Patents by Inventor Akira Yamakawa
Akira Yamakawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11927125Abstract: A prediction device that predicts time for a reducing agent accommodated in a container mounted on a work vehicle to freeze includes a remaining amount information acquisition unit configured to acquire remaining amount information indicating a remaining amount of the reducing agent in the container, a wall surface temperature acquisition unit configured to acquire a detection result of a wall surface temperature of the container, a reducing agent temperature acquisition unit configured to acquire a detection result of a temperature of the reducing agent, and a time calculation unit configured to calculate the time for the reducing agent to freeze based on the wall surface temperature, the reducing agent temperature, and the remaining amount information.Type: GrantFiled: July 16, 2020Date of Patent: March 12, 2024Assignee: Komatsu Ltd.Inventors: Akira Oka, Tatsuya Yamakawa, Yohei Nishikawa
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Publication number: 20240071678Abstract: A transformer device according to the disclosure includes a transformer and a cooling device that cools the transformer. The transformer includes a primary coil, a secondary coil, and a first core and a second core, into which the primary and secondary coils are respectively inserted. The first and second cores are disposed to face each other. The first core includes a first core part and a second core part, each of the first and second core parts formed by dividing the first core in a predetermined division plane. The first and second core parts of the first core are disposed to face each other through a gap, and in which the first core and the cooling device are disposed to face each other.Type: ApplicationFiled: December 24, 2021Publication date: February 29, 2024Inventors: Akira KATO, Takehiko YAMAKAWA
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Patent number: 11791284Abstract: Provided is a method suitable for efficiently manufacturing a semiconductor device while preventing warpage of the wafer laminate in manufacturing a semiconductor device in which semiconductor elements are multilayered through laminating wafers in which the semiconductor elements are fabricated. The method includes at least: preparing a plurality of first wafer laminates each having a laminate configuration including a first and second wafers each having an element forming surface and a back surface opposite from the element forming surface, the laminate configuration wherein the element forming surface sides of the first and second wafers are bonded to each other; thinning the first wafer of the first wafer laminate to form a first wafer laminate having the thinned first wafer; and bonding the thinned first wafer sides of two first wafer laminates having undergone the thinning to each other to form a second wafer laminate.Type: GrantFiled: October 18, 2019Date of Patent: October 17, 2023Assignee: Daicel CorporationInventors: Naoko Tsuji, Akira Yamakawa, Katsuhiko Sumita
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Publication number: 20210358867Abstract: Provided is a method suitable for efficiently manufacturing a semiconductor device while preventing warpage of the wafer laminate in manufacturing a semiconductor device in which semiconductor elements are multilayered through laminating wafers in which the semiconductor elements are fabricated. The method includes at least: preparing a plurality of first wafer laminates each having a laminate configuration including a first and second wafers each having an element forming surface and a back surface opposite from the element forming surface, the laminate configuration wherein the element forming surface sides of the first and second wafers are bonded to each other; thinning the first wafer of the first wafer laminate to form a first wafer laminate having the thinned first wafer; and bonding the thinned first wafer sides of two first wafer laminates having undergone the thinning to each other to form a second wafer laminate.Type: ApplicationFiled: October 18, 2019Publication date: November 18, 2021Applicant: DAICEL CORPORATIONInventors: Naoko TSUJI, Akira YAMAKAWA, Katsuhiko SUMITA
