Patents by Inventor Akira UTA

Akira UTA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11518884
    Abstract: A room-temperature-curable organopolysiloxane composition; a structure obtained from the composition; and a method for assessing the cured state of the composition are provided. The room-temperature-curable organopolysiloxane composition, which changes in color with the progress of curing from the uncured state, comprises the following ingredients: (A) 100 parts by mass of one or more organopolysiloxanes represented by formula (1) HO(SiR2O)nH??(1) and/or formula (2) (with variables as defined herein); (B) 0.1-50 parts by mass of an organosilicon compound having at least three silicon-atom-bonded hydrolyzable groups in the molecule, which is not any of ingredients (A), (C), and (D), and/or a product of the partial hydrolytic condensation of the organosilicon compound; (C) 0.01-20 parts by mass of a curing catalyst; (D) 0.1-10 parts by mass of a silane coupling agent; and (E) 0.01-10 parts by mass of a pH indicator.
    Type: Grant
    Filed: December 27, 2018
    Date of Patent: December 6, 2022
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Akira Uta, Takafumi Sakamoto
  • Patent number: 11401419
    Abstract: This dealcoholization room-temperature curable organopolysiloxane composition contains (A) a diorganopolysiloxane having a silicon atom-bonded hydroxy group and/or a hydrolyzable silyl group at both ends of the molecular chain, and has a coefficient of viscosity of 20-1,000,000 mPa·s, (B) an organopolysiloxane which is a partial (co-)hydrolysis-condensation product of a hydrolyzable organosilane compound having one or more silicon atom-bonded alkenyl groups and 1-3 silicon atom-bonded alkoxy groups, per molecule, (C) a hydrolyzable organosilane compound having one or more phenylene backbones and two or more amino groups, per molecule, and/or a partial hydrolysis-condensation product thereof.
    Type: Grant
    Filed: June 16, 2017
    Date of Patent: August 2, 2022
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Akira Uta, Takafumi Sakamoto
  • Publication number: 20220220260
    Abstract: This organopolysiloxane composition, when cured at room temperature by moisture in the atmosphere, provides a silicone rubber cured product having good self-adhesiveness to a magnesium alloy. The organopolysiloxane composition contains (A) an organopolysiloxane having a hydroxy group and/or a hydrolysable silyl group at both ends of the molecular chain, (B) an organic silicon compound other than (A) and (C), having at least three hydrolysable groups bonded to a silicon atom per molecule, and/or a partial hydrolysis-condensation product thereof, and (C) a silane coupling agent having a specific molecular structure having a carboxylic acid silyl ester bond. Furthermore, a novel compound, having an alkoxysilyl group and a carboxylic acid silyl ester group per molecule, can have improved adhesiveness/bonding properties with respect to a base material due to the effect of carboxylic acid after hydrolysis thereof.
    Type: Application
    Filed: March 30, 2022
    Publication date: July 14, 2022
    Applicant: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Akira UTA, Takafumi SAKAMOTO
  • Publication number: 20220162393
    Abstract: A room-temperature-curable organopolysiloxane composition for an oil seal, wherein an organosilane compound containing a specific organo-oxymethyl group and represented by formula (1) and/or a partial hydrolysis condensate of said compound is used as a curing agent (crosslinking agent), and an organic compound having a guanidine skeleton is added in combination as a curing catalyst. (In the formula, each R1 is independently a C1-12 unsubstituted or substituted monovalent hydrocarbon group, R2 is a C1-12 unsubstituted or substituted monovalent hydrocarbon group, Y is a hydrolyzable group, and n is 0, 1 or 2.) It is thus possible to obtain a cured product having good rubber properties, adhesiveness, and engine oil resistance after curing even without containing a metal-based catalyst.
