Abstract: A multilayer ceramic capacitor includes dielectric layers and internal electrode layers. Internal electrode layers adjacent to a first main surface define first main surface-side internal electrode layers, and internal electrode layers adjacent to the second main surface define second main surface-side internal electrode layers, first solid solution layers including a second metal as a solid solution is provided at interfaces between the first main surface-side internal electrode layers and the dielectric layers, the interfaces being in the first main surface-side internal electrode layers, and second solid solution layers including the second metal as a solid solution is provided at interfaces between the second main surface-side internal electrode layers and the dielectric layers, the interfaces being in the second main surface-side internal electrode layers. A concentration of the second metal in the second solid solution layer is higher than that of the second metal in the first solid solution layer.

Abstract: A multilayer ceramic electronic component includes a multilayer body and an external electrode on each of both end surfaces of the multilayer body. The external electrode includes an underlying electrode layer and a plating layer that is disposed on the underlying electrode layer. The underlying electrode layer includes Ni as a first metal component, Sn as a second metal component, and a ceramic material, and includes an alloy portion that is provided around the ceramic material and includes an alloyed Ni defining the first metal component and an alloyed Sn defining the second metal component.

Abstract: A multilayer ceramic capacitor includes dielectric layers and internal electrode layers. Internal electrode layers adjacent to a first main surface define first main surface-side internal electrode layers, and internal electrode layers adjacent to the second main surface define second main surface-side internal electrode layers, first solid solution layers including a second metal as a solid solution is provided at interfaces between the first main surface-side internal electrode layers and the dielectric layers, the interfaces being in the first main surface-side internal electrode layers, and second solid solution layers including the second metal as a solid solution is provided at interfaces between the second main surface-side internal electrode layers and the dielectric layers, the interfaces being in the second main surface-side internal electrode layers. A concentration of the second metal in the second solid solution layer is higher than that of the second metal in the first solid solution layer.

Abstract: A multilayer ceramic capacitor includes dielectric layers including Ba and Ti, and internal electrode layers including Ni. A dimension L0 in a length direction, a dimension T0 in a lamination direction, and a dimension W0 in a width direction satisfy 1.7?L0/T0?2.3 and 1.0?W0/T0?1.4. Adjacent ends of the internal electrode layers have a positional deviation of about 5 ?m or less in the width direction. Segregation of Sn with an atomic composition percentage of about 2 at % or higher occurs at an interface between the internal electrode layer and the dielectric layer. A dimension of each side gap portion in the width direction is WS, a dimension of each outer layer portion in the lamination direction is TG, and 0.3?WS/TG?0.6. For each internal electrode layer, a dimension in the width direction is WI, and T0<WI.

Abstract: A multilayer ceramic capacitor includes a multilayer body and a pair of external electrodes at both ends of the multilayer body in a length direction and covering a pair of end surfaces, and connected to internal electrode layers. The pair of external electrodes each include a first external electrode layer covering each of the end surfaces and connected to the internal electrode layers, a second external electrode layer on the first external electrode layer, and a plated layer on the second external electrode layer, the first external electrode layer includes Ni and dielectric particles, the second external electrode layer includes Cu and glass, and a metal group including at least one of Sn, In, Ga, Zn, Bi, Pb, Fe, V, Y, or Cu is included at an interface between the first and second external electrode layers.

Abstract: An electronic component includes a multilayer body including inner electrodes and dielectric layers alternately stacked, and an outer electrode electrically connected to the inner electrodes. The multilayer body includes first and second main surfaces opposite to each other in a stacking direction, first and second side surfaces opposite to each other in a width direction, and first and second end surfaces opposite to each other in a length direction. The outer electrode includes first outer electrodes disposed on the first and second end surfaces, and at least one second outer electrode disposed on at least one of the first and second side surfaces. The at least one second outer electrode is directly connected to the inner electrodes at positions spaced away from the at least one of the first or second side surface toward the inside of the multilayer body.

