Patents by Inventor Akito Hamazono

Akito Hamazono has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Surface mount electronic component having electrodes suppressing the occurrence of migration
    Patent number: 6316726
    Abstract: A surface mount component includes a substrate having two main faces, and first electrodes made of a metal, such as zinc, which is unlikely to cause migration. The first electrodes are formed on most of the entire face of both main faces of the substrate. Second electrodes made of a superior bonding material, such as copper, are disposed on the first electrodes. Lead terminals are bonded to the second electrodes by a bonding material, and an external packaging material covers the surface mount component. This configuration suppresses the occurrence of migration and improves resistance to electrical breakdown.
    Type: Grant
    Filed: November 22, 1999
    Date of Patent: November 13, 2001
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Akio Hidaka, Akito Hamazono, Katsumi Sasaki, Shoichi Ikebe