Patents by Inventor Akira Yamakami
Akira Yamakami has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11840650Abstract: A black sheet (1) includes a laminate of a base sheet (11) and an infrared reflecting layer (12). The CIE color values (L*, a*, b*) and the infrared reflectance R/[%] at a wavelength of 850 nm are within the following respective ranges.Type: GrantFiled: August 29, 2018Date of Patent: December 12, 2023Assignees: DIC CORPORATION, SUN CHEMICAL CORPORATIONInventors: Nana Shiraishi, Katsuaki Imai, Akira Yamakami, Bo Sun, Jerome Moyer, Philippe Schottland
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Patent number: 11787981Abstract: The invention relates to a method for peeling a pressure-sensitive adhesive tape including: a pressure-sensitive adhesive layer. The pressure-sensitive adhesive tape has a thickness greater than 150 ?m and smaller than 1,500 ?m, an elongation at break of 600% to 3,000%, and a stress at break of 2.5 to 80.0 MPa. According to the invention, the conformity and the adhesion with respect to an adherend, particularly, a hard adherend, are excellent, and excellent re-peeling properties are obtained, so that the pressure-sensitive adhesive tape can be stretched and peeled off in a horizontal direction, without necessity for embrittling the pressure-sensitive adhesive tape by heating or by using an organic solvent or the like or without remaining of the pressure-sensitive adhesive on the adherend, in a case of peeling the pressure-sensitive adhesive tape.Type: GrantFiled: May 2, 2022Date of Patent: October 17, 2023Assignee: DIC CORPORATIONInventors: Daisuke Watanabe, Takamine Sugiura, Akira Yamakami
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Publication number: 20220380640Abstract: An adhesive tape with high repeelability from the state that a portion of the adhesive tape has already been peeled from an adherend is provided. The adhesive tape includes a substrate layer and an adhesive layer. The substrate layer has a breaking stress in a range of 1 to 90 MPa and an elongation at break in a range of 400% to 3000%. The adhesive tape satisfies the following relational expression (i): [Math. 1] P400/P0?0.9 (i). P0 denotes an initial cleavage strength N/cm2 of the adhesive tape, and P400 denotes a cleavage strength N/cm2 when the adhesive tape is stretched by 400%.Type: ApplicationFiled: July 20, 2022Publication date: December 1, 2022Applicant: DIC CorporationInventors: Daisuke Watanabe, Kota Suetsugu, Akira Yamakami, Yumi Kagiyama
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Publication number: 20220372342Abstract: An adhesive tape has adhesive strength with high high-load holding power, temporal repeelability, and storage stability. The adhesive tape includes a substrate layer and an adhesive layer. The substrate layer has a breaking stress in a range of 1 to 100 MPa and an elongation at break in a range of 300% to 3000%. The adhesive layer contains a tackifier resin and a triblock copolymer with a repeating unit represented by the general formula (1): A, B, and C independently denote a repeating unit. A and C independently denote an alkyl methacrylate monomer unit and B denotes an alkyl acrylate monomer unit. p, q, and r independently denote the degree of polymerization of their respective monomer units. A and C may be the same or may denote an alkyl methacrylate monomer unit with a different chemical structure. * denotes a bonding arm to another atom.Type: ApplicationFiled: July 20, 2022Publication date: November 24, 2022Applicant: DIC CorporationInventors: Daisuke Watanabe, Kota Suetsugu, Akira Yamakami
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Publication number: 20220372341Abstract: An adhesive tape with high high-load holding power, initial adhesive strength, and repeelability is provided. An adhesive layer of the adhesive tape contains filler particles and a triblock copolymer with a repeating unit represented by the following general formula (1): A, B, and C independently denote a repeating unit. A and C independently denote an alkyl methacrylate monomer unit and B denotes an alkyl acrylate monomer unit. p, q, and r independently denote the degree of polymerization of their monomer units respectively. A and C may be the same or may denote an alkyl methacrylate monomer unit with a different chemical structure, and * denotes a bonding arm to another atom. A relationship D50/T between an average particle size D50 of the filler particles and an average thickness T of the adhesive layer ranges from 0.05 to 1.0.Type: ApplicationFiled: July 20, 2022Publication date: November 24, 2022Applicant: DIC CorporationInventors: Daisuke Watanabe, Kota Suetsugu, Akira Yamakami, Yumi Kagiyama
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Publication number: 20220251426Abstract: The invention relates to a method for peeling a pressure-sensitive adhesive tape including: a pressure-sensitive adhesive layer. The pressure-sensitive adhesive tape has a thickness greater than 150 ?m and smaller than 1,500 ?m, an elongation at break of 600% to 3,000%, and a stress at break of 2.5 to 80.0 MPa. According to the invention, the conformity and the adhesion with respect to an adherend, particularly, a hard adherend, are excellent, and excellent re-peeling properties are obtained, so that the pressure-sensitive adhesive tape can be stretched and peeled off in a horizontal direction, without necessity for embrittling the pressure-sensitive adhesive tape by heating or by using an organic solvent or the like or without remaining of the pressure-sensitive adhesive on the adherend, in a case of peeling the pressure-sensitive adhesive tape.Type: ApplicationFiled: May 2, 2022Publication date: August 11, 2022Applicant: DIC CORPORATIONInventors: Daisuke Watanabe, Takamine Sugiura, Akira Yamakami
