Patents by Inventor Akira UTA
Akira UTA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11970580Abstract: A room-temperature-curable organopolysiloxane composition for an oil seal, wherein an organosilane compound containing a specific organo-oxymethyl group and represented by formula (1) below and/or a partial hydrolysis condensate of said compound is used as a curing agent (crosslinking agent), and an organic compound having a guanidine skeleton is added in combination as a curing catalyst. In the formula, each R1 is independently a C1-12 unsubstituted or substituted monovalent hydrocarbon group, R2 is a C1-12 unsubstituted or substituted monovalent hydrocarbon group, Y is a hydrolyzable group, and n is 0, 1 or 2.Type: GrantFiled: March 26, 2020Date of Patent: April 30, 2024Assignee: SHIN-ETSU CHEMICAL CO., LTD.Inventors: Akira Uta, Shigeki Yasuda, Tetsuro Yamada, Munenao Hirokami, Taiki Katayama, Takafumi Sakamoto
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Publication number: 20240101762Abstract: This two-component type room temperature fast-curing organopolysiloxane composition: includes a first agent containing, at a specific ratio, (A) a specific structure organopolysiloxane having a silanol group or a hydrolyzable silyl group at molecular chain ends thereof, (B) a hydrolyzable organosilane compound and/or a partially hydrolyzed condensate thereof that releases a cyclic ketone compound as a leaving group (leaving substance) by hydrolysis, and (C) a curing catalyst; and a second agent containing, in a specific amount, (A?) a specific structure organopolysiloxane having a silanol group at molecular chain ends thereof; and has more excellent hardenability than one-component type room temperature-curing organopolysiloxane compositions. This composition leaves or releases a cyclic ketone compound such as cyclobutanone or cyclopentanone as a leaving group (leaving compound) at the time of curing, and thus solves hazard or safety problems with respect to human bodies or environments.Type: ApplicationFiled: January 18, 2022Publication date: March 28, 2024Applicant: SHIN-ETSU CHEMICAL CO., LTD.Inventors: Akira UTA, Takafumi SAKAMOTO
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Publication number: 20240002606Abstract: The present invention provides: a room temperature curable organopolysiloxane composition which has curability equivalent to the curability of conventional dealcoholization type or deoximation type room temperature curable organopolysiloxane compositions even if various catalysts are used therefor, while reducing harmful effects on human bodies and burden on the environment, and which enables the achievement of a cured product that has good rubber properties, adhesiveness and durability if cured; various articles which comprise this composition or a cured product that is obtained by curing this composition; a novel hydrolyzable organosilane compound which is useful as a curing agent for this composition; and a method for producing this novel hydrolyzable organosilane compound.Type: ApplicationFiled: August 16, 2021Publication date: January 4, 2024Applicant: SHIN-ETSU CHEMICAL CO., LTD.Inventor: Akira UTA
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Patent number: 11834556Abstract: This organopolysiloxane composition, when cured at room temperature by moisture in the atmosphere, provides a silicone rubber cured product having good self-adhesiveness to a magnesium alloy. The organopolysiloxane composition contains (A) an organopolysiloxane having a hydroxy group and/or a hydrolysable silyl group at both ends of the molecular chain, (B) an organic silicon compound other than (A) and (C), having at least three hydrolysable groups bonded to a silicon atom per molecule, and/or a partial hydrolysis-condensation product thereof, and (C) a silane coupling agent having a specific molecular structure having a carboxylic acid silyl ester bond. Furthermore, a novel compound, having an alkoxysilyl group and a carboxylic acid silyl ester group per molecule, can have improved adhesiveness/bonding properties with respect to a base material due to the effect of carboxylic acid after hydrolysis thereof.Type: GrantFiled: March 30, 2022Date of Patent: December 5, 2023Assignee: SHIN-ETSU CHEMICAL CO., LTD.Inventors: Akira Uta, Takafumi Sakamoto