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Patent number: 11149118Abstract: The present invention provides an insulating film forming composition that excels in insulating properties and heat resistance, suppresses the occurrence of warpage, and can form an insulating film with excellent adhesion. The insulating film forming composition of the present invention contains, as a polymerizable compound, a polyorganosilsesquioxane containing siloxane constituent units; wherein the total content of: constituent units represented by formula (I) [RaSiO3/2] (I) and constituent units represented by formula (II) [RaSiO2/2(ORb)] (II) is greater than or equal to 55 mol % of the total amount of the siloxane constituent units; and the polyorganosilsesquioxane has a number average molecular weight of from 500 to 10000 and an epoxy equivalent of from 200 to 2000 g/eq.Type: GrantFiled: April 26, 2018Date of Patent: October 19, 2021Assignee: DAICEL CORPORATIONInventors: Hiroto Miyake, Naoko Tsuji, Akira Yamakawa
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Patent number: 11066586Abstract: Provided is a curable composition that can, when cured, form a cured product having adhesiveness and adhesion to an adherend at excellent levels. The curable composition contains a polyorganosilsesquioxane and one of (A) a compound represented by Formula (X); and (B) a polymerization stabilizer, where Formula (X) is expressed as follows: wherein r1 represents an integer from 4 to 20; L represents a group containing epoxy, oxetanyl or vinyl ether group; R11 and R12 each represent an optionally substituted hydrocarbon group; s1 represents an integer from 1 to 3; t1 represents an integer from 0 to 2, where s1 plus t1 equals 3; and R13 and R14 are selected from hydrogen and an optionally substituted hydrocarbon group. The polyorganosilsesquioxane has a number-average molecular weight of 1000 to 3000 and a molecular-weight dispersity of 1.0 to 3.Type: GrantFiled: June 13, 2016Date of Patent: July 20, 2021Assignee: DAICEL CORPORATIONInventors: Hiroki Tanaka, Naoko Tsuji, Akira Yamakawa
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Publication number: 20210139652Abstract: The present invention provides an insulating film forming composition that excels in insulating properties and heat resistance, suppresses the occurrence of warpage, and can form an insulating film with excellent adhesion. The insulating film forming composition of the present invention contains, as a polymerizable compound, a polyorganosilsesquioxane containing siloxane constituent units; wherein the total content of: constituent units represented by formula (I) [RaSiO3/2] (I) and constituent units represented by formula (II) [RaSiO2/2(ORb)] (II) is greater than or equal to 55 mol % of the total amount of the siloxane constituent units; and the polyorganosilsesquioxane has a number average molecular weight of from 500 to 10000 and an epoxy equivalent of from 200 to 2000 g/eq.Type: ApplicationFiled: April 26, 2018Publication date: May 13, 2021Applicant: DAICEL CORPORATIONInventors: Hiroto MIYAKE, Naoko TSUJI, Akira YAMAKAWA
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Publication number: 20200148926Abstract: The present invention is to provide a curable composition for adhesive agents that cures at a low temperature and that can form a cured article having excellent heat resistance, crack resistance, and adhesive properties and tight bonding properties for adhereds.Type: ApplicationFiled: May 16, 2018Publication date: May 14, 2020Applicant: DAICEL CORPORATIONInventors: Akira YAMAKAWA, Naoko TSUJI
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Patent number: 10619047Abstract: Provided is a curable composition having excellent film-formability and can be cured at low temperatures to form a cured product that has heat resistance, cracking resistance, and adhesiveness and adhesion to an adherend at excellent levels. The curable composition according to the present invention is a composition containing polyorganosilsesquioxanes (A). The polyorganosilsesquioxanes (A) include (a-1) an epoxy-containing polyorganosilsesquioxane having a weight-average molecular weight of 3000 or more, and (a-2) an epoxy-containing polyorganosilsesquioxane having a weight-average molecular weight of 2500 or less. The polyorganosilsesquioxanes (A) contain the components (a-1) and (a-2) in a total content of 50 weight percent or more of the total amount of the polyorganosilsesquioxanes (A). The polyorganosilsesquioxanes (A) have a ratio in content (weight ratio) of (a-1) to (a-2) of from 10:90 to 70:30.Type: GrantFiled: June 7, 2016Date of Patent: April 14, 2020Assignee: DAICEL CORPORATIONInventors: Naoko Tsuji, Hiroki Tanaka, Akira Yamakawa, Akihiro Shibamoto, Nobuhiko Harada
