Patents by Inventor Akira Yamakawa

Akira Yamakawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11927125
    Abstract: A prediction device that predicts time for a reducing agent accommodated in a container mounted on a work vehicle to freeze includes a remaining amount information acquisition unit configured to acquire remaining amount information indicating a remaining amount of the reducing agent in the container, a wall surface temperature acquisition unit configured to acquire a detection result of a wall surface temperature of the container, a reducing agent temperature acquisition unit configured to acquire a detection result of a temperature of the reducing agent, and a time calculation unit configured to calculate the time for the reducing agent to freeze based on the wall surface temperature, the reducing agent temperature, and the remaining amount information.
    Type: Grant
    Filed: July 16, 2020
    Date of Patent: March 12, 2024
    Assignee: Komatsu Ltd.
    Inventors: Akira Oka, Tatsuya Yamakawa, Yohei Nishikawa
  • Publication number: 20240071678
    Abstract: A transformer device according to the disclosure includes a transformer and a cooling device that cools the transformer. The transformer includes a primary coil, a secondary coil, and a first core and a second core, into which the primary and secondary coils are respectively inserted. The first and second cores are disposed to face each other. The first core includes a first core part and a second core part, each of the first and second core parts formed by dividing the first core in a predetermined division plane. The first and second core parts of the first core are disposed to face each other through a gap, and in which the first core and the cooling device are disposed to face each other.
    Type: Application
    Filed: December 24, 2021
    Publication date: February 29, 2024
    Inventors: Akira KATO, Takehiko YAMAKAWA
  • Patent number: 11791284
    Abstract: Provided is a method suitable for efficiently manufacturing a semiconductor device while preventing warpage of the wafer laminate in manufacturing a semiconductor device in which semiconductor elements are multilayered through laminating wafers in which the semiconductor elements are fabricated. The method includes at least: preparing a plurality of first wafer laminates each having a laminate configuration including a first and second wafers each having an element forming surface and a back surface opposite from the element forming surface, the laminate configuration wherein the element forming surface sides of the first and second wafers are bonded to each other; thinning the first wafer of the first wafer laminate to form a first wafer laminate having the thinned first wafer; and bonding the thinned first wafer sides of two first wafer laminates having undergone the thinning to each other to form a second wafer laminate.
    Type: Grant
    Filed: October 18, 2019
    Date of Patent: October 17, 2023
    Assignee: Daicel Corporation
    Inventors: Naoko Tsuji, Akira Yamakawa, Katsuhiko Sumita
  • Publication number: 20210358867
    Abstract: Provided is a method suitable for efficiently manufacturing a semiconductor device while preventing warpage of the wafer laminate in manufacturing a semiconductor device in which semiconductor elements are multilayered through laminating wafers in which the semiconductor elements are fabricated. The method includes at least: preparing a plurality of first wafer laminates each having a laminate configuration including a first and second wafers each having an element forming surface and a back surface opposite from the element forming surface, the laminate configuration wherein the element forming surface sides of the first and second wafers are bonded to each other; thinning the first wafer of the first wafer laminate to form a first wafer laminate having the thinned first wafer; and bonding the thinned first wafer sides of two first wafer laminates having undergone the thinning to each other to form a second wafer laminate.
    Type: Application
    Filed: October 18, 2019
    Publication date: November 18, 2021
    Applicant: DAICEL CORPORATION
    Inventors: Naoko TSUJI, Akira YAMAKAWA, Katsuhiko SUMITA
  • Patent number: 11149118
    Abstract: The present invention provides an insulating film forming composition that excels in insulating properties and heat resistance, suppresses the occurrence of warpage, and can form an insulating film with excellent adhesion. The insulating film forming composition of the present invention contains, as a polymerizable compound, a polyorganosilsesquioxane containing siloxane constituent units; wherein the total content of: constituent units represented by formula (I) [RaSiO3/2] (I) and constituent units represented by formula (II) [RaSiO2/2(ORb)] (II) is greater than or equal to 55 mol % of the total amount of the siloxane constituent units; and the polyorganosilsesquioxane has a number average molecular weight of from 500 to 10000 and an epoxy equivalent of from 200 to 2000 g/eq.