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Publication number: 20230183483Abstract: This thermally conductive silicone composition contains: (A) 100 parts by mass of a diorganopolysiloxane which has a hydroxyl group or hydrolyzable group at both terminals of the molecular chain thereof; (B) 150-600 parts by mass of a hydrolyzable organopolysiloxane which has a specific hydrolyzable silyl group; (C) 0.1-100 parts by mass of a crosslinking agent component; (D) 1,500-6,500 parts by mass of zinc oxide particles which have an average particle diameter of 0.1-2 µm and in which, among the particles, the content of coarse grains having a particle diameter of 10 µm or more is 1 vol% or less relative to the total amount of component (D), as measured by the laser diffraction particle size distribution method; (E) 0.01-30 parts by mass of an adhesion promoter; and (F) 0.01-20 parts by mass of a pH indicator, wherein the thermal conductivity at 25° C. as measured by the hot disk method is 0.5 W/mK or more.Type: ApplicationFiled: May 11, 2021Publication date: June 15, 2023Applicant: Shin-Etsu Chemical Co., Ltd.Inventors: Takahiro YAMAGUCHI, Akira UTA, Takafumi SAKAMOTO
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Patent number: 11518884Abstract: A room-temperature-curable organopolysiloxane composition; a structure obtained from the composition; and a method for assessing the cured state of the composition are provided. The room-temperature-curable organopolysiloxane composition, which changes in color with the progress of curing from the uncured state, comprises the following ingredients: (A) 100 parts by mass of one or more organopolysiloxanes represented by formula (1) HO(SiR2O)nH??(1) and/or formula (2) (with variables as defined herein); (B) 0.1-50 parts by mass of an organosilicon compound having at least three silicon-atom-bonded hydrolyzable groups in the molecule, which is not any of ingredients (A), (C), and (D), and/or a product of the partial hydrolytic condensation of the organosilicon compound; (C) 0.01-20 parts by mass of a curing catalyst; (D) 0.1-10 parts by mass of a silane coupling agent; and (E) 0.01-10 parts by mass of a pH indicator.Type: GrantFiled: December 27, 2018Date of Patent: December 6, 2022Assignee: SHIN-ETSU CHEMICAL CO., LTD.Inventors: Akira Uta, Takafumi Sakamoto
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Patent number: 11401419Abstract: This dealcoholization room-temperature curable organopolysiloxane composition contains (A) a diorganopolysiloxane having a silicon atom-bonded hydroxy group and/or a hydrolyzable silyl group at both ends of the molecular chain, and has a coefficient of viscosity of 20-1,000,000 mPa·s, (B) an organopolysiloxane which is a partial (co-)hydrolysis-condensation product of a hydrolyzable organosilane compound having one or more silicon atom-bonded alkenyl groups and 1-3 silicon atom-bonded alkoxy groups, per molecule, (C) a hydrolyzable organosilane compound having one or more phenylene backbones and two or more amino groups, per molecule, and/or a partial hydrolysis-condensation product thereof.Type: GrantFiled: June 16, 2017Date of Patent: August 2, 2022Assignee: SHIN-ETSU CHEMICAL CO., LTD.Inventors: Akira Uta, Takafumi Sakamoto
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Publication number: 20220220260Abstract: This organopolysiloxane composition, when cured at room temperature by moisture in the atmosphere, provides a silicone rubber cured product having good self-adhesiveness to a magnesium alloy. The organopolysiloxane composition contains (A) an organopolysiloxane having a hydroxy group and/or a hydrolysable silyl group at both ends of the molecular chain, (B) an organic silicon compound other than (A) and (C), having at least three hydrolysable groups bonded to a silicon atom per molecule, and/or a partial hydrolysis-condensation product thereof, and (C) a silane coupling agent having a specific molecular structure having a carboxylic acid silyl ester bond. Furthermore, a novel compound, having an alkoxysilyl group and a carboxylic acid silyl ester group per molecule, can have improved adhesiveness/bonding properties with respect to a base material due to the effect of carboxylic acid after hydrolysis thereof.Type: ApplicationFiled: March 30, 2022Publication date: July 14, 2022Applicant: SHIN-ETSU CHEMICAL CO., LTD.Inventors: Akira UTA, Takafumi SAKAMOTO
