Patents by Inventor Akito Sasaki

Akito Sasaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250197300
    Abstract: A sintered silicon nitride wafer according to an embodiment has a flat plate-shape. In the sintered silicon nitride wafer, at least one surface of the wafer has a mean value, of mean lengths RSm of a plurality of roughness profile elements having a length of a plurality of line segments passing through the center of the surface being taken as a standard length, within the range of 100 ?m or larger and 350 ?m or smaller.
    Type: Application
    Filed: February 26, 2025
    Publication date: June 19, 2025
    Applicants: KABUSHIKI KAISHA TOSHIBA, TOSHIBA MATERIALS CO., LTD.
    Inventors: Keita KANAHARA, Akito SASAKI, Kentaro IWAI
  • Publication number: 20250155474
    Abstract: In a method for manufacturing a current sensor, a wiring board is placed by bringing the wiring board into contact with board contact portions of a sensor housing while deforming an adhesive applied on top surfaces of board adhesion portions of the sensor housing between the board adhesion portions and the wiring board, and a shield is placed by bringing the shield into contact with shield contact portions of the sensor housing while deforming an adhesive applied on top surfaces of shield adhesion portions of the sensor housing between the shield adhesion portions and the shield. After the placing of the wiring board and the placing of the shield, both the adhesive positioned between the board adhesion portions and the wiring board and the adhesive positioned between the shield adhesion portions and the shield are cured simultaneously.
    Type: Application
    Filed: January 16, 2025
    Publication date: May 15, 2025
    Inventors: Kazuhiro YOSHINO, Takeshi TSUKAMOTO, Akito SASAKI
  • Publication number: 20250069994
    Abstract: A ceramic circuit substrate according to an embodiment includes a ceramic substrate and multiple metal parts. The ceramic substrate includes a first surface. The multiple metal parts are located respectively in multiple first regions of the first surface. The first surface includes a second region positioned between adjacent first regions of the multiple metal parts. An average length RSm of roughness curve elements in the second region is not less than 40 ?m. The average length RSm is preferably not more than 100 ?m. A maximum peak height Rp of a surface roughness curve in the second region is preferably not less than 1.0 ?m. A maximum valley depth Rv of a surface roughness curve in the second region is preferably not less than 1.0 ?m.
    Type: Application
    Filed: November 12, 2024
    Publication date: February 27, 2025
    Applicants: KABUSHIKI KAISHA TOSHIBA, TOSHIBA MATERIALS CO., LTD.
    Inventors: Akito SASAKI, Kentaro IWAI, Keita KANAHARA
  • Publication number: 20240324105
    Abstract: A ceramic substrate for which the yield when forming a notched portion is improved is provided. A ceramic substrate according to an embodiment includes a front surface and a back surface. A notched portion is provided at one or more locations of the ceramic substrate. The notched portion has an opening portion. At least one angle (?3) where the ceramic substrate is present when viewed from the front surface among angles of end portions of the opening portion is greater than 90 degrees.
    Type: Application
    Filed: May 22, 2024
    Publication date: September 26, 2024
    Applicants: KABUSHIKI KAISHA TOSHIBA, TOSHIBA MATERIALS CO., LTD.
    Inventors: Kentaro IWAI, Akito SASAKI
  • Publication number: 20240295588
    Abstract: A current sensor includes a bus bar, a core having a core hole, a gap forming portion, a core lateral portion, and a core bottom portion, a detection unit located in a gap, and a case containing the core. The case has an opening portion which is inserted in a core hole and in which the bus bar is inserted. The opening portion includes a facing surface facing the bus bar and a protruding portion protruding from the facing surface toward the bus bar to come into contact with the bus bar, and a space is formed between the facing surface of the bus bar.
    Type: Application
    Filed: May 10, 2024
    Publication date: September 5, 2024
    Inventors: Ryo MIYAMOTO, Akito SASAKI, Kenji TOKUNAGA
  • Publication number: 20240295587
    Abstract: A current sensor includes a bus bar, a core having a core hole, a gap forming portion, a core lateral portion, and a core bottom portion, a detection unit. The detection unit is located in a gap. A magnetic permeability of the core lateral portion is different from a magnetic permeability of the core bottom portion.
    Type: Application
    Filed: May 10, 2024
    Publication date: September 5, 2024
    Inventors: Ryo MIYAMOTO, Akito SASAKI, Kenji TOKUNAGA
  • Patent number: 12037260
    Abstract: According to one embodiment, nano metal compound particles are provided. The nano metal compound particles have an average particle size of 50 nm or less. The nano metal compound particles have a peak ?t of 2.8 eV or less. The peak ?t corresponds to a resonant frequency of an oscillator according to a spectroscopic ellipsometry method fitted to a Lorentz model.
    Type: Grant
    Filed: October 22, 2019
    Date of Patent: July 16, 2024
    Assignees: Kabushiki Keisha Toshiba, Toshiba Materials Co., Ltd.
