Patents by Inventor Akiteru Nishio
Akiteru Nishio has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 6455809Abstract: A resin window 1 with a conductor in which a conductor print 3 is interposed between a resin panel 2 and a resin film 4 joined to one side of the resin panel, includes a metal film 6 provided on one side of the resin film 4 that is joined to the resin panel 2. The metal film 6 is connected to a conductor print 3 at a portion thereof and is exposed through an opening 5 formed in the resin film 4. The resin panel 2 has integrally formed fixing pins 7 that protrude to the outer surface side of the resin film 4 through the metal film 6. A terminal 8 is secured to a resin window 1 by heat treating the fixing pins 7 with a mounting base 8a of the terminal 8 made of electrically conductive material being overlaid on the metal film 6.Type: GrantFiled: June 12, 2000Date of Patent: September 24, 2002Assignee: Kabushiki Kaisha Toyoda Jidoshokki SeisakushoInventors: Hiroshi Kuno, Akiteru Nishio, Kotaro Oami, Yasushi Iimori
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Patent number: 6244653Abstract: A resin molded object 1 that may be used as a sunroof has a reinforcing rib 3 around the periphery of a window body 2 that is disposed inside a car. The window body 2 is molded using a fixed die 7 and one molding surface 8a of a first movable die 8, then the reinforcing rib 3 is molded on the window body 2 using the fixed die 7 and a second molding surface 8b of a second movable die 8 to thereby to fabricate a double-molded resin window.Type: GrantFiled: September 17, 1998Date of Patent: June 12, 2001Assignees: Kabushiki Kaisha Toyoda Jidoshokki Seisakusho, Mitsubishi Engineering Plastics CorporationInventors: Akiteru Nishio, Hiroyuki Imaizumi, Tsuneaki Iwakiri
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Patent number: 6151834Abstract: A window device for use in a motor vehicle, has at least one pair of mutually threadingly engageable male member and female member, one of which is fixed into a boss formed integrally with a resin window panel, the other of which is threaded to the above one member through a hole formed in the reinforcing member, so that a reinforcing member is interposed between two engaging faces of the male and female members. Further, a shoulder portion is formed on either the male member or the female member for maintaining a constant interval between the two engaging faces of the male and female members.Type: GrantFiled: July 28, 1998Date of Patent: November 28, 2000Assignee: Kabushiki Kaisha Toyoda Jidoshokki SeisakushoInventors: Kotaro Oami, Akiteru Nishio
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Patent number: 6103999Abstract: A resin window 1 with a conductor in which a conductor print 3 is interposed between a resin panel 2 and a resin film 4 joined to one side of the resin panel, includes a metal film 6 provided on one side of the resin film 4 that is joined to the resin panel 2. The metal film 6 is connected to a conductor print 3 at a portion thereof and is exposed through an opening 5 formed in the resin film 4. The resin panel 2 has integrally formed fixing pins 7 that protrude to the outer surface side of the resin film 4 through the metal film 6. A terminal 8 is secured to a resin window 1 by heat treating the fixing pins 7 with a mounting base 8a of the terminal 8 made of electrically conductive material being overlaid on the metal film 6.Type: GrantFiled: June 17, 1999Date of Patent: August 15, 2000Assignee: Kabushiki Kaisha Toyoda Jidoshokki SeisakushoInventors: Akiteru Nishio, Kotaro Oami, Yasushi Iimori, Hiroshi Kuno
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Patent number: 6103998Abstract: A resin window 1 with a conductor in which a conductor print 3 is interposed between a resin panel 2 and a resin film 4 joined to one side of the resin panel, includes a metal film 6 provided on one side of the resin film 4 that is joined to the resin panel 2. The metal film 6 is connected to a conductor print 3 at a portion thereof and is exposed through an opening 5 formed in the resin film 4. The resin panel 2 has integrally formed fixing pins 7 that protrude to the outer surface side of the resin film 4 through the metal film 6. A terminal 8 is secured to a resin window 1 by heat treating the fixing pins 7 with a mounting base 8a of the terminal 8 made of electrically conductive material being overlaid on the metal film 6.Type: GrantFiled: June 17, 1999Date of Patent: August 15, 2000Assignee: Kabushiki Kaisha Toyoda Jidoshokki SeisakushoInventors: Hiroshi Kuno, Akiteru Nishio, Kotaro Oami, Yasushi Iimori
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Patent number: 5992928Abstract: A sliding window slidably fitted in an opening of an automobile roof. A frame made of a hard material, which linear expansion coefficient is substantially equal to that of the vehicle body, is fit into the opening. A hard synthetic resin plate is fit into the frame with a flexible molding arranged therebetween. The molding has a thin section which absorbs deformation of the resin plate caused by changes in the temperature.Type: GrantFiled: October 28, 1996Date of Patent: November 30, 1999Assignee: Kabushiki Kaisha Toyoda Jidoshokki SeisakushoInventors: Yoshifumi Kato, Akiteru Nishio
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Patent number: 5783260Abstract: A thin-film forming method comprising an uncured-layer forming step in which a mixed composition containing an organic polymerizing agent curable composition and a silicone polymerizing curable composition is prepared to form an uncured layer consisting of this mixed composition on a resin substrate; a solvent removing step in which the solvent in the uncured layer is removed; a first polymerization curing step in which the organic polymerizing curable composition in the uncured layer is polymerized; and a second polymerization curing step in which the silicone polymerizing curable composition in the uncured layer is polymerized. The thin-film forming method can comprise formation of the uncured layer on a resin substrate through the intermediation of a primer layer or formation of an uncured underlayer and uncured top layer followed by separate underlayer polymerization and top layer polymerization curing steps.Type: GrantFiled: July 25, 1996Date of Patent: July 21, 1998Assignee: Kabushiki Kaisha Toyoda Jidoshokki SeisakushoInventors: Yoshifumi Kato, Yoshifumi Fujita, Atsushi Hozumi, Akiteru Nishio
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Patent number: 5571569Abstract: A thin-film forming method comprising an uncured-layer forming step in which a mixed composition containing an organic polymerizing agent curable composition and a silicone polymerizing curable composition is prepared to form an uncured layer consisting of this mixed composition on a resin substrate; a solvent removing step in which the solvent in the uncured layer is removed; a first polymerization curing step in which the organic polymerizing curable composition in the uncured layer is polymerized; and a second polymerization curing step in which the silicone polymerizing curable composition in the uncured layer is polymerized. The thin-film forming method can comprise formation of the uncured layer on a resin substrate through the intermediation of a primer layer or formation of an uncured underlayer and uncured top layer followed by separate underlayer polymerization and top layer polymerization curing steps.Type: GrantFiled: April 11, 1995Date of Patent: November 5, 1996Assignee: Kabushiki Kaisha Toyoda Jidoshokki SeisakushoInventors: Yoshifumi Kato, Yoshifumi Fujita, Atsushi Hozumi, Akiteru Nishio