    Type: Grant
    Filed: April 26, 2018
    Date of Patent: October 19, 2021
    Assignee: DAICEL CORPORATION
    Inventors: Hiroto Miyake, Naoko Tsuji, Akira Yamakawa
  • Patent number: 11066586
    Abstract: Provided is a curable composition that can, when cured, form a cured product having adhesiveness and adhesion to an adherend at excellent levels. The curable composition contains a polyorganosilsesquioxane and one of (A) a compound represented by Formula (X); and (B) a polymerization stabilizer, where Formula (X) is expressed as follows: wherein r1 represents an integer from 4 to 20; L represents a group containing epoxy, oxetanyl or vinyl ether group; R11 and R12 each represent an optionally substituted hydrocarbon group; s1 represents an integer from 1 to 3; t1 represents an integer from 0 to 2, where s1 plus t1 equals 3; and R13 and R14 are selected from hydrogen and an optionally substituted hydrocarbon group. The polyorganosilsesquioxane has a number-average molecular weight of 1000 to 3000 and a molecular-weight dispersity of 1.0 to 3.
    Type: Grant
    Filed: June 13, 2016
    Date of Patent: July 20, 2021
    Assignee: DAICEL CORPORATION
    Inventors: Hiroki Tanaka, Naoko Tsuji, Akira Yamakawa
  • Publication number: 20210139652
    Abstract: The present invention provides an insulating film forming composition that excels in insulating properties and heat resistance, suppresses the occurrence of warpage, and can form an insulating film with excellent adhesion. The insulating film forming composition of the present invention contains, as a polymerizable compound, a polyorganosilsesquioxane containing siloxane constituent units; wherein the total content of: constituent units represented by formula (I) [RaSiO3/2] (I) and constituent units represented by formula (II) [RaSiO2/2(ORb)] (II) is greater than or equal to 55 mol % of the total amount of the siloxane constituent units; and the polyorganosilsesquioxane has a number average molecular weight of from 500 to 10000 and an epoxy equivalent of from 200 to 2000 g/eq.
    Type: Application
    Filed: April 26, 2018
    Publication date: May 13, 2021
    Applicant: DAICEL CORPORATION
    Inventors: Hiroto MIYAKE, Naoko TSUJI, Akira YAMAKAWA
  • Publication number: 20200148926
    Abstract: The present invention is to provide a curable composition for adhesive agents that cures at a low temperature and that can form a cured article having excellent heat resistance, crack resistance, and adhesive properties and tight bonding properties for adhereds.
    Type: Application
    Filed: May 16, 2018
    Publication date: May 14, 2020
    Applicant: DAICEL CORPORATION
    Inventors: Akira YAMAKAWA, Naoko TSUJI
  • Patent number: 10619047
    Abstract: Provided is a curable composition having excellent film-formability and can be cured at low temperatures to form a cured product that has heat resistance, cracking resistance, and adhesiveness and adhesion to an adherend at excellent levels. The curable composition according to the present invention is a composition containing polyorganosilsesquioxanes (A). The polyorganosilsesquioxanes (A) include (a-1) an epoxy-containing polyorganosilsesquioxane having a weight-average molecular weight of 3000 or more, and (a-2) an epoxy-containing polyorganosilsesquioxane having a weight-average molecular weight of 2500 or less. The polyorganosilsesquioxanes (A) contain the components (a-1) and (a-2) in a total content of 50 weight percent or more of the total amount of the polyorganosilsesquioxanes (A). The polyorganosilsesquioxanes (A) have a ratio in content (weight ratio) of (a-1) to (a-2) of from 10:90 to 70:30.