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Publication number: 20220162393Abstract: A room-temperature-curable organopolysiloxane composition for an oil seal, wherein an organosilane compound containing a specific organo-oxymethyl group and represented by formula (1) and/or a partial hydrolysis condensate of said compound is used as a curing agent (crosslinking agent), and an organic compound having a guanidine skeleton is added in combination as a curing catalyst. (In the formula, each R1 is independently a C1-12 unsubstituted or substituted monovalent hydrocarbon group, R2 is a C1-12 unsubstituted or substituted monovalent hydrocarbon group, Y is a hydrolyzable group, and n is 0, 1 or 2.) It is thus possible to obtain a cured product having good rubber properties, adhesiveness, and engine oil resistance after curing even without containing a metal-based catalyst.Type: ApplicationFiled: March 26, 2020Publication date: May 26, 2022Applicant: SHIN-ETSU CHEMICAL CO., LTD.Inventors: Akira UTA, Shigeki YASUDA, Tetsuro YAMADA, Munenao HIROKAMI, Taiki KATAYAMA, Takafumi SAKAMOTO
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Patent number: 11319413Abstract: This organopolysiloxane composition, when cured at room temperature by moisture in the atmosphere, provides a silicone rubber cured product having good self-adhesiveness to a magnesium alloy. The organopolysiloxane composition contains (A) an organopolysiloxane having a hydroxy group and/or a hydrolysable silyl group at both ends of the molecular chain, (B) an organic silicon compound other than (A) and (C), having at least three hydrolysable groups bonded to a silicon atom per molecule, and/or a partial hydrolysis-condensation product thereof, and (C) a silane coupling agent having a specific molecular structure having a carboxylic acid silyl ester bond. Furthermore, a novel compound, having an alkoxysilyl group and a carboxylic acid silyl ester group per molecule, can have improved adhesiveness/bonding properties with respect to a base material due to the effect of carboxylic acid after hydrolysis thereof.Type: GrantFiled: October 9, 2018Date of Patent: May 3, 2022Assignee: SHIN-ETSU CHEMICAL CO., LTD.Inventors: Akira Uta, Takafumi Sakamoto
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Publication number: 20220106514Abstract: This room temperature-curable composition contains: (A) a prescribed polyoxyalkylene compound which has two reactive silicon groups (silyl groups having 1 hydroxy group or 1-3 organo-oxy groups) per molecule, with one reactive silicon group at each molecular chain terminal, and in which the main chain is a prescribed polyoxyalkylene-based polymer; (B) an inorganic filler; (C) a hydrolyzable (organo)silane compound and/or a partial hydrolytic condensation product thereof as a curing agent; (D) a silane coupling agent; and (E) a curing catalyst. Produced by this configuration is a cured product which exhibits excellent silicone oil resistance, excellent curing properties and good elongation and adhesive properties.Type: ApplicationFiled: January 16, 2020Publication date: April 7, 2022Applicant: SHIN-ETSU CHEMICAL CO., LTD.Inventors: Akira UTA, Taiki KATAYAMA, Takafumi SAKAMOTO
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Patent number: 11142612Abstract: Provided is a thermoplastic elastomer comprising a mesogen-silicon compound (co)polymer which is represented by formula (1) below and has a number average molecular weight of 1,000-500,000. The thermoplastic elastomer has transparency and rubber properties (rubber elasticity) and can be (repeatedly) molded thermally and reversibly, and thus can be suitably used in potting materials or various sealing materials. In formula (1), Ar represents a mesogenic group selected from among structures represented by formula (2) below, a represents an integer of 0.5-1, b represents a number of 0-0.5 (a and b respectively represent the ratio of the number of respective repeating units to the sum of all the repeating units in the molecule, and a+b=1), R1 is a monovalent hydrocarbon group that does not contain a C1-8 aliphatic unsaturated bond, and R2 is a hydrogen atom, —Si(CH3)3, —Si(CH3)2(OH), —Si(CH3)2(CH?CH2) or —Si(CH3)2(CH2—CH?CH2).Type: GrantFiled: January 16, 2018Date of Patent: October 12, 2021Assignee: SHIN-ETSU CHEMICAL CO., LTD.Inventors: Akira Uta, Kumiko Hayashi, Tomoki Akiba
