Abstract: A sintered silicon nitride wafer according to an embodiment has a flat plate-shape. In the sintered silicon nitride wafer, at least one surface of the wafer has a mean value, of mean lengths RSm of a plurality of roughness profile elements having a length of a plurality of line segments passing through the center of the surface being taken as a standard length, within the range of 100 ?m or larger and 350 ?m or smaller.

Abstract: In a method for manufacturing a current sensor, a wiring board is placed by bringing the wiring board into contact with board contact portions of a sensor housing while deforming an adhesive applied on top surfaces of board adhesion portions of the sensor housing between the board adhesion portions and the wiring board, and a shield is placed by bringing the shield into contact with shield contact portions of the sensor housing while deforming an adhesive applied on top surfaces of shield adhesion portions of the sensor housing between the shield adhesion portions and the shield. After the placing of the wiring board and the placing of the shield, both the adhesive positioned between the board adhesion portions and the wiring board and the adhesive positioned between the shield adhesion portions and the shield are cured simultaneously.

Abstract: A ceramic circuit substrate according to an embodiment includes a ceramic substrate and multiple metal parts. The ceramic substrate includes a first surface. The multiple metal parts are located respectively in multiple first regions of the first surface. The first surface includes a second region positioned between adjacent first regions of the multiple metal parts. An average length RSm of roughness curve elements in the second region is not less than 40 ?m. The average length RSm is preferably not more than 100 ?m. A maximum peak height Rp of a surface roughness curve in the second region is preferably not less than 1.0 ?m. A maximum valley depth Rv of a surface roughness curve in the second region is preferably not less than 1.0 ?m.

Abstract: A ceramic substrate for which the yield when forming a notched portion is improved is provided. A ceramic substrate according to an embodiment includes a front surface and a back surface. A notched portion is provided at one or more locations of the ceramic substrate. The notched portion has an opening portion. At least one angle (?3) where the ceramic substrate is present when viewed from the front surface among angles of end portions of the opening portion is greater than 90 degrees.

Abstract: A current sensor includes a bus bar, a core having a core hole, a gap forming portion, a core lateral portion, and a core bottom portion, a detection unit located in a gap, and a case containing the core. The case has an opening portion which is inserted in a core hole and in which the bus bar is inserted. The opening portion includes a facing surface facing the bus bar and a protruding portion protruding from the facing surface toward the bus bar to come into contact with the bus bar, and a space is formed between the facing surface of the bus bar.

Abstract: A current sensor includes a bus bar, a core having a core hole, a gap forming portion, a core lateral portion, and a core bottom portion, a detection unit. The detection unit is located in a gap. A magnetic permeability of the core lateral portion is different from a magnetic permeability of the core bottom portion.

Abstract: According to one embodiment, nano metal compound particles are provided. The nano metal compound particles have an average particle size of 50 nm or less. The nano metal compound particles have a peak ?t of 2.8 eV or less. The peak ?t corresponds to a resonant frequency of an oscillator according to a spectroscopic ellipsometry method fitted to a Lorentz model.

Abstract: A current sensor includes a plurality of individual sensors and a wiring case. Each of the individual sensors includes an electrical-conduction member through which a measurement current to be measured flows, a magnetoelectric converter and an insulating sensor housing. The magnetoelectric converter converts a measurement magnetic field caused by a flow of the measurement current into an electric signal. The sensor housing accommodates the electrical-conduction member and the magnetoelectric converter therein. The wiring case is larger than the sensor housing. The wiring case includes an insulating integrated housing in which the plurality of individual sensors is fixed, and an input/output wiring disposed in the integrated housing and electrically connected to the megnetoelectric converter of each of the plurality of individual sensors.

Abstract: A current sensor includes a wiring board, a shield, an insulating sensor housing, and a shield adhesive. The wiring board and the shield are accommodated in the sensor housing. The sensor housing has a shield support part to support the shield, and a shield adhesion part. An application surface of the shield adhesion part is further from the shield than a contact surface of the shield support part. The shield is mounted on the contact surface of the shield support part, and the shield adhesive is disposed between the application surface of the shield adhesion part and the shield. The shield and the wiring board are aligned with and spaced from each other in the sensor housing.

Abstract: A photon counting radiation detector includes a cell structure including a substrate and an epitaxial layer provided on the substrate, radiation being incident on the epitaxial layer; an inclination ? of the substrate being set in a predetermined range, where tsub is a thickness of the substrate, tepi is a thickness of the epitaxial layer, L is a length of the substrate, and the inclination ? is an inclination of the substrate with respect to an incident direction of the radiation. The epitaxial layer is preferably one type selected from SiC, Ga2O3, GaAs, GaN, diamond, and CdTe. Such a photon counting radiation detector is preferably a direct converting type.

Abstract: According to one embodiment, there is provided a multielement composite oxide powder that includes an oxide particle including a composite oxide, the composite oxide containing: constituent metal elements containing two or more hexavalent metal elements and two or more pentavalent metal elements at a content of 80 atm % or more in total; and oxygen. The oxide particle has a major axis and a minor axis intersecting the major axis, and has a polygonal tunnel structure including one or more polygonal tunnels of five or more vertices in a major axis direction along the major axis.

