Patents by Inventor Akira Yoshizumo

Akira Yoshizumo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device encapsulant consisting of epoxy resin composition
    Patent number: 5068267
    Abstract: An encapsulant consisting of an epoxy resin composition and suitably used to encapsulate a semiconductor device which is to be surface-mounted contains(a) an epoxy resin,(b) a rubber-modified phenolic resin comprising a phenolic resin, and a methylmethacrylate-butadiene-styrene copolymer and a thermosetting silicon rubber dispersed in said phenolic resin,(c) a curing accelerator, and(d) a silica powder.
    Type: Grant
    Filed: September 12, 1989
    Date of Patent: November 26, 1991
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Ken Uchida, Michiya Higashi, Naoko Kihara, Hiroshi Shimozawa, Akira Yoshizumo