Abstract: A complementary wiring package including a package, a first set of external pins mounted in a central region on a top surface of the package in a vertical direction and connected to a plurality of respectively corresponding through holes, a second set of external pins being mounted in a perimeter region on a top surface of the package in a vertical direction and connected to printed wiring of a printed wiring board, and a plurality of internal lines that connect the first set of external pins to the second set of external pins. The complementary wiring package does not require a semi-conductor integrated circuit and is capable of being coupled with an semi-conductor integrated circuit package via the plurality of respectively corresponding through holes of the printed wiring board which is sandwiched between the complementary wiring package and the semi-conductor integrated circuit package.