Patents by Inventor Akira Yamakami

Akira Yamakami has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11840650
    Abstract: A black sheet (1) includes a laminate of a base sheet (11) and an infrared reflecting layer (12). The CIE color values (L*, a*, b*) and the infrared reflectance R/[%] at a wavelength of 850 nm are within the following respective ranges.
    Type: Grant
    Filed: August 29, 2018
    Date of Patent: December 12, 2023
    Assignees: DIC CORPORATION, SUN CHEMICAL CORPORATION
    Inventors: Nana Shiraishi, Katsuaki Imai, Akira Yamakami, Bo Sun, Jerome Moyer, Philippe Schottland
  • Patent number: 11787981
    Abstract: The invention relates to a method for peeling a pressure-sensitive adhesive tape including: a pressure-sensitive adhesive layer. The pressure-sensitive adhesive tape has a thickness greater than 150 ?m and smaller than 1,500 ?m, an elongation at break of 600% to 3,000%, and a stress at break of 2.5 to 80.0 MPa. According to the invention, the conformity and the adhesion with respect to an adherend, particularly, a hard adherend, are excellent, and excellent re-peeling properties are obtained, so that the pressure-sensitive adhesive tape can be stretched and peeled off in a horizontal direction, without necessity for embrittling the pressure-sensitive adhesive tape by heating or by using an organic solvent or the like or without remaining of the pressure-sensitive adhesive on the adherend, in a case of peeling the pressure-sensitive adhesive tape.
    Type: Grant
    Filed: May 2, 2022
    Date of Patent: October 17, 2023
    Assignee: DIC CORPORATION
    Inventors: Daisuke Watanabe, Takamine Sugiura, Akira Yamakami
  • Publication number: 20220380640
    Abstract: An adhesive tape with high repeelability from the state that a portion of the adhesive tape has already been peeled from an adherend is provided. The adhesive tape includes a substrate layer and an adhesive layer. The substrate layer has a breaking stress in a range of 1 to 90 MPa and an elongation at break in a range of 400% to 3000%. The adhesive tape satisfies the following relational expression (i): [Math. 1] P400/P0?0.9 (i). P0 denotes an initial cleavage strength N/cm2 of the adhesive tape, and P400 denotes a cleavage strength N/cm2 when the adhesive tape is stretched by 400%.
    Type: Application
    Filed: July 20, 2022
    Publication date: December 1, 2022
    Applicant: DIC Corporation
    Inventors: Daisuke Watanabe, Kota Suetsugu, Akira Yamakami, Yumi Kagiyama
  • Publication number: 20220372342
    Abstract: An adhesive tape has adhesive strength with high high-load holding power, temporal repeelability, and storage stability. The adhesive tape includes a substrate layer and an adhesive layer. The substrate layer has a breaking stress in a range of 1 to 100 MPa and an elongation at break in a range of 300% to 3000%. The adhesive layer contains a tackifier resin and a triblock copolymer with a repeating unit represented by the general formula (1): A, B, and C independently denote a repeating unit. A and C independently denote an alkyl methacrylate monomer unit and B denotes an alkyl acrylate monomer unit. p, q, and r independently denote the degree of polymerization of their respective monomer units. A and C may be the same or may denote an alkyl methacrylate monomer unit with a different chemical structure. * denotes a bonding arm to another atom.
    Type: Application
    Filed: July 20, 2022
    Publication date: November 24, 2022
    Applicant: DIC Corporation
    Inventors: Daisuke Watanabe, Kota Suetsugu, Akira Yamakami
  • Publication number: 20220372341
    Abstract: An adhesive tape with high high-load holding power, initial adhesive strength, and repeelability is provided. An adhesive layer of the adhesive tape contains filler particles and a triblock copolymer with a repeating unit represented by the following general formula (1): A, B, and C independently denote a repeating unit. A and C independently denote an alkyl methacrylate monomer unit and B denotes an alkyl acrylate monomer unit. p, q, and r independently denote the degree of polymerization of their monomer units respectively. A and C may be the same or may denote an alkyl methacrylate monomer unit with a different chemical structure, and * denotes a bonding arm to another atom. A relationship D50/T between an average particle size D50 of the filler particles and an average thickness T of the adhesive layer ranges from 0.05 to 1.0.
    Type: Application
    Filed: July 20, 2022
    Publication date: November 24, 2022
    Applicant: DIC Corporation
    Inventors: Daisuke Watanabe, Kota Suetsugu, Akira Yamakami, Yumi Kagiyama
  • Publication number: 20220251426
    Abstract: The invention relates to a method for peeling a pressure-sensitive adhesive tape including: a pressure-sensitive adhesive layer. The pressure-sensitive adhesive tape has a thickness greater than 150 ?m and smaller than 1,500 ?m, an elongation at break of 600% to 3,000%, and a stress at break of 2.5 to 80.0 MPa. According to the invention, the conformity and the adhesion with respect to an adherend, particularly, a hard adherend, are excellent, and excellent re-peeling properties are obtained, so that the pressure-sensitive adhesive tape can be stretched and peeled off in a horizontal direction, without necessity for embrittling the pressure-sensitive adhesive tape by heating or by using an organic solvent or the like or without remaining of the pressure-sensitive adhesive on the adherend, in a case of peeling the pressure-sensitive adhesive tape.
    Type: Application
    Filed: May 2, 2022
    Publication date: August 11, 2022
    Applicant: DIC CORPORATION
    Inventors: Daisuke Watanabe, Takamine Sugiura, Akira Yamakami
  • Publication number: 20200376801
    Abstract: A black sheet (1) includes a laminate of a base sheet (11) and an infrared reflecting layer (12). The CIE color values (L*, a*, b*) and the infrared reflectance R/[%] at a wavelength of 850 nm are within the following respective ranges.