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Publication number: 20210206924Abstract: This organopolysiloxane composition, when cured at room temperature by moisture in the atmosphere, provides a silicone rubber cured product having good self-adhesiveness to a magnesium alloy. The organopolysiloxane composition contains (A) an organopolysiloxane having a hydroxy group and/or a hydrolysable silyl group at both ends of the molecular chain, (B) an organic silicon compound other than (A) and (C), having at least three hydrolysable groups bonded to a silicon atom per molecule, and/or a partial hydrolysis-condensation product thereof, and (C) a silane coupling agent having a specific molecular structure having a carboxylic acid silyl ester bond. Furthermore, a novel compound, having an alkoxysilyl group and a carboxylic acid silyl ester group per molecule, can have improved adhesiveness/bonding properties with respect to a base material due to the effect of carboxylic acid after hydrolysis thereof.Type: ApplicationFiled: October 9, 2018Publication date: July 8, 2021Applicant: SHIN-ETSU CHEMICAL CO., LTD.Inventors: Akira UTA, Takafumi SAKAMOTO
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Publication number: 20200392339Abstract: Provided are: a room-temperature-curable organopolysiloxane composition, the degree of cure of which can be visually recognized on the basis of a change in color; a structure obtained from the composition; and a method for assessing the cured state of the composition. The room-temperature-curable organopolysiloxane composition, which changes in color with the progress of curing from the uncured state, comprises the following ingredients: (A) 100 parts by mass of one or more organopolysiloxanes represented by formula (1) HO(SiR2O)nH??(1) (wherein R is an unsubstituted or halogen-substituted C1-10 monovalent hydrocarbon group and n is an integer of 10 or larger) and/or formula (2) (wherein R and n are the same as above, X is an oxygen atom or a C2-5 alkylene group, and m is independently 0 or 1); (B) 0.Type: ApplicationFiled: December 27, 2018Publication date: December 17, 2020Applicant: SHIN-ETSU CHEMICAL CO., LTD.Inventors: Akira UTA, Takafumi SAKAMOTO
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Patent number: 10590322Abstract: Provided is a heat dissipation material comprising a mesogen/silicon compound (co)polymer having a number average molecular weight of 1,000-500,000, represented by general formula (1). (Ar is a mesogen group selected from the structure represented by the following formulas. a represents a positive number from 0.5 to 1, b represents a number from 0 to 0.5 (with the caveat that a and b each represent the ratio of each number of repeating units in molecules, and a+b=1). R1 is independently a monovalent hydrocarbon group which does not independently include a C1-8 aliphatic unsaturated bond. R2 is independently a hydrogen atom, —Si(CH3)3, —Si(CH3)2(OH), —Si(CH3)2(CH?CH) or —Si(CH3)2(CH2—CH?CH2)). This heat dissipation material has excellent thermal conductivity, and further shows good thermoplastic properties and has excellent moldability, and hence can be suitably used as a resin material for heat dissipation materials and semiconductor devices and electronic parts in particular.Type: GrantFiled: May 25, 2016Date of Patent: March 17, 2020Assignee: SHIN-ETSU CHEMICAL CO., LTD.Inventors: Akira Uta, Masayuki Ikeno, Nobuaki Matsumoto, Kohei Masuda, Takafumi Sakamoto
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Publication number: 20190352466Abstract: Provided is a thermoplastic elastomer comprising a mesogen-silicon compound (co)polymer which is represented by formula (1) below and has a number average molecular weight of 1,000-500,000. The thermoplastic elastomer has transparency and rubber properties (rubber elasticity) and can be (repeatedly) molded thermally and reversibly, and thus can be suitably used in potting materials or various sealing materials. In formula (1), Ar represents a mesogenic group selected from among structures represented by formula (2) below, a represents an integer of 0.5-1, b represents a number of 0-0.5 (a and b respectively represent the ratio of the number of respective repeating units to the sum of all the repeating units in the molecule, and a+b=1), R1 is a monovalent hydrocarbon group that does not contain a C1-8 aliphatic unsaturated bond, and R2 is a hydrogen atom, —Si(CH3)3, —Si(CH3)2(OH), —Si(CH3)2(CH?CH2) or —Si(CH3)2(CH2—CH?CH2).Type: ApplicationFiled: January 16, 2018Publication date: November 21, 2019Applicant: SHIN-ETSU CHEMICAL CO., LTD.Inventors: Akira Uta, Kumiko Hayashi, Tomoki Akiba
