Patents by Inventor Akira Yagasaki

Akira Yagasaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • METHOD OF MANUFACTURING PRINTED WIRING BOARD, AND PRINTED WIRING BOARD
    Publication number: 20170105289
    Abstract: On a printed wiring board obtained by a method of manufacturing a printed board, a predetermined component is to be mounted on at least one of a front surface side and a back surface side. The manufacturing method includes preparing a CFRP core, forming a through hole so as to penetrate the CFRP core from the front surface side to the back surface side and include a region in which the component is to be mounted when viewed in a plan view, and embedding a GFRP core having insulating properties within the through hole by filling the through hole with a resin having insulating properties and curing the resin. According to the manufacturing method, the component mounted on the printed board is not affected by a stray capacitance due to a CFRP, and it is not difficult to form a circuit.
    Type: Application
    Filed: October 21, 2016
    Publication date: April 13, 2017
    Applicant: Mitsubishi Electric Corporation
    Inventors: Hiroyuki OSUGA, Sohei SAMEJIMA, Kazuhito SAKURADA, Akira YAGASAKI, Tatsuya HINATA
  • Method of manufacturing printed wiring board, and printed wiring board
    Patent number: 9532444
    Abstract: On a printed wiring board obtained by a method of manufacturing a printed board, a predetermined component is to be mounted on at least one of a front surface side and a back surface side. The manufacturing method includes preparing a CFRP core, forming a through hole so as to penetrate the CFRP core from the front surface side to the back surface side and include a region in which the component is to be mounted when viewed in a plan view, and embedding a GFRP core having insulating properties within the through hole by filling the through hole with a resin having insulating properties and curing the resin. According to the manufacturing method, the component mounted on the printed board is not affected by a stray capacitance due to a CFRP, and it is not difficult to form a circuit.
    Type: Grant
    Filed: February 23, 2011
    Date of Patent: December 27, 2016
    Assignees: Mitsubishi Electric Corporation, NIPPON AVIONICS CO., LTD.
    Inventors: Hiroyuki Osuga, Sohei Samejima, Kazuhito Sakurada, Akira Yagasaki, Tatsuya Hinata
  • METHOD OF MANUFACTURING PRINTED WIRING BOARD, AND PRINTED WIRING BOARD
    Publication number: 20130008700
    Abstract: On a printed wiring board obtained by a method of manufacturing a printed board, a predetermined component is to be mounted on at least one of a front surface side and a back surface side. The manufacturing method includes preparing a CFRP core, forming a through hole so as to penetrate the CFRP core from the front surface side to the back surface side and include a region in which the component is to be mounted when viewed in a plan view, and embedding a GFRP core having insulating properties within the through hole by filling the through hole with a resin having insulating properties and curing the resin. According to the manufacturing method, the component mounted on the printed board is not affected by a stray capacitance due to a CFRP, and it is not difficult to form a circuit.
    Type: Application
    Filed: February 23, 2011
    Publication date: January 10, 2013
    Applicants: NIPPON AVIONICS, CO., LTD., Mitsubishi Electric Corporation
    Inventors: Hiroyuki Osuga, Sohei Samejima, Kazuhito Sakurada, Akira Yagasaki, Tatsuya Hinata