Patents by Inventor Akira UMISE

Akira UMISE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11268168
    Abstract: The present invention provides an artifactless superelastic alloy including a Au—Cu—Al alloy, the superelastic alloy containing Cu in an amount of 20 atom % or more and 40 atom % or less, Al in an amount of 15 atom % or more and 25 atom % or less, and Au as a balance, the superelastic alloy having a bulk magnetic susceptibility of ?24 ppm or more and 6 ppm or less. The Ni-free superelastic alloy of the present invention is capable of exhibiting superelasticity in a normal temperature range, and hardly generated artifacts in a magnetic field environment. The alloy can be produced by setting a casting time in a melting and casting step to a fixed time, and hot-pressing an alloy after casting to make material structures homogeneous.
    Type: Grant
    Filed: August 9, 2018
    Date of Patent: March 8, 2022
    Assignees: TOKYO INSTITUTE OF TECHNOLOGY, TANAKA KIKINZOKU KOGYO K.K.
    Inventors: Hideki Hosoda, Akira Umise, Kenji Goto
  • Publication number: 20210010120
    Abstract: The present invention provides a shape-memory alloy including a Au—Cu—Al alloy having 20 at % or more and 40 at % or less Cu and 15 at % or more and 30 at % or less Al, with the balance being Au and inevitable impurities. The shape-memory alloy has a Vickers hardness of 360 Hv or less. The Au—Cu—Al alloy of the present invention is an alloy capable of developing both biocompatibility and a shape-memory effect, and further capable of achieving artifactlessness in a magnetic environment. The Au—Cu—Al alloy can be produced by heat-treating a clad material formed of a combination of a hollow material made of a Au—Cu alloy and a core material made of metallic Al at 500° C. or more and 700° C. or less.
    Type: Application
    Filed: February 28, 2019
    Publication date: January 14, 2021
    Applicants: TOKYO INSTITUTE OF TECHNOLOGY, TANAKA KIKINZOKU KOGYO K.K.
    Inventors: Hideki HOSODA, Akira UMISE, Kenji GOTO
  • Publication number: 20200190628
    Abstract: The present invention provides an artifactless superelastic alloy including a Au—Cu—Al alloy, the superelastic alloy containing Cu in an amount of 20 atom % or more and 40 atom % or less, Al in an amount of 15 atom % or more and 25 atom % or less, and Au as a balance, the superelastic alloy having a bulk magnetic susceptibility of ?24 ppm or more and 6 ppm or less. The Ni-free superelastic alloy of the present invention is capable of exhibiting superelasticity in a normal temperature range, and hardly generated artifacts in a magnetic field environment. The alloy can be produced by setting a casting time in a melting and casting step to a fixed time, and hot-pressing an alloy after casting to make material structures homogeneous.
    Type: Application
    Filed: August 9, 2018
    Publication date: June 18, 2020
    Applicants: TOKYO INSTITUTE OF TECHNOLOGY, TANAKA KIKINZOKU KOGYO K.K.
    Inventors: Hideki HOSODA, Akira UMISE, Kenji GOTO
  • Patent number: 10590519
    Abstract: The present invention provides a superelastic alloy formed by addition of Fe or Co to an Au—Cu—Al alloy, including: Cu of 12.5% by mass or more and 16.5% by mass or less; Al of 3.0% by mass or more and 5.5% by mass or less; Fe or Co of 0.01% by mass or more and 2.0% by mass or less; and a balance Au, and a difference between Al content and Cu content (Cu—Al) is 12% by mass or less. The superelastic alloy according to the present invention has superelastic property while being Ni-free, excellent X-ray imaging property, processability, and strength property, and is suitable for a medical field.
    Type: Grant
    Filed: August 29, 2014
    Date of Patent: March 17, 2020
    Assignees: TANAKA KIKINZOKU KOGYO K.K., TOKYO INSTITUTE OF TECHNOLOGY
    Inventors: Hideki Hosada, Tomonari Inamura, Masaki Tahara, Tomohiko Morita, Akira Umise, Yusuke Doi, Kenji Goto
  • Publication number: 20160362772
    Abstract: The present invention provides a superelastic alloy formed by addition of Fe or Co to an Au—Cu—Al alloy, including: Cu of 12.5% by mass or more and 16.5% by mass or less; Al of 3.0% by mass or more and 5.5% by mass or less; Fe or Co of 0.01% by mass or more and 2.0% by mass or less; and a balance Au, and a difference between Al content and Cu content (Cu—Al) is 12% by mass or less. The superelastic alloy according to the present invention has superelastic property while being Ni-free, excellent X-ray imaging property, processability, and strength property, and is suitable for a medical field.
    Type: Application
    Filed: August 29, 2014
    Publication date: December 15, 2016
    Inventors: Hideki HOSADA, Tomonari INAMURA, Masaki TAHARA, Tomohiko MORITA, Akira UMISE, Yusuke DOI, Kenji GOTO