    Inventors: Yuzo Shigesato, Junjun Jia, Daisuke Fukushi, Hideaki Hirabayashi, Yoshinori Kataoka, Akito Sasaki, Atsuya Sasaki
  • Patent number: 11988692
    Abstract: A current sensor includes a plurality of individual sensors and a wiring case. Each of the individual sensors includes an electrical-conduction member through which a measurement current to be measured flows, a magnetoelectric converter and an insulating sensor housing. The magnetoelectric converter converts a measurement magnetic field caused by a flow of the measurement current into an electric signal. The sensor housing accommodates the electrical-conduction member and the magnetoelectric converter therein. The wiring case is larger than the sensor housing. The wiring case includes an insulating integrated housing in which the plurality of individual sensors is fixed, and an input/output wiring disposed in the integrated housing and electrically connected to the megnetoelectric converter of each of the plurality of individual sensors.
    Type: Grant
    Filed: July 14, 2022
    Date of Patent: May 21, 2024
    Assignee: DENSO CORPORATION
    Inventors: Hiroaki Miwa, Akito Sasaki, Ryosuke Sakai, Takuma Esaka, Tatsuaki Sugito
  • Patent number: 11953526
    Abstract: A current sensor includes a wiring board, a shield, an insulating sensor housing, and a shield adhesive. The wiring board and the shield are accommodated in the sensor housing. The sensor housing has a shield support part to support the shield, and a shield adhesion part. An application surface of the shield adhesion part is further from the shield than a contact surface of the shield support part. The shield is mounted on the contact surface of the shield support part, and the shield adhesive is disposed between the application surface of the shield adhesion part and the shield. The shield and the wiring board are aligned with and spaced from each other in the sensor housing.
    Type: Grant
    Filed: June 27, 2022
    Date of Patent: April 9, 2024
    Assignee: DENSO CORPORATION
    Inventors: Akito Sasaki, Ryosuke Sakai, Hiroaki Miwa, Takeshi Tsukamoto, Hiroshi Nomura, Takuma Esaka, Tatsuaki Sugito
  • Patent number: 11942490
    Abstract: A photon counting radiation detector includes a cell structure including a substrate and an epitaxial layer provided on the substrate, radiation being incident on the epitaxial layer; an inclination ? of the substrate being set in a predetermined range, where tsub is a thickness of the substrate, tepi is a thickness of the epitaxial layer, L is a length of the substrate, and the inclination ? is an inclination of the substrate with respect to an incident direction of the radiation. The epitaxial layer is preferably one type selected from SiC, Ga2O3, GaAs, GaN, diamond, and CdTe. Such a photon counting radiation detector is preferably a direct converting type.
    Type: Grant
    Filed: February 18, 2021
    Date of Patent: March 26, 2024
    Assignees: KABUSHIKI KAISHA TOSHIBA, TOSHIBA MATERIALS CO., LTD.
    Inventors: Kuniyuki Kakushima, Akito Sasaki, Atsuya Sasaki, Hideaki Hirabayashi
  • Publication number: 20240082824
    Abstract: According to one embodiment, there is provided a multielement composite oxide powder that includes an oxide particle including a composite oxide, the composite oxide containing: constituent metal elements containing two or more hexavalent metal elements and two or more pentavalent metal elements at a content of 80 atm % or more in total; and oxygen. The oxide particle has a major axis and a minor axis intersecting the major axis, and has a polygonal tunnel structure including one or more polygonal tunnels of five or more vertices in a major axis direction along the major axis.
    Type: Application
    Filed: November 14, 2023
    Publication date: March 14, 2024
    Applicant: TOSHIBA MATERIALS CO., LTD.
    Inventors: Daisuke FUKUSHI, Seiichi SUENAGA, Akito SASAKI, Masaki TOYOSHIMA
  • Patent number: 11896966
    Abstract: In one embodiment, an antibacterial material includes at least one microparticles selected from tungsten oxide microparticles and tungsten oxide complex microparticles. The microparticles, which have undergone a test to evaluate viable cell count by inoculating in a test piece, to which the microparticles are adhered in a range of 0.02 mg/cm2 or more and 40 mg/cm2 or less, at least one bacterium selected from among Staphylococcus aureus, Escherichia coli, Klebsiella pneumoniae, Pseudomonas aeruginosa, methicillin-resistant Staphylococcus aureus, and enterohemorrhagic Escherichia coli, and storing for 24 hours, have an antibacterial activity value R of 0.1 or more expressed by the following: R=log(B1/C1) where, B1 denotes an average value (number) of viable cell count after storing an untreated test piece for 24 hours, and C1 denotes an average value (number) of viable cell count after storing the test piece on which the microparticles are coated for 24 hours.
    Type: Grant
    Filed: May 12, 2020
    Date of Patent: February 13, 2024
    Assignees: KABUSHIKI KAISHA TOSHIBA, TOSHIBA MATERIALS CO., LTD.