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Publication number: 20200071579Abstract: Provided is an adhesive composition that can be cured at low temperatures and can form a cured product having excellent insulating property, heat resistance, and adhesiveness. The adhesive composition according to the present invention includes polyorganosilsesquioxane (A) including a constituent unit represented by Formula (1) below, R1SiO3/2(1), in Formula (1), R1 represents a group containing a radically polymerizable group. In the polyorganosilsesquioxane (A), a proportion of the constituent unit represented by Formula (1) and a constituent unit represented by the following Formula (2), relative to a total amount (100 mol %) of siloxane constituent units, is from 55 to 100 mol %, R1SiO2/2(OR2) (2), in Formula (2), R1 is as defined above, and R2 is a hydrogen atom or an alkyl group having from 1 to 4 carbons. The polyorganosilsesquioxane (A) has a number average molecular weight from 1500 to 50000 and a molecular weight dispersity (weight average molecular weight/number average molecular weight) from 1.Type: ApplicationFiled: May 16, 2018Publication date: March 5, 2020Applicant: DAICEL CORPORATIONInventors: Akihiro SHIBAMOTO, Shinji MAETANI, Kazuhiro NISHIDA, Daisuke USA, Akira YAMAKAWA, Naoko TSUJI
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Patent number: 10079786Abstract: The present disclosure provides methods and apparatus for enhanced messaging. Specifically, methods and apparatus are presented for transmitting a communication characteristic indicator of a communication message substantially simultaneous to an input of data defining at least a portion of the communication message at the sending device. In one aspect, the communication characteristic indicator represents one or more characteristics of the data.Type: GrantFiled: September 3, 2012Date of Patent: September 18, 2018Assignee: QUALCOMM IncorporatedInventors: Devender Akira Yamakawa, Kameron N. Kerger, Paul J. Lafata
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Publication number: 20180171193Abstract: Provided is a curable composition that can, when cured, form a cured product having adhesiveness and adhesion to an adherend at excellent levels. The curable composition contains a polyorganosilsesquioxane and one of (A) a compound represented by Formula (X); and (B) a polymerization stabilizer, where Formula (X) is expressed as follows: wherein r1 represents an integer from 4 to 20; L represents a group containing epoxy, oxetanyl or vinyl ether group; R11 and R12 each represent an optionally substituted hydrocarbon group; s1 represents an integer from 1 to 3; t1 represents an integer from 0 to 2, where s1 plus t1 equals 3; and R13 and R14 are selected from hydrogen and an optionally substituted hydrocarbon group. The polyorganosilsesquioxane has a number-average molecular weight of 1000 to 3000 and a molecular-weight dispersity of 1.0 to 3.Type: ApplicationFiled: June 13, 2016Publication date: June 21, 2018Applicant: DAICEL CORPORATIONInventors: Hiroki TANAKA, Naoko TSUJI, Akira YAMAKAWA
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Publication number: 20180163049Abstract: Provided is a curable composition having excellent film-formability and can be cured at low temperatures to form a cured product that has heat resistance, cracking resistance, and adhesiveness and adhesion to an adherend at excellent levels. The curable composition according to the present invention is a composition containing polyorganosilsesquioxanes (A). The polyorganosilsesquioxanes (A) include (a-1) an epoxy-containing polyorganosilsesquioxane having a weight-average molecular weight of 3000 or more, and (a-2) an epoxy-containing polyorganosilsesquioxane having a weight-average molecular weight of 2500 or less. The polyorganosilsesquioxanes (A) contain the components (a-1) and (a-2) in a total content of 50 weight percent or more of the total amount of the polyorganosilsesquioxanes (A). The polyorganosilsesquioxanes (A) have a ratio in content (weight ratio) of (a-1) to (a-2) of from 10:90 to 70:30.Type: ApplicationFiled: June 7, 2016Publication date: June 14, 2018Applicant: DAICEL CORPORATIONInventors: Naoko TSUJI, Hiroki TANAKA, Akira YAMAKAWA, Akihiro SHIBAMOTO, Nobuhiko HARADA
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Publication number: 20170346767Abstract: The present disclosure provides methods and apparatus for enhanced messaging. Specifically, methods and apparatus are presented for transmitting a communication characteristic indicator of a communication message substantially simultaneous to an input of data defining at least a portion of the communication message at the sending device. In one aspect, the communication characteristic indicator represents one or more characteristics of the data.Type: ApplicationFiled: August 16, 2017Publication date: November 30, 2017Inventors: Devender Akira YAMAKAWA, Kameron N. KERGER, Paul J. LAFATA