Abstract: In one embodiment, an antibacterial material includes at least one microparticles selected from tungsten oxide microparticles and tungsten oxide complex microparticles. The microparticles, which have undergone a test to evaluate viable cell count by inoculating in a test piece, to which the microparticles are adhered in a range of 0.02 mg/cm2 or more and 40 mg/cm2 or less, at least one bacterium selected from among Staphylococcus aureus, Escherichia coli, Klebsiella pneumoniae, Pseudomonas aeruginosa, methicillin-resistant Staphylococcus aureus, and enterohemorrhagic Escherichia coli, and storing for 24 hours, have an antibacterial activity value R of 0.1 or more expressed by the following: R=log(B1/C1) where, B1 denotes an average value (number) of viable cell count after storing an untreated test piece for 24 hours, and C1 denotes an average value (number) of viable cell count after storing the test piece on which the microparticles are coated for 24 hours.

Abstract: According to the embodiment, in a method for manufacturing a ceramic circuit board in which a copper plate is bonded to at least one surface of a ceramic substrate via a brazing material layer, the brazing material layer does not include Ag, but includes Cu, Ti, and one or two of Sn or In, and a ceramic circuit board is prepared in which a portion of the brazing material layer is exposed between the patterned configuration of the copper plate. The method includes a chemical polishing process of chemically polishing the portion of the brazing material layer, and a brazing material etching process of etching the chemically polished portion of the brazing material layer by using an etchant that includes one or two selected from hydrogen peroxide and ammonium peroxodisulfate and has a pH of not more than 6.

Abstract: A position sensor includes a detector and a signal processor. The detector includes: a sensor chip having a surface; a first detection element disposed at the surface of the sensor chip; and a second detection element disposed at the surface of the sensor chip. The signal processor processes a signal input from the detector. The first detection element outputs a first detection signal corresponding to a position of a detection target, based on a change in a magnetic field received from the detection target. The second detection element outputs a second detection signal corresponding to the position of the detection target, based on the change in the magnetic field received from the detection target. A center of balance of the first detection element coincides with a center of balance of the second detection element.

Abstract: A semiconductor solid state battery has an insulating layer provided between an N-type semiconductor and a P-type semiconductor. The first insulating layer preferably has a thickness of 3 nm to 30 ?m and a dielectric constant of 10 or less. The first insulating layer preferably has a density of 60% or more of a bulk body. The semiconductor layer preferably has a capture level introduced. The semiconductor solid state battery can eliminate leakage of an electrolyte solution.

Abstract: A current sensor includes a plurality of individual sensors and a wiring case. Each of the individual sensors includes an electrical-conduction member through which a measurement current to be measured flows, a magnetoelectric converter and an insulating sensor housing. The magnetoelectric converter converts a measurement magnetic field caused by a flow of the measurement current into an electric signal. The sensor housing accommodates the electrical-conduction member and the magnetoelectric converter therein. The wiring case is larger than the sensor housing. The wiring case includes an insulating integrated housing in which the plurality of individual sensors is fixed, and an input/output wiring disposed in the integrated housing and electrically connected to the megnetoelectric converter of each of the plurality of individual sensors.

Abstract: A position sensor including: a power supply terminal to which a power supply voltage is applied; a ground terminal to which a ground voltage is applied; an output terminal that outputs a signal; a detection portion that operates based on the power supply voltage and the ground voltage, and detects a position of a detection target by a magnetic resistance element whose resistance value changes according to a movement of the detection target; and a signal processing portion that operates based on the power supply voltage and the ground voltage, and processes a signal input from the detection portion.

Abstract: A current sensor includes a wiring board, a shield, an insulating sensor housing, and a shield adhesive. The wiring board and the shield are accommodated in the sensor housing. The sensor housing has a shield support part to support the shield, and a shield adhesion part. An application surface of the shield adhesion part is further from the shield than a contact surface of the shield support part. The shield is mounted on the contact surface of the shield support part, and the shield adhesive is disposed between the application surface of the shield adhesion part and the shield. The shield and the wiring board are aligned with and spaced from each other in the sensor housing.

Abstract: A current sensor includes a plurality of individual sensors and a wiring case. Each of the individual sensors includes an electrical-conduction member through which a measurement current to be measured flows, a magnetoelectric converter and an insulating sensor housing. The magnetoelectric converter converts a measurement magnetic field caused by a flow of the measurement current into an electric signal. The sensor housing accommodates the electrical-conduction member and the magnetoelectric converter therein. The wiring case is larger than the sensor housing. The wiring case includes an insulating integrated housing in which the plurality of individual sensors is fixed, and an input/output wiring disposed in the integrated housing and electrically connected to the megnetoelectric converter of each of the plurality of individual sensors.

Abstract: A current sensor includes a wiring board, a shield, an insulating sensor housing, and a shield adhesive. The wiring board and the shield are accommodated in the sensor housing. The sensor housing has a shield support part to support the shield, and a shield adhesion part. An application surface of the shield adhesion part is further from the shield than a contact surface of the shield support part. The shield is mounted on the contact surface of the shield support part, and the shield adhesive is disposed between the application surface of the shield adhesion part and the shield. The shield and the wiring board are aligned with and spaced from each other in the sensor housing.