    Inventors: Kayo Nakano, Akira Sato, Yasuhiro Shirakawa, Keiichi Fuse, Shinya Kasamatsu, Akito Sasaki
  • Publication number: 20230390845
    Abstract: According to the embodiment, in a method for manufacturing a ceramic circuit board in which a copper plate is bonded to at least one surface of a ceramic substrate via a brazing material layer, the brazing material layer does not include Ag, but includes Cu, Ti, and one or two of Sn or In, and a ceramic circuit board is prepared in which a portion of the brazing material layer is exposed between the patterned configuration of the copper plate. The method includes a chemical polishing process of chemically polishing the portion of the brazing material layer, and a brazing material etching process of etching the chemically polished portion of the brazing material layer by using an etchant that includes one or two selected from hydrogen peroxide and ammonium peroxodisulfate and has a pH of not more than 6.
    Type: Application
    Filed: August 17, 2023
    Publication date: December 7, 2023
    Applicants: KABUSHIKI KAISHA TOSHIBA, TOSHIBA MATERIALS CO., LTD.
    Inventors: Akito SASAKI, Hiromasa KATO, Hideaki HIRABAYASHI
  • Patent number: 11733063
    Abstract: A position sensor includes a detector and a signal processor. The detector includes: a sensor chip having a surface; a first detection element disposed at the surface of the sensor chip; and a second detection element disposed at the surface of the sensor chip. The signal processor processes a signal input from the detector. The first detection element outputs a first detection signal corresponding to a position of a detection target, based on a change in a magnetic field received from the detection target. The second detection element outputs a second detection signal corresponding to the position of the detection target, based on the change in the magnetic field received from the detection target. A center of balance of the first detection element coincides with a center of balance of the second detection element.
    Type: Grant
    Filed: November 27, 2019
    Date of Patent: August 22, 2023
    Assignee: DENSO CORPORATION
    Inventors: Atsushi Kobayashi, Yasuhiro Kitaura, Michihiro Makita, Akito Sasaki, Tetsuya Ohmi
  • Patent number: 11600866
    Abstract: A semiconductor solid state battery has an insulating layer provided between an N-type semiconductor and a P-type semiconductor. The first insulating layer preferably has a thickness of 3 nm to 30 ?m and a dielectric constant of 10 or less. The first insulating layer preferably has a density of 60% or more of a bulk body. The semiconductor layer preferably has a capture level introduced. The semiconductor solid state battery can eliminate leakage of an electrolyte solution.
    Type: Grant
    Filed: June 11, 2019
    Date of Patent: March 7, 2023
    Assignees: Kabushiki Kaisha Toshiba, Toshiba Materials Co., Ltd.
    Inventors: Atsuya Sasaki, Akito Sasaki, Yoshinori Kataoka, Hideaki Hirabayashi, Shuichi Saito
  • Publication number: 20220357368
    Abstract: A current sensor includes a plurality of individual sensors and a wiring case. Each of the individual sensors includes an electrical-conduction member through which a measurement current to be measured flows, a magnetoelectric converter and an insulating sensor housing. The magnetoelectric converter converts a measurement magnetic field caused by a flow of the measurement current into an electric signal. The sensor housing accommodates the electrical-conduction member and the magnetoelectric converter therein. The wiring case is larger than the sensor housing. The wiring case includes an insulating integrated housing in which the plurality of individual sensors is fixed, and an input/output wiring disposed in the integrated housing and electrically connected to the megnetoelectric converter of each of the plurality of individual sensors.
    Type: Application
    Filed: July 14, 2022
    Publication date: November 10, 2022
    Inventors: Hiroaki MIWA, Akito SASAKI, Ryosuke SAKAI, Takuma ESAKA, Tatsuaki SUGITO
  • Patent number: 11493528
    Abstract: A position sensor including: a power supply terminal to which a power supply voltage is applied; a ground terminal to which a ground voltage is applied; an output terminal that outputs a signal; a detection portion that operates based on the power supply voltage and the ground voltage, and detects a position of a detection target by a magnetic resistance element whose resistance value changes according to a movement of the detection target; and a signal processing portion that operates based on the power supply voltage and the ground voltage, and processes a signal input from the detection portion.
    Type: Grant
    Filed: November 8, 2019
    Date of Patent: November 8, 2022
    Assignee: DENSO CORPORATION
    Inventors: Akito Sasaki, Atsushi Kobayashi, Michihiro Makita, Tetsuya Ohmi
  • Publication number: 20220326283
    Abstract: A current sensor includes a wiring board, a shield, an insulating sensor housing, and a shield adhesive. The wiring board and the shield are accommodated in the sensor housing. The sensor housing has a shield support part to support the shield, and a shield adhesion part. An application surface of the shield adhesion part is further from the shield than a contact surface of the shield support part. The shield is mounted on the contact surface of the shield support part, and the shield adhesive is disposed between the application surface of the shield adhesion part and the shield. The shield and the wiring board are aligned with and spaced from each other in the sensor housing.
    Type: Application
    Filed: June 27, 2022
    Publication date: October 13, 2022
    Inventors: Akito SASAKI, Ryosuke SAKAI, Hiroaki MIWA, Takeshi TSUKAMOTO, Hