion of the contact main body, contacting with the contacting member has an insulation layer.
    Type: Application
    Filed: July 19, 2017
    Publication date: January 25, 2018
    Applicant: Tyco Electronics Japan G.K.
    Inventors: Keita Terajima, Eiichiro Takemasa, Akira Torigoe
  • Glass wiring board
    Patent number: 9148953
    Abstract: A glass wiring board is provided that includes a glass substrate and a primer layer. The prime layer is disposed on the glass substrate and includes an intermediate layer and a copper plating layer disposed on the intermediate layer. The intermediate layer includes a resin coupling agent and a metal element dispersed in the resin coupling agent.
    Type: Grant
    Filed: October 4, 2013
    Date of Patent: September 29, 2015
    Assignee: Tyco Electronics Japan G.K.
    Inventors: Katsunori Fukuda, Akira Torigoe
  • Glass Wiring Board
    Publication number: 20140097005
    Abstract: A glass wiring board is provided that includes a glass substrate and a primer layer. The prime layer is disposed on the glass substrate and includes an intermediate layer and a copper plating layer disposed on the intermediate layer. The intermediate layer includes a resin coupling agent and a metal element dispersed in the resin coupling agent.
    Type: Application
    Filed: October 4, 2013
    Publication date: April 10, 2014
    Applicant: Tyco Electronics Japan G. K.
    Inventors: Katsunori Fukuda, Akira Torigoe