    Type: Application
    Filed: August 29, 2018
    Publication date: December 3, 2020
    Applicants: DIC Corporation, Sun Chemical Corporation
    Inventors: Nana Shiraishi, Katsuaki Imai, Akira Yamakami, Bo Sun, Jerome Moyer, Philippe Schottland
  • Publication number: 20200190370
    Abstract: The invention relates to a pressure-sensitive adhesive tape including: a pressure-sensitive adhesive layer. The pressure-sensitive adhesive tape has a thickness greater than 150 ?m and smaller than 1,500 ?m, an elongation at break of 600% to 3,000%, and a stress at break of 2.5 to 80.0 MPa. According to the invention, the conformity and the adhesion with respect to an adherend, particularly, a hard adherend, are excellent, and excellent re-peeling properties are obtained, so that the pressure-sensitive adhesive tape can be stretched and peeled off in a horizontal direction, without necessity for embrittling the pressure-sensitive adhesive tape by heating or by using an organic solvent or the like or without remaining of the pressure-sensitive adhesive on the adherend, in a case of peeling the pressure-sensitive adhesive tape.
    Type: Application
    Filed: June 14, 2018
    Publication date: June 18, 2020
    Applicant: DIC Corporation
    Inventors: Daisuke Watanabe, Takamine Sugiura, Akira Yamakami
  • Patent number: 10093835
    Abstract: There is provided a double-sided adhesive tape includes a foam base, a resin film disposed on a surface of the foam base, an adhesive layer disposed on a surface of the resin film, and an adhesive layer disposed on another surface of the foam base. The foam base has a density of 0.45 g/cm3 or less and an interlaminar strength of 10 N/cm or more. The adhesive layer has a 180°-peel adhesion of 10 N/20 mm or more. The 180°-peel adhesion is measured at a peeling speed of 300 mm/min when an adhesive tape including a 25-?m-thick PET base and a 25-?m-thick adhesive layer disposed on the PET base is bonded to an aluminium board at 23° C. and 65% RH by pressing the adhesive tape against the aluminium board with one stroke of a 2-kg roller and subsequently the adhesive tape is left standing for 1 hour at 23° C. and 50% RH.
    Type: Grant
    Filed: April 22, 2014
    Date of Patent: October 9, 2018
    Assignee: DIC CORPORATION (TOKYO)
    Inventors: Akira Yamakami, Hideaki Takei, Yuki Ogawa, Yumi Kamikawa, Takeshi Iwasaki
  • Publication number: 20160339672
    Abstract: There is provided a double-sided pressure-sensitive adhesive tape including resin films laminated on both surfaces of a foaming body substrate, and pressure-sensitive adhesive layers laminated on the surface of the resin film, in which the foaming body substrate has a density of 0.45 g/cm3 or less, and an interlaminar strength of 10 N/cm or more, and pressure-sensitive adhesive layer exhibits a 180° peeling adhesive force of 10 N/20 mm or more when a pressure-sensitive adhesive tape obtained by providing the pressure-sensitive adhesive layer on a polyethylene terephthalate substrate having a thickness of 25 ?m such that the thickness of the pressure-sensitive adhesive layer is 25 ?m is allowed to adhere onto an aluminum plate with pressure under the predetermined environment, and is peeled at a peeling rate of 300 mm/min.
    Type: Application
    Filed: December 9, 2014
    Publication date: November 24, 2016
    Applicant: DIC Corporation
    Inventors: Yumi Kagiyama, Hideaki Takei, Akira Yamakami, Takeshi Iwasaki
  • Publication number: 20160108292
    Abstract: There is provided a double-sided adhesive tape includes a foam base, a resin film disposed on a surface of the foam base, an adhesive layer disposed on a surface of the resin film, and an adhesive layer disposed on another surface of the foam base. The foam base has a density of 0.45 g/cm3 or less and an interlaminar strength of 10 N/cm or more. The adhesive layer has a 180°-peel adhesion of 10 N/20 mm or more. The 180°-peel adhesion is measured at a peeling speed of 300 mm/min when an adhesive tape including a 25-?m-thick PET base and a 25-?m-thick adhesive layer disposed on the PET base is bonded to an aluminium board at 23° C. and 65% RH by pressing the adhesive tape against the aluminium board with one stroke of a 2-kg roller and subsequently the adhesive tape is left standing for 1 hour at 23° C. and 50% RH.
    Type: Application
    Filed: April 22, 2014
    Publication date: April 21, 2016
    Applicant: DIC Corporation
    Inventors: Akira Yamakami, Hideaki Takei, Yuki Ogawa, Yumi Kamikawa, Takeshi Iwasaki
  • Publication number: 20040028895
    Abstract: An adhesive tape (a) which combines light reflectivity and light shielding characteristics, which is used for bonding between an LCD panel and a backlight case of an LCD module; (b) and which comprises a backing formed by laminating a light reflective layer and a light shielding layer, and an adhesive layer provided on at least one surface of the backing; (c) wherein the light reflective layer is formed of a white resin film with a thickness within a range from 10 to 30 &mgr;m, and a tensile strength of at least 10.0 N/10 mm.
    Type: Application
    Filed: August 8, 2003
    Publication date: February 12, 2004
    Applicant: Dainippon Ink and Chemicals, Inc.
    Inventors: Akira Yamakami, Kosuke Tanabe, Ryuichi Nakamura, Akihiro Kuwashita, Akihiro Yamada