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Publication number: 20190177542Abstract: This dealcoholization room-temperature curable organopolysiloxane composition contains (A) a diorganopolysiloxane having a silicon atom-bonded hydroxy group and/or a hydrolyzable silyl group at both ends of the molecular chain, and has a coefficient of viscosity of 20-1,000,000 mPa·s, (B) an organopolysiloxane which is a partial (co-)hydrolysis-condensation product of a hydrolyzable organosilane compound having one or more silicon atom-bonded alkenyl groups and 1-3 silicon atom-bonded alkoxy groups, per molecule, (C) a hydrolyzable organosilane compound having one or more phenylene backbones and two or more amino groups, per molecule, and/or a partial hydrolysis-condensation product thereof.Type: ApplicationFiled: June 16, 2017Publication date: June 13, 2019Applicant: SHIN-ETSU CHEMICAL CO., LTD.Inventors: Akira UTA, Takafumi SAKAMOTO
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Publication number: 20180163113Abstract: Provided is a heat dissipation material comprising a mesogen/silicon compound (co)polymer having a number average molecular weight of 1,000-500,000, represented by general formula (1). (Ar is a mesogen group selected from the structure represented by the following formulas. a represents a positive number from 0.5 to 1, b represents a number from 0 to 0.5 (with the caveat that a and b each represent the ratio of each number of repeating units in molecules, and a+b=1). R1 is independently a monovalent hydrocarbon group which does not independently include a C1-8 aliphatic unsaturated bond. R2 is independently a hydrogen atom, —Si(CH3)3, —Si(CH3)2(OH), —Si(CH3)2(CH?CH) or —Si(CH3)2(CH2—CH?CH2)). This heat dissipation material has excellent thermal conductivity, and further shows good thermoplastic properties and has excellent moldability, and hence can be suitably used as a resin material for heat dissipation materials and semiconductor devices and electronic parts in particular.Type: ApplicationFiled: May 25, 2016Publication date: June 14, 2018Applicant: SHIN-ETSU CHEMICAL CO., LTD.Inventors: Akira UTA, Masayuki IKENO, Nobuaki MATSUMOTO, Kohei MASUDA, Takafumi SAKAMOTO
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Patent number: 9920080Abstract: Provided is an alkoxysilyl-vinylene group-containing silicon compound represented by the following general formula (1): wherein each of R1 and R2 independently represents a monovalent hydrocarbon group having 1 to 20 carbon atoms; R represents a monovalent hydrocarbon group having an organic functional group(s) and 1 to 30 carbon atoms; and n represents an integer of 1 to 3. The alkoxy groups in the novel organic silicon compound of the invention have a dramatically improved hydrolyzability. Further, a high adhesion or adhesiveness; and a fast adhesiveness can be exhibited by adding the novel organic silicon compound to a room temperature curable organopolysiloxane.Type: GrantFiled: February 2, 2015Date of Patent: March 20, 2018Assignee: Shin-Etsu Chemical Co., Ltd.Inventors: Akira Uta, Akitsugu Fujiwara, Takafumi Sakamoto
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Publication number: 20180016475Abstract: Provided is a room temperature-curable organopolysiloxane composition capable of yielding, through curing, a silicone rubber cured product exhibiting a favorable adhesiveness and water-immersion adhesiveness to general purpose resins and metals. The composition contains (A) a diorganopolysiloxane having silicon atom-bonded hydroxyl groups and/or hydrolyzable groups at both terminals of a molecular chain, and exhibiting a viscosity of 20 to 1,000,000 mPa·s at 25° C.Type: ApplicationFiled: November 4, 2015Publication date: January 18, 2018Applicant: Shin-Etsu Chemical Co., Ltd.Inventors: Akira UTA, Takafumi SAKAMOTO, Munenao HIROKAMI