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Publication number: 20200376801Abstract: A black sheet (1) includes a laminate of a base sheet (11) and an infrared reflecting layer (12). The CIE color values (L*, a*, b*) and the infrared reflectance R/[%] at a wavelength of 850 nm are within the following respective ranges.Type: ApplicationFiled: August 29, 2018Publication date: December 3, 2020Applicants: DIC Corporation, Sun Chemical CorporationInventors: Nana Shiraishi, Katsuaki Imai, Akira Yamakami, Bo Sun, Jerome Moyer, Philippe Schottland
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Publication number: 20200190370Abstract: The invention relates to a pressure-sensitive adhesive tape including: a pressure-sensitive adhesive layer. The pressure-sensitive adhesive tape has a thickness greater than 150 ?m and smaller than 1,500 ?m, an elongation at break of 600% to 3,000%, and a stress at break of 2.5 to 80.0 MPa. According to the invention, the conformity and the adhesion with respect to an adherend, particularly, a hard adherend, are excellent, and excellent re-peeling properties are obtained, so that the pressure-sensitive adhesive tape can be stretched and peeled off in a horizontal direction, without necessity for embrittling the pressure-sensitive adhesive tape by heating or by using an organic solvent or the like or without remaining of the pressure-sensitive adhesive on the adherend, in a case of peeling the pressure-sensitive adhesive tape.Type: ApplicationFiled: June 14, 2018Publication date: June 18, 2020Applicant: DIC CorporationInventors: Daisuke Watanabe, Takamine Sugiura, Akira Yamakami
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Patent number: 10093835Abstract: There is provided a double-sided adhesive tape includes a foam base, a resin film disposed on a surface of the foam base, an adhesive layer disposed on a surface of the resin film, and an adhesive layer disposed on another surface of the foam base. The foam base has a density of 0.45 g/cm3 or less and an interlaminar strength of 10 N/cm or more. The adhesive layer has a 180°-peel adhesion of 10 N/20 mm or more. The 180°-peel adhesion is measured at a peeling speed of 300 mm/min when an adhesive tape including a 25-?m-thick PET base and a 25-?m-thick adhesive layer disposed on the PET base is bonded to an aluminium board at 23° C. and 65% RH by pressing the adhesive tape against the aluminium board with one stroke of a 2-kg roller and subsequently the adhesive tape is left standing for 1 hour at 23° C. and 50% RH.Type: GrantFiled: April 22, 2014Date of Patent: October 9, 2018Assignee: DIC CORPORATION (TOKYO)Inventors: Akira Yamakami, Hideaki Takei, Yuki Ogawa, Yumi Kamikawa, Takeshi Iwasaki
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Publication number: 20160339672Abstract: There is provided a double-sided pressure-sensitive adhesive tape including resin films laminated on both surfaces of a foaming body substrate, and pressure-sensitive adhesive layers laminated on the surface of the resin film, in which the foaming body substrate has a density of 0.45 g/cm3 or less, and an interlaminar strength of 10 N/cm or more, and pressure-sensitive adhesive layer exhibits a 180° peeling adhesive force of 10 N/20 mm or more when a pressure-sensitive adhesive tape obtained by providing the pressure-sensitive adhesive layer on a polyethylene terephthalate substrate having a thickness of 25 ?m such that the thickness of the pressure-sensitive adhesive layer is 25 ?m is allowed to adhere onto an aluminum plate with pressure under the predetermined environment, and is peeled at a peeling rate of 300 mm/min.Type: ApplicationFiled: December 9, 2014Publication date: November 24, 2016Applicant: DIC CorporationInventors: Yumi Kagiyama, Hideaki Takei, Akira Yamakami, Takeshi Iwasaki
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Publication number: 20160108292Abstract: There is provided a double-sided adhesive tape includes a foam base, a resin film disposed on a surface of the foam base, an adhesive layer disposed on a surface of the resin film, and an adhesive layer disposed on another surface of the foam base. The foam base has a density of 0.45 g/cm3 or less and an interlaminar strength of 10 N/cm or more. The adhesive layer has a 180°-peel adhesion of 10 N/20 mm or more. The 180°-peel adhesion is measured at a peeling speed of 300 mm/min when an adhesive tape including a 25-?m-thick PET base and a 25-?m-thick adhesive layer disposed on the PET base is bonded to an aluminium board at 23° C. and 65% RH by pressing the adhesive tape against the aluminium board with one stroke of a 2-kg roller and subsequently the adhesive tape is left standing for 1 hour at 23° C. and 50% RH.Type: ApplicationFiled: April 22, 2014Publication date: April 21, 2016Applicant: DIC CorporationInventors: Akira Yamakami, Hideaki Takei, Yuki Ogawa, Yumi Kamikawa, Takeshi Iwasaki
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Publication number: 20040028895Abstract: An adhesive tape (a) which combines light reflectivity and light shielding characteristics, which is used for bonding between an LCD panel and a backlight case of an LCD module; (b) and which comprises a backing formed by laminating a light reflective layer and a light shielding layer, and an adhesive layer provided on at least one surface of the backing; (c) wherein the light reflective layer is formed of a white resin film with a thickness within a range from 10 to 30 &mgr;m, and a tensile strength of at least 10.0 N/10 mm.Type: ApplicationFiled: August 8, 2003Publication date: February 12, 2004Applicant: Dainippon Ink and Chemicals, Inc.Inventors: Akira Yamakami, Kosuke Tanabe, Ryuichi Nakamura, Akihiro Kuwashita, Akihiro Yamada