Patents by Inventor Akito Ando

Akito Ando has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5686207
    Abstract: A method of forming a mask for photolithography comprises forming a transparent conductive film on a transparent substrate. The substrate and an electrode having a sharp front end are immersed in an electrolytic solution. The sharp front end of the electrode and the transparent film are then positioned close to each other while controlling a distance therebetween. The substrate and the electrode are then scanned relative to each other in two-dimensions while maintaining the distance between the sharp front end of the electrode and the transparent film constant. Thereafter, an electrochemical reaction is processed on the substrate while a voltage is applied between the transparent film and the electrode to form a mask pattern on the substrate. During repair of the mask thus formed, the substrate and the electrode are immersed in the electrolytic solution.
    Type: Grant
    Filed: July 19, 1995
    Date of Patent: November 11, 1997
    Assignee: Seiko Instruments Inc.
    Inventors: Masayuki Suda, Akito Ando, Tatsuaki Ataka
  • Patent number: 5366613
    Abstract: An electrochemical fine processing method for forming a pattern of a substance having different etching resistance against an etching solution from that of an article by bringing the minute forward end of the counter electrode close to the surface of the article. The counter electrode is applied a predetermined electric potential and the electrochemical reaction is repeating in a minute region of the article in the vicinity of the counter electrode to form an optional pattern. After forming the pattern, the article is etched in an etching solution having a property of different etching rate for the pattern forming portion and a portion other than the pattern forming portion. It become possible to form a fine pattern directly onto the surface of an article to be processed having surface unevenness.
    Type: Grant
    Filed: March 29, 1993
    Date of Patent: November 22, 1994
    Assignee: Seiko Instruments Inc.
    Inventors: Masayuki Suda, Toshihiko Sakuhara, Masataka Shinogi, Fumiharu Iwasaki, Akito Ando
  • Patent number: 5344539
    Abstract: An electrochemical fine processing apparatus for electrochemically performing an adding processing and a removing processing of a substance such as a metal or a polymer in a solution in order to produce a structure having a high aspect ratio. Removing electrodes for applying an electric potential opposite to that applied to an addition electrode are disposed around the addition electrode, whereby an excess portion of metal or polymer film pattern can be scraped electrochemically. In addition, alternate electric potential pulses are applied successively to the addition electrode and then to the removing electrodes. It becomes possible to form on the support a structure with sharp pattern edge portions and a high aspect ratio.
    Type: Grant
    Filed: March 29, 1993
    Date of Patent: September 6, 1994
    Assignee: Seiko Instruments Inc.
    Inventors: Masataka Shinogi, Toshihiko Sakuhara, Masayuki Suda, Fumiharu Iwasaki, Akito Ando
  • Patent number: 5288382
    Abstract: An optical fine processing apparatus for forming a structure having a high aspect ratio even on a workpiece having high heat conductivity. Light, such as a laser beam, is irradiated onto the workpiece in an electrolytic solution through a light guide to deposit a substance such as a metal or a polymer. A plurality of removal electrodes are allowed to have an electric potential for removing a part of the deposited substance. The removal electrodes are disposed in a rotation ring which is rotatable about the optical axis of the irradiating light onto the sample so as to adjust the width of a predetermined pattern to be scraped by changing the rotation angle of the removal electrodes with respect to the optical axis. By scanning the light guide and the removing electrodes above the workpiece surface, it is possible to form any desired pattern on the workpiece.
    Type: Grant
    Filed: March 29, 1993
    Date of Patent: February 22, 1994
    Assignee: Seiko Instruments, Inc.
    Inventors: Masataka Shinogi, Toshihiko Sakuhara, Masayuki Suda, Fumiharu Iwasaki, Akito Ando