Abstract: It is determined whether the importance of an object storage node is equal to or larger than a predetermined importance and the reliability of the object storage node is equal to or larger than a predetermined reliability, the object storage node being a storage node set as an object among N storage nodes that are members of a storage cluster, N being an integer equal to or larger than 3. When the determination result is true, reintegration of the object storage node is performed. The importance of the object storage node depends on highness of availability when assuming that the object storage node has left the storage cluster. The reliability of the object storage node depends on the tendency of operation of the object storage node.

Abstract: It is determined whether the importance of an object storage node is equal to or larger than a predetermined importance and the reliability of the object storage node is equal to or larger than a predetermined reliability, the object storage node being a storage node set as an object among N storage nodes that are members of a storage cluster, N being an integer equal to or larger than 3. When the determination result is true, reintegration of the object storage node is performed. The importance of the object storage node depends on highness of availability when assuming that the object storage node has left the storage cluster. The reliability of the object storage node depends on the tendency of operation of the object storage node.

Abstract: A dielectric film for a printed wiring board that has excellent heat resistance, moisture resistance, insulation properties, adhesiveness, ease of handling, ease of processing, and the like, and possesses low elasticity and high elongation as stress relief functions. The dielectric film has drawn porous polytetrafluoroethylene used as the base material; this is impregnated with an adhesive or fusible resin; the post-solidification tensile modulus of elasticity is 0.1 to 1.8 GPa; and the tensile elongation at break (at 25° C.) is at least 4.0%. A semiconductor device, comprising a multilayer printed board having a plurality of circuit layers, and a semiconductor element mounted on the multilayer printed board, this semiconductor device having an insulating/adhesive layer with a stress relief function between the outermost circuit layer of the multilayer board on the side of the semiconductor element, and the circuit layer adjacent thereto; and the insulating/adhesive layer is formed from the dielectric film.

Abstract: A dielectric film for a printed wiring board that has excellent heat resistance, moisture resistance, insulation properties, adhesiveness, ease of handling, ease of processing, and the like, and possesses low elasticity and high elongation as stress relief functions. The dielectric film has drawn porous polytetrafluoroethylene used as the base material; this is impregnated with an adhesive or fusible resin; the post-solidification tensile modulus of elasticity is 0.1 to 1.8 GPa; and the tensile elongation at break (at 25° C.) is at least 4.0%.

Abstract: A prepreg, provided with adhesiveness or fusibility and configured such that voids in a porous polytetrafluoroethylene film are filled with a bromine-free flame-resistant resin composition, wherein this prepreg is such that the bromine content of the resin is 0.09 weight % or less.

Abstract: A printed circuit board assembly having a coverlay film which is a composite film consisting of a porous fluoropolymer film coated with a thermoplastic or heat-curing adhesive is disclosed. The coverlay film has excellent conformability and adhesion to the printed circuit board and low dielectric constant.

Abstract: A resin-sealed semiconductor device, including a chip mounting die pad, porous fluorocarbon material located just beneath the die pad, beneath a die-pad supporting layer, gold lead wires, or in a sealing resin surrounding the other components, wherein any water vapor generated by the heat of soldering will be held within the porous fluorocarbon rather than crack the sealant under internal pressure.

Abstract: A resin-sealed semiconductor device, including a chip mounting die pad, porous fluorocarbon material located just beneath the die pad, beneath a die-pad supporting layer, gold lead wires, or in a sealing resin surrounding the other components, wherein any water vapor generated by the heat of soldering will be held within the porous fluorocarbon rather than crack the sealant under internal pressure.

Abstract: A process and apparatus for automatically weighing and introducing chemicals are intended to automatically weigh the chemicals and introduce the chemicals into a treatment tank; the chemicals are injected into a chemical container and weighted, and then transported to a dissolving tank adjunct to the treatment tank, and then introduced into the dissolving tank. A control means is provided to put under its control the operations of injecting into a chemical container a desired amount of desired chemicals selected from among plural sorts of chemicals and driving a transportments and an introducing means automatically in association with this injecting operation.