    Type: Grant
    Filed: June 7, 2016
    Date of Patent: April 14, 2020
    Assignee: DAICEL CORPORATION
    Inventors: Naoko Tsuji, Hiroki Tanaka, Akira Yamakawa, Akihiro Shibamoto, Nobuhiko Harada
  • Publication number: 20200071579
    Abstract: Provided is an adhesive composition that can be cured at low temperatures and can form a cured product having excellent insulating property, heat resistance, and adhesiveness. The adhesive composition according to the present invention includes polyorganosilsesquioxane (A) including a constituent unit represented by Formula (1) below, R1SiO3/2(1), in Formula (1), R1 represents a group containing a radically polymerizable group. In the polyorganosilsesquioxane (A), a proportion of the constituent unit represented by Formula (1) and a constituent unit represented by the following Formula (2), relative to a total amount (100 mol %) of siloxane constituent units, is from 55 to 100 mol %, R1SiO2/2(OR2) (2), in Formula (2), R1 is as defined above, and R2 is a hydrogen atom or an alkyl group having from 1 to 4 carbons. The polyorganosilsesquioxane (A) has a number average molecular weight from 1500 to 50000 and a molecular weight dispersity (weight average molecular weight/number average molecular weight) from 1.
    Type: Application
    Filed: May 16, 2018
    Publication date: March 5, 2020
    Applicant: DAICEL CORPORATION
    Inventors: Akihiro SHIBAMOTO, Shinji MAETANI, Kazuhiro NISHIDA, Daisuke USA, Akira YAMAKAWA, Naoko TSUJI
  • Patent number: 10079786
    Abstract: The present disclosure provides methods and apparatus for enhanced messaging. Specifically, methods and apparatus are presented for transmitting a communication characteristic indicator of a communication message substantially simultaneous to an input of data defining at least a portion of the communication message at the sending device. In one aspect, the communication characteristic indicator represents one or more characteristics of the data.
    Type: Grant
    Filed: September 3, 2012
    Date of Patent: September 18, 2018
    Assignee: QUALCOMM Incorporated
    Inventors: Devender Akira Yamakawa, Kameron N. Kerger, Paul J. Lafata
  • Publication number: 20180171193
    Abstract: Provided is a curable composition that can, when cured, form a cured product having adhesiveness and adhesion to an adherend at excellent levels. The curable composition contains a polyorganosilsesquioxane and one of (A) a compound represented by Formula (X); and (B) a polymerization stabilizer, where Formula (X) is expressed as follows: wherein r1 represents an integer from 4 to 20; L represents a group containing epoxy, oxetanyl or vinyl ether group; R11 and R12 each represent an optionally substituted hydrocarbon group; s1 represents an integer from 1 to 3; t1 represents an integer from 0 to 2, where s1 plus t1 equals 3; and R13 and R14 are selected from hydrogen and an optionally substituted hydrocarbon group. The polyorganosilsesquioxane has a number-average molecular weight of 1000 to 3000 and a molecular-weight dispersity of 1.0 to 3.
    Type: Application
    Filed: June 13, 2016
    Publication date: June 21, 2018
    Applicant: DAICEL CORPORATION
    Inventors: Hiroki TANAKA, Naoko TSUJI, Akira YAMAKAWA
  • Publication number: 20180163049
    Abstract: Provided is a curable composition having excellent film-formability and can be cured at low temperatures to form a cured product that has heat resistance, cracking resistance, and adhesiveness and adhesion to an adherend at excellent levels. The curable composition according to the present invention is a composition containing polyorganosilsesquioxanes (A). The polyorganosilsesquioxanes (A) include (a-1) an epoxy-containing polyorganosilsesquioxane having a weight-average molecular weight of 3000 or more, and (a-2) an epoxy-containing polyorganosilsesquioxane having a weight-average molecular weight of 2500 or less. The polyorganosilsesquioxanes (A) contain the components (a-1) and (a-2) in a total content of 50 weight percent or more of the total amount of the polyorganosilsesquioxanes (A). The polyorganosilsesquioxanes (A) have a ratio in content (weight ratio) of (a-1) to (a-2) of from 10:90 to 70:30.
    Type: Application
    Filed: June 7, 2016
    Publication date: June 14, 2018
    Applicant: DAICEL CORPORATION
    Inventors: Naoko TSUJI, Hiroki TANAKA, Akira YAMAKAWA, Akihiro SHIBAMOTO, Nobuhiko HARADA
  • Publication number: 20170346767
    Abstract: The present disclosure provides methods and apparatus for enhanced messaging. Specifically, methods and apparatus are presented for transmitting a communication characteristic indicator of a communication message substantially simultaneous to an input of data defining at least a portion of the communication message at the sending device. In one aspect, the communication characteristic indicator represents one or more characteristics of the data.