    Type: Application
    Filed: March 26, 2020
    Publication date: May 26, 2022
    Applicant: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Akira UTA, Shigeki YASUDA, Tetsuro YAMADA, Munenao HIROKAMI, Taiki KATAYAMA, Takafumi SAKAMOTO
  • Patent number: 11319413
    Abstract: This organopolysiloxane composition, when cured at room temperature by moisture in the atmosphere, provides a silicone rubber cured product having good self-adhesiveness to a magnesium alloy. The organopolysiloxane composition contains (A) an organopolysiloxane having a hydroxy group and/or a hydrolysable silyl group at both ends of the molecular chain, (B) an organic silicon compound other than (A) and (C), having at least three hydrolysable groups bonded to a silicon atom per molecule, and/or a partial hydrolysis-condensation product thereof, and (C) a silane coupling agent having a specific molecular structure having a carboxylic acid silyl ester bond. Furthermore, a novel compound, having an alkoxysilyl group and a carboxylic acid silyl ester group per molecule, can have improved adhesiveness/bonding properties with respect to a base material due to the effect of carboxylic acid after hydrolysis thereof.
    Type: Grant
    Filed: October 9, 2018
    Date of Patent: May 3, 2022
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Akira Uta, Takafumi Sakamoto
  • Publication number: 20220106514
    Abstract: This room temperature-curable composition contains: (A) a prescribed polyoxyalkylene compound which has two reactive silicon groups (silyl groups having 1 hydroxy group or 1-3 organo-oxy groups) per molecule, with one reactive silicon group at each molecular chain terminal, and in which the main chain is a prescribed polyoxyalkylene-based polymer; (B) an inorganic filler; (C) a hydrolyzable (organo)silane compound and/or a partial hydrolytic condensation product thereof as a curing agent; (D) a silane coupling agent; and (E) a curing catalyst. Produced by this configuration is a cured product which exhibits excellent silicone oil resistance, excellent curing properties and good elongation and adhesive properties.
    Type: Application
    Filed: January 16, 2020
    Publication date: April 7, 2022
    Applicant: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Akira UTA, Taiki KATAYAMA, Takafumi SAKAMOTO
  • Patent number: 11142612
    Abstract: Provided is a thermoplastic elastomer comprising a mesogen-silicon compound (co)polymer which is represented by formula (1) below and has a number average molecular weight of 1,000-500,000. The thermoplastic elastomer has transparency and rubber properties (rubber elasticity) and can be (repeatedly) molded thermally and reversibly, and thus can be suitably used in potting materials or various sealing materials. In formula (1), Ar represents a mesogenic group selected from among structures represented by formula (2) below, a represents an integer of 0.5-1, b represents a number of 0-0.5 (a and b respectively represent the ratio of the number of respective repeating units to the sum of all the repeating units in the molecule, and a+b=1), R1 is a monovalent hydrocarbon group that does not contain a C1-8 aliphatic unsaturated bond, and R2 is a hydrogen atom, —Si(CH3)3, —Si(CH3)2(OH), —Si(CH3)2(CH?CH2) or —Si(CH3)2(CH2—CH?CH2).
    Type: Grant
    Filed: January 16, 2018
    Date of Patent: October 12, 2021
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Akira Uta, Kumiko Hayashi, Tomoki Akiba
  • Publication number: 20210206924
    Abstract: This organopolysiloxane composition, when cured at room temperature by moisture in the atmosphere, provides a silicone rubber cured product having good self-adhesiveness to a magnesium alloy. The organopolysiloxane composition contains (A) an organopolysiloxane having a hydroxy group and/or a hydrolysable silyl group at both ends of the molecular chain, (B) an organic silicon compound other than (A) and (C), having at least three hydrolysable groups bonded to a silicon atom per molecule, and/or a partial hydrolysis-condensation product thereof, and (C) a silane coupling agent having a specific molecular structure having a carboxylic acid silyl ester bond. Furthermore, a novel compound, having an alkoxysilyl group and a carboxylic acid silyl ester group per molecule, can have improved adhesiveness/bonding properties with respect to a base material due to the effect of carboxylic acid after hydrolysis thereof.
