Abstract: There is provided a method of manufacturing an electronic unit that includes an electronic component having a rectangular plate shape and generating heat during operation, and a heat dissipation gel covering the electronic component. The method includes a side surface coating step of coating opposite two side surfaces of four side surfaces of the electronic component with the heat dissipation gel by discharging the heat dissipation gel from a flat-shaped opening of a nozzle, and a top surface coating step of coating a top surface of the electronic component by discharging the heat dissipation gel from the opening of the nozzle after completion of the side surface coating step.

Abstract: A connection structure which electrically connects, through a conductive ball, a first contact which is provided at an electrical wiring member and a second contact which is provided at an electrical component, wherein a bottom surface of a case is provided with a ball assembly-use passage, the first contact is provided at the electrical wiring member facing the ball assembly-use passage.