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Publication number: 20170240429Abstract: A nanodiamond according to the present invention has acidic functional groups, contains the acidic functional groups in a number density of 1 or more per square nanometer in the nanodiamond surface, and has a specific surface area of 150 m2/g or more. Particles of the nanodiamond preferably have a D50 (median diameter) of 9 nm or less. The nanodiamond is preferably derived from a nanodiamond synthesized by a detonation technique (in particular, an air-cooling detonation technique).Type: ApplicationFiled: August 31, 2015Publication date: August 24, 2017Applicant: DAICEL CORPORATIONInventor: Akira YAMAKAWA
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Patent number: 9544497Abstract: Systems and methods for deductively determining a resolution setting for an imaging device based on one or more features of a scene are disclosed. The features may include the size of primary or foreground faces within the scene, a maximum amount of high frequency content within the scene, a lighting condition of the scene, or a battery level of an electronic device.Type: GrantFiled: May 21, 2014Date of Patent: January 10, 2017Assignee: QUALCOMM IncorporatedInventors: Babak Forutanpour, William Thomas Frantz, Shriram Ganesh, Daniel Scott Baker, Devender Akira Yamakawa
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Patent number: 9310217Abstract: Methods and apparatus for delivering content may include receiving a direction of travel for a wireless device and selecting a route of travel for the wireless device that proceeds in the given direction to maximize an amount of contact with one or more access terminals capable of providing data connectivity. In addition, the methods and apparatus may include providing content to the wireless device via the data connectivity provided by the one or more access terminals along the selected route of travel.Type: GrantFiled: June 12, 2012Date of Patent: April 12, 2016Assignee: QUALCOMM IncorporatedInventors: Babak Forutanpour, David L. Bednar, Devender Akira Yamakawa, Kevin Edward Hunter
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Publication number: 20150341535Abstract: Systems and methods for deductively determining a resolution setting for an imaging device based on one or more features of a scene are disclosed. The features may include the size of primary or foreground faces within the scene, a maximum amount of high frequency content within the scene, a lighting condition of the scene, or a battery level of an electronic device.Type: ApplicationFiled: May 21, 2014Publication date: November 26, 2015Applicant: QUALCOMM IncorporatedInventors: Babak Forutanpour, William Thomas Frantz, Shriram Ganesh, Daniel Scott Baker, Devender Akira Yamakawa
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Patent number: 9195898Abstract: Implementations relate to systems and methods for real-time image recognition and mobile visual searching. A mobile device, such as a cellular phone, acquires an image and pre-processes the acquired image to generate a visual search query based on objects detected in the acquired image. The visual search query includes the acquired image or a query image extracted therefrom and metadata associated with the detected objects. The mobile device wirelessly communicates the visual search query to a remote server, and in response to the visual search query, the remote server recognizes an object in the query image based on the associated metadata. The remote server then generates information content based on the recognized object and communicates the information content to the mobile device to be presented via the mobile device.Type: GrantFiled: August 7, 2009Date of Patent: November 24, 2015Assignee: QUALCOMM IncorporatedInventors: Joseph Jyh-Huei Huang, Chang Yong, Hsiang-Tsun Li, Devender Akira Yamakawa, Jose Ricardo Dos Santos
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Publication number: 20140067965Abstract: The present disclosure provides methods and apparatus for enhanced messaging. Specifically, methods and apparatus are presented for transmitting a communication characteristic indicator of a communication message substantially simultaneous to an input of data defining at least a portion of the communication message at the sending device. In one aspect, the communication characteristic indicator represents one or more characteristics of the data.Type: ApplicationFiled: September 3, 2012Publication date: March 6, 2014Inventors: Devender Akira YAMAKAWA, Kameron N. KERGER, Paul J. LAFATA