    Type: Application
    Filed: October 9, 2018
    Publication date: July 8, 2021
    Applicant: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Akira UTA, Takafumi SAKAMOTO
  • Publication number: 20200392339
    Abstract: Provided are: a room-temperature-curable organopolysiloxane composition, the degree of cure of which can be visually recognized on the basis of a change in color; a structure obtained from the composition; and a method for assessing the cured state of the composition. The room-temperature-curable organopolysiloxane composition, which changes in color with the progress of curing from the uncured state, comprises the following ingredients: (A) 100 parts by mass of one or more organopolysiloxanes represented by formula (1) HO(SiR2O)nH??(1) (wherein R is an unsubstituted or halogen-substituted C1-10 monovalent hydrocarbon group and n is an integer of 10 or larger) and/or formula (2) (wherein R and n are the same as above, X is an oxygen atom or a C2-5 alkylene group, and m is independently 0 or 1); (B) 0.
    Type: Application
    Filed: December 27, 2018
    Publication date: December 17, 2020
    Applicant: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Akira UTA, Takafumi SAKAMOTO
  • Patent number: 10590322
    Abstract: Provided is a heat dissipation material comprising a mesogen/silicon compound (co)polymer having a number average molecular weight of 1,000-500,000, represented by general formula (1). (Ar is a mesogen group selected from the structure represented by the following formulas. a represents a positive number from 0.5 to 1, b represents a number from 0 to 0.5 (with the caveat that a and b each represent the ratio of each number of repeating units in molecules, and a+b=1). R1 is independently a monovalent hydrocarbon group which does not independently include a C1-8 aliphatic unsaturated bond. R2 is independently a hydrogen atom, —Si(CH3)3, —Si(CH3)2(OH), —Si(CH3)2(CH?CH) or —Si(CH3)2(CH2—CH?CH2)). This heat dissipation material has excellent thermal conductivity, and further shows good thermoplastic properties and has excellent moldability, and hence can be suitably used as a resin material for heat dissipation materials and semiconductor devices and electronic parts in particular.
    Type: Grant
    Filed: May 25, 2016
    Date of Patent: March 17, 2020
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Akira Uta, Masayuki Ikeno, Nobuaki Matsumoto, Kohei Masuda, Takafumi Sakamoto
  • Publication number: 20190352466
    Abstract: Provided is a thermoplastic elastomer comprising a mesogen-silicon compound (co)polymer which is represented by formula (1) below and has a number average molecular weight of 1,000-500,000. The thermoplastic elastomer has transparency and rubber properties (rubber elasticity) and can be (repeatedly) molded thermally and reversibly, and thus can be suitably used in potting materials or various sealing materials. In formula (1), Ar represents a mesogenic group selected from among structures represented by formula (2) below, a represents an integer of 0.5-1, b represents a number of 0-0.5 (a and b respectively represent the ratio of the number of respective repeating units to the sum of all the repeating units in the molecule, and a+b=1), R1 is a monovalent hydrocarbon group that does not contain a C1-8 aliphatic unsaturated bond, and R2 is a hydrogen atom, —Si(CH3)3, —Si(CH3)2(OH), —Si(CH3)2(CH?CH2) or —Si(CH3)2(CH2—CH?CH2).
    Type: Application
    Filed: January 16, 2018
    Publication date: November 21, 2019
    Applicant: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Akira Uta, Kumiko Hayashi, Tomoki Akiba
  • Publication number: 20190177542
    Abstract: This dealcoholization room-temperature curable organopolysiloxane composition contains (A) a diorganopolysiloxane having a silicon atom-bonded hydroxy group and/or a hydrolyzable silyl group at both ends of the molecular chain, and has a coefficient of viscosity of 20-1,000,000 mPa·s, (B) an organopolysiloxane which is a partial (co-)hydrolysis-condensation product of a hydrolyzable organosilane compound having one or more silicon atom-bonded alkenyl groups and 1-3 silicon atom-bonded alkoxy groups, per molecule, (C) a hydrolyzable organosilane compound having one or more phenylene backbones and two or more amino groups, per molecule, and/or a partial hydrolysis-condensation product thereof.
