Patents by Inventor Akisuke Hirata

Akisuke Hirata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8216654
    Abstract: There are provided a film forming equipment component having a structure in which an deposited film d formed on the component can be separated from the component for a time period shorter than the prior art to reduce damage due to a cleaning fluid S, and a method of cleaning such a component. A metal film layer 2 electrochemically less noble than the matrix metal material 1 of the aforementioned component is formed on the surface of the matrix metal material 1 through thermal spraying, vapor depositing, sputtering, laminating or other process. Alternatively, a second metal film layer 3 electrochemically more noble than the aforementioned matrix metal material 1 is formed on the surface of the metal film layer 2 through said thermal spraying or other process. Thus, a local cell is formed between the metal film layer 2 and the matrix metal material 1 or the second metal film layer 3.
    Type: Grant
    Filed: February 18, 2004
    Date of Patent: July 10, 2012
    Assignee: Ulvac, Inc.
    Inventors: Akisuke Hirata, Shinji Isoda, Yutaka Kadowaki, Katsuhiko Mushiake
  • Publication number: 20110200481
    Abstract: In An Al composite material collapsible in the presence of moisture, the external surface of small pieces or powder constructed from a single or a plurality of crystalline grains of Al or an Al alloy is covered with a film of a low melting point metal or alloy selected from the group consisting of In, Sn, combinations of In and Sn, and alloys thereof. The content of the foregoing low melting point metal or alloy ranges from 0.1 to 20% by mass on the basis of the total mass of the composite material. A material obtained by adding a low melting point metal in an amount specified above to, for instance, Al and then fusing and melting the resulting mixture is quenched and solidified within a non-oxidizing atmosphere to thus form an Al composite material. An Al film, an Al spray-coated film and Al powder can be prepared from the foregoing Al composite material. A component member for a film-forming chamber is also provided, which is provided with a water-collapsible Al film on the surface thereof.
    Type: Application
    Filed: April 21, 2011
    Publication date: August 18, 2011
    Applicant: ULVAC, INC.
    Inventors: Akisuke HIRATA, Shinji Isoda, Yutaka Kadowaki, Katsuhiko Mushiake
  • Publication number: 20110192546
    Abstract: In An Al composite material collapsible in the presence of moisture, the external surface of small pieces or powder constructed from a single or a plurality of crystalline grains of Al or an Al alloy is covered with a film of a low melting point metal or alloy selected from the group consisting of In, Sn, combinations of In and Sn, and alloys thereof. The content of the foregoing low melting point metal or alloy ranges from 0.1 to 20% by mass on the basis of the total mass of the composite material. A material obtained by adding a low melting point metal in an amount specified above to, for instance, Al and then fusing and melting the resulting mixture is quenched and solidified within a non-oxidizing atmosphere to thus form an Al composite material. An Al film, an Al spray-coated film and Al powder can be prepared from the foregoing Al composite material. A component member for a film-forming chamber is also provided, which is provided with a water-collapsible Al film on the surface thereof.
    Type: Application
    Filed: April 21, 2011
    Publication date: August 11, 2011
    Applicant: ULVAC, INC.
    Inventors: Akisuke HIRATA, Shinji Isoda, Yutaka Kadowaki, Katsuhiko Mushiake
  • Patent number: 7951463
    Abstract: In an Al composite material collapsible in the presence of moisture, the external surface of small pieces or powder constructed from a single or a plurality of crystalline grains of Al or an Al alloy is covered with a film of a low melting point metal or alloy selected from the group consisting of In, Sn, combinations of In and Sn, and alloys thereof. The content of the foregoing low melting point metal or alloy ranges from 0.1 to 20% by mass on the basis of the total mass of the composite material. A component member for a film-forming chamber is also provided, which is provided with a water-collapsible Al film on the surface thereof. Film-forming operations are continued over a long period of time using the component member for a film-forming chamber provided with the water-collapsible Al film and then film-forming materials can be recovered from the component member on which the film-forming materials are deposited in a substantial thickness.
    Type: Grant
    Filed: March 4, 2005
    Date of Patent: May 31, 2011
    Assignee: Ulvac, Inc.
    Inventors: Akisuke Hirata, Shinji Isoda, Yutaka Kadowaki, Katsuhiko Mushiake
  • Patent number: 7436068
    Abstract: Herein disclosed are a component of a film-forming device, in which a thin films is formed on a substrate using a film-forming material, whose surface structure makes any breakage, peeling off and/or falling off of a film adhered to the component quite difficult, while the structure permits easy removal of such an adhered film within a short period of time when cleaning the component as sell as a method for cleaning the component. A large number of through holes each extending from the back face to the top face of the component are formed for the penetration of a cleaning solution into the boundary between the component and a film of the film-forming material adhered to the surface of the component and formed during the formation of the foregoing thin film. This easily allows the peeling off and removal of the film adhered to the component within a short period of time as compared when the adhered film is dissolved only from the surface thereof.
    Type: Grant
    Filed: January 22, 2004
    Date of Patent: October 14, 2008
    Assignee: Ulvac, Inc.
    Inventors: Akisuke Hirata, Shinji Isoda, Yutaka Kadowaki, Katsuhiko Mushiake
  • Publication number: 20060246735
    Abstract: There are provided a film forming equipment component having a structure in which an deposited film d formed on the component can be separated from the component for a time period shorter than the prior art to reduce damage due to a cleaning fluid S, and a method of cleaning such a component. A metal film layer 2 electrochemically less noble than the matrix metal material 1 of the aforementioned component is formed on the surface of the matrix metal material 1 through thermal spraying, vapor depositing, sputtering, laminating or other process. Alternatively, a second metal film layer 3 electrochemically more noble than the aforementioned matrix metal material 1 is formed on the surface of the metal film layer 2 through said thermal spraying or other process. Thus, a local cell is formed between the metal film layer 2 and the matrix metal material 1 or the second metal film layer 3.
    Type: Application
    Filed: February 18, 2004
    Publication date: November 2, 2006
    Inventors: Akisuke Hirata, Shinji Isoda, Yutaka Kadowaki, Katsuhiko Mushiake
  • Publication number: 20060240271
    Abstract: In An Al composite material collapsible in the presence of moisture, the external surface of small pieces or powder constructed from a single or a plurality of crystalline grains of Al or an Al alloy is covered with a film of a low melting point metal or alloy selected from the group consisting of In, Sn, combinations of In and Sn, and alloys thereof. The content of the foregoing low melting point metal or alloy ranges from 0.1 to 20% by mass on the basis of the total mass of the composite material. A material obtained by adding a low melting point metal in an amount specified above to, for instance, Al and then fusing and melting the resulting mixture is quenched and solidified within a non-oxidizing atmosphere to thus form an Al composite material. An Al film, an Al spray-coated film and Al powder can be prepared from the foregoing Al composite material. A component member for a film-forming chamber is also provided, which is provided with a water-collapsible Al film on the surface thereof.
    Type: Application
    Filed: March 4, 2005
    Publication date: October 26, 2006
    Inventors: Akisuke Hirata, Shinji Isoda, Yutaka Kadowaki, Katsuhiko Mushiake
  • Publication number: 20060144418
    Abstract: Herein disclosed are a component of a film-forming device, in which a thin films is formed on a substrate using a film-forming material, whose surface structure makes any breakage, peeling off and/or falling off of a film adhered to the component quite difficult, while the structure permits easy removal of such an adhered film within a short period of time when cleaning the component as sell as a method for cleaning the component. A large number of through holes each extending from the back face to the top face of the component are formed for the penetration of a cleaning solution into the boundary between the component and a film of the film-forming material adhered to the surface of the component and formed during the formation of the foregoing thin film. This easily allows the peeling off and removal of the film adhered to the component within a short period of time as compared when the adhered film is dissolved only from the surface thereof.
    Type: Application
    Filed: January 22, 2004
    Publication date: July 6, 2006
    Inventors: Akisuke Hirata, Shinji Isoda, Yutaka Kadowaki, Katsuhiko Mushiake
  • Publication number: 20010016115
    Abstract: A panel heater is made of a metallic panel member and an ohmic heat generating body which is covered with a sheath member and which is embedded in the metallic panel member. One of the sheath member and the panel member is formed by a first material capable of being alloyed with, and having a coefficient of thermal expansion close to a coefficient of thermal expansion of, a second material for the other of the sheath member and the panel member. The sheath member and the panel member are seamlessly integrated by diffusion bonding at a high temperature and high pressure.
    Type: Application
    Filed: January 31, 2001
    Publication date: August 23, 2001
    Inventors: Akisuke Hirata, Masami Ohtugu