    Type: Application
    Filed: August 16, 2017
    Publication date: November 30, 2017
    Inventors: Devender Akira YAMAKAWA, Kameron N. KERGER, Paul J. LAFATA
  • Publication number: 20170240429
    Abstract: A nanodiamond according to the present invention has acidic functional groups, contains the acidic functional groups in a number density of 1 or more per square nanometer in the nanodiamond surface, and has a specific surface area of 150 m2/g or more. Particles of the nanodiamond preferably have a D50 (median diameter) of 9 nm or less. The nanodiamond is preferably derived from a nanodiamond synthesized by a detonation technique (in particular, an air-cooling detonation technique).
    Type: Application
    Filed: August 31, 2015
    Publication date: August 24, 2017
    Applicant: DAICEL CORPORATION
    Inventor: Akira YAMAKAWA
  • Patent number: 9544497
    Abstract: Systems and methods for deductively determining a resolution setting for an imaging device based on one or more features of a scene are disclosed. The features may include the size of primary or foreground faces within the scene, a maximum amount of high frequency content within the scene, a lighting condition of the scene, or a battery level of an electronic device.
    Type: Grant
    Filed: May 21, 2014
    Date of Patent: January 10, 2017
    Assignee: QUALCOMM Incorporated
    Inventors: Babak Forutanpour, William Thomas Frantz, Shriram Ganesh, Daniel Scott Baker, Devender Akira Yamakawa
  • Patent number: 9310217
    Abstract: Methods and apparatus for delivering content may include receiving a direction of travel for a wireless device and selecting a route of travel for the wireless device that proceeds in the given direction to maximize an amount of contact with one or more access terminals capable of providing data connectivity. In addition, the methods and apparatus may include providing content to the wireless device via the data connectivity provided by the one or more access terminals along the selected route of travel.
    Type: Grant
    Filed: June 12, 2012
    Date of Patent: April 12, 2016
    Assignee: QUALCOMM Incorporated
    Inventors: Babak Forutanpour, David L. Bednar, Devender Akira Yamakawa, Kevin Edward Hunter
  • Publication number: 20150341535
    Abstract: Systems and methods for deductively determining a resolution setting for an imaging device based on one or more features of a scene are disclosed. The features may include the size of primary or foreground faces within the scene, a maximum amount of high frequency content within the scene, a lighting condition of the scene, or a battery level of an electronic device.
    Type: Application
    Filed: May 21, 2014
    Publication date: November 26, 2015
    Applicant: QUALCOMM Incorporated
    Inventors: Babak Forutanpour, William Thomas Frantz, Shriram Ganesh, Daniel Scott Baker, Devender Akira Yamakawa
  • Patent number: 9195898
    Abstract: Implementations relate to systems and methods for real-time image recognition and mobile visual searching. A mobile device, such as a cellular phone, acquires an image and pre-processes the acquired image to generate a visual search query based on objects detected in the acquired image. The visual search query includes the acquired image or a query image extracted therefrom and metadata associated with the detected objects. The mobile device wirelessly communicates the visual search query to a remote server, and in response to the visual search query, the remote server recognizes an object in the query image based on the associated metadata. The remote server then generates information content based on the recognized object and communicates the information content to the mobile device to be presented via the mobile device.
    Type: Grant
    Filed: August 7, 2009
    Date of Patent: November 24, 2015
    Assignee: QUALCOMM Incorporated
    Inventors: Joseph Jyh-Huei Huang, Chang Yong, Hsiang-Tsun Li, Devender Akira Yamakawa, Jose Ricardo Dos Santos
  • Publication number: 20140067965
    Abstract: The present disclosure provides methods and apparatus for enhanced messaging. Specifically, methods and apparatus are presented for transmitting a communication characteristic indicator of a communication message substantially simultaneous to an input of data defining at least a portion of the communication message at the sending device. In one aspect, the communication characteristic indicator represents one or more characteristics of the data.
    Type: Application
    Filed: September 3, 2012
    Publication date: March 6, 2014
    Inventors: Devender Akira YAMAKAWA, Kameron N. KERGER, Paul J. LAFATA