Abstract: A multilayer ceramic capacitor includes a multilayer body and a pair of external electrodes at both ends of the multilayer body in a length direction and covering a pair of end surfaces, and connected to internal electrode layers. The pair of external electrodes each include a first external electrode layer covering each of the end surfaces and connected to the internal electrode layers, a second external electrode layer on the first external electrode layer, and a plated layer on the second external electrode layer, the first external electrode layer includes Ni and dielectric particles, the second external electrode layer includes Cu and glass, and a metal group including at least one of Sn, In, Ga, Zn, Bi, Pb, Fe, V, Y, or Cu is included at an interface between the first and second external electrode layers.

Abstract: A multilayer ceramic electronic component includes a multilayer body and an external electrode on each of both end surfaces of the multilayer body. The external electrode includes an underlying electrode layer and a plating layer that is disposed on the underlying electrode layer. The underlying electrode layer includes Ni as a first metal component, Sn as a second metal component, and a ceramic material, and includes an alloy portion that is provided around the ceramic material and includes an alloyed Ni defining the first metal component and an alloyed Sn defining the second metal component.

Abstract: A multilayer ceramic electronic component includes a multilayer body and an external electrode on each of both end surfaces of the multilayer body. The external electrode includes an underlying electrode layer and a plating layer that is disposed on the underlying electrode layer. The underlying electrode layer includes Ni as a first metal component, Sn as a second metal component, and a ceramic material, and includes an alloy portion that is provided around the ceramic material and includes an alloyed Ni defining the first metal component and an alloyed Sn defining the second metal component.

Abstract: A multilayer ceramic electronic component includes a multilayer body and an external electrode on each of both end surfaces of the multilayer body. The external electrode includes an underlying electrode layer and a plating layer that is disposed on the underlying electrode layer. The underlying electrode layer includes Ni as a first metal component, Sn as a second metal component, and a ceramic material, and includes an alloy portion that is provided around the ceramic material and includes an alloyed Ni defining the first metal component and an alloyed Sn defining the second metal component.

Abstract: A multilayer ceramic capacitor includes a multilayer body and a pair of external electrodes at both ends of the multilayer body in a length direction and covering a pair of end surfaces, and connected to internal electrode layers. The pair of external electrodes each include a first external electrode layer covering each of the end surfaces and connected to the internal electrode layers, a second external electrode layer on the first external electrode layer, and a plated layer on the second external electrode layer, the first external electrode layer includes Ni and dielectric particles, the second external electrode layer includes Cu and glass, and a metal group including at least one of Sn, In, Ga, Zn, Bi, Pb, Fe, V, Y, or Cu is included at an interface between the first and second external electrode layers.

Abstract: A multilayer ceramic capacitor includes dielectric layers and internal electrode layers. Internal electrode layers adjacent to a first main surface define first main surface-side internal electrode layers, and internal electrode layers adjacent to the second main surface define second main surface-side internal electrode layers, first solid solution layers including a second metal as a solid solution is provided at interfaces between the first main surface-side internal electrode layers and the dielectric layers, the interfaces being in the first main surface-side internal electrode layers, and second solid solution layers including the second metal as a solid solution is provided at interfaces between the second main surface-side internal electrode layers and the dielectric layers, the interfaces being in the second main surface-side internal electrode layers. A concentration of the second metal in the second solid solution layer is higher than that of the second metal in the first solid solution layer.

Abstract: A multilayer ceramic electronic component includes a multilayer body and an external electrode on each of both end surfaces of the multilayer body. The external electrode includes an underlying electrode layer and a plating layer that is disposed on the underlying electrode layer. The underlying electrode layer includes Ni as a first metal component, Sn as a second metal component, and a ceramic material, and includes an alloy portion that is provided around the ceramic material and includes an alloyed Ni defining the first metal component and an alloyed Sn defining the second metal component.

Abstract: A multilayer ceramic capacitor includes a laminate including a dielectric ceramic layer and first and second electrode layers laminated in a lamination direction, and first and second external electrodes respectively connected to the first and second internal electrode layers. The laminate includes a central layer portion, a peripheral layer portion sandwiching the central layer portion, and a side margin sandwiching the central layer portion and the peripheral layer portion. The first and second internal electrode layers and the first and second external electrodes include Ni. In a cross section including the lamination direction and a width direction, a Ni content of the peripheral layer portion is larger at a surface portion than at a central portion in a thickness direction, and a Ni content of the side margin is larger at a surface portion than at a central portion in a thickness direction of the side margin.