    Type: Application
    Filed: June 16, 2017
    Publication date: June 13, 2019
    Applicant: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Akira UTA, Takafumi SAKAMOTO
  • Publication number: 20180163113
    Abstract: Provided is a heat dissipation material comprising a mesogen/silicon compound (co)polymer having a number average molecular weight of 1,000-500,000, represented by general formula (1). (Ar is a mesogen group selected from the structure represented by the following formulas. a represents a positive number from 0.5 to 1, b represents a number from 0 to 0.5 (with the caveat that a and b each represent the ratio of each number of repeating units in molecules, and a+b=1). R1 is independently a monovalent hydrocarbon group which does not independently include a C1-8 aliphatic unsaturated bond. R2 is independently a hydrogen atom, —Si(CH3)3, —Si(CH3)2(OH), —Si(CH3)2(CH?CH) or —Si(CH3)2(CH2—CH?CH2)). This heat dissipation material has excellent thermal conductivity, and further shows good thermoplastic properties and has excellent moldability, and hence can be suitably used as a resin material for heat dissipation materials and semiconductor devices and electronic parts in particular.
    Type: Application
    Filed: May 25, 2016
    Publication date: June 14, 2018
    Applicant: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Akira UTA, Masayuki IKENO, Nobuaki MATSUMOTO, Kohei MASUDA, Takafumi SAKAMOTO
  • Patent number: 9920080
    Abstract: Provided is an alkoxysilyl-vinylene group-containing silicon compound represented by the following general formula (1): wherein each of R1 and R2 independently represents a monovalent hydrocarbon group having 1 to 20 carbon atoms; R represents a monovalent hydrocarbon group having an organic functional group(s) and 1 to 30 carbon atoms; and n represents an integer of 1 to 3. The alkoxy groups in the novel organic silicon compound of the invention have a dramatically improved hydrolyzability. Further, a high adhesion or adhesiveness; and a fast adhesiveness can be exhibited by adding the novel organic silicon compound to a room temperature curable organopolysiloxane.
    Type: Grant
    Filed: February 2, 2015
    Date of Patent: March 20, 2018
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Akira Uta, Akitsugu Fujiwara, Takafumi Sakamoto
  • Publication number: 20180016475
    Abstract: Provided is a room temperature-curable organopolysiloxane composition capable of yielding, through curing, a silicone rubber cured product exhibiting a favorable adhesiveness and water-immersion adhesiveness to general purpose resins and metals. The composition contains (A) a diorganopolysiloxane having silicon atom-bonded hydroxyl groups and/or hydrolyzable groups at both terminals of a molecular chain, and exhibiting a viscosity of 20 to 1,000,000 mPa·s at 25° C.
    Type: Application
    Filed: November 4, 2015
    Publication date: January 18, 2018
    Applicant: Shin-Etsu Chemical Co., Ltd.
    Inventors: Akira UTA, Takafumi SAKAMOTO, Munenao HIROKAMI
  • Publication number: 20170190721
    Abstract: Provided is an alkoxysilyl-vinylene group-containing silicon compound represented by the following general formula (1): wherein each of R1 and R2 independently represents a monovalent hydrocarbon group having 1 to 20 carbon atoms; R represents a monovalent hydrocarbon group having an organic functional group(s) and 1 to 30 carbon atoms; and n represents an integer of 1 to 3. The alkoxy groups in the novel organic silicon compound of the invention have a dramatically improved hydrolyzability. Further, a high adhesion or adhesiveness; and a fast adhesiveness can be exhibited by adding the novel organic silicon compound to a room temperature curable organopolysiloxane.
    Type: Application
    Filed: February 2, 2015
    Publication date: July 6, 2017
    Applicant: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Akira UTA, Akitsugu FUJIWARA, Takafumi SAKAMOTO