Abstract: A multilayer ceramic capacitor includes a ceramic body including a stack of dielectric layers and internal electrodes, and an external electrode electrically connected to each of the internal electrodes and provided at each of both end surfaces of the ceramic body. The external electrode includes a metal layer and a plating layer on the metal layer. In a cross section of the metal layer that is obtained by cutting the external electrode along a plane parallel to a side surface at a central position in a width direction, the metal layer includes a dielectric material at an area ratio of about 20% or more, and includes cavities at an area ratio of about 5% or more and about 20% or less, the cavities having an average diameter of about 0.5 ?m or more and about 1.5 ?m or less, and having a maximum diameter of about 5.0 ?m or less.

Abstract: An electronic component includes a multilayer body including inner electrodes and dielectric layers alternately stacked, and an outer electrode electrically connected to the inner electrodes. The multilayer body includes first and second main surfaces opposite to each other in a stacking direction, first and second side surfaces opposite to each other in a width direction, and first and second end surfaces opposite to each other in a length direction. The outer electrode includes first outer electrodes disposed on the first and second end surfaces, and at least one second outer electrode disposed on at least one of the first and second side surfaces. The at least one second outer electrode is directly connected to the inner electrodes at positions spaced away from the at least one of the first or second side surface toward the inside of the multilayer body.

Abstract: An electronic component includes a multilayer body including inner electrodes and dielectric layers alternately stacked, and an outer electrode electrically connected to the inner electrodes. The multilayer body includes first and second main surfaces opposite to each other in a stacking direction, first and second side surfaces opposite to each other in a width direction, and first and second end surfaces opposite to each other in a length direction. The outer electrode includes first outer electrodes disposed on the first and second end surfaces, and at least one second outer electrode disposed on at least one of the first and second side surfaces. The at least one second outer electrode is directly connected to the inner electrodes at positions spaced away from the at least one of the first or second side surface toward the inside of the multilayer body.

Abstract: A multilayer ceramic electronic component includes a multilayer body and an external electrode on each of both end surfaces of the multilayer body. The external electrode includes an underlying electrode layer and a plating layer that is disposed on the underlying electrode layer. The underlying electrode layer includes Ni as a first metal component, Sn as a second metal component, and a ceramic material, and includes an alloy portion that is provided around the ceramic material and includes an alloyed Ni defining the first metal component and an alloyed Sn defining the second metal component.

Abstract: A multilayer ceramic capacitor includes a laminate including a dielectric ceramic layer and first and second electrode layers laminated in a lamination direction, and first and second external electrodes respectively connected to the first and second internal electrode layers. The laminate includes a central layer portion, a peripheral layer portion sandwiching the central layer portion, and a side margin sandwiching the central layer portion and the peripheral layer portion. The first and second internal electrode layers and the first and second external electrodes include Ni. In a cross section including the lamination direction and a width direction, a Ni content of the peripheral layer portion is larger at a surface portion than at a central portion in a thickness direction, and a Ni content of the side margin is larger at a surface portion than at a central portion in a thickness direction of the side margin.

Abstract: A multilayer ceramic capacitor includes a ceramic body including a stack of dielectric layers and internal electrodes, and an external electrode electrically connected to each of the internal electrodes and provided at each of both end surfaces of the ceramic body. The external electrode includes a metal layer and a plating layer on the metal layer. In a cross section of the metal layer that is obtained by cutting the external electrode along a plane parallel to a side surface at a central position in a width direction, the metal layer includes a dielectric material at an area ratio of about 20% or more, and includes cavities at an area ratio of about 5% or more and about 20% or less, the cavities having an average diameter of about 0.5 ?m or more and about 1.5 ?m or less, and having a maximum diameter of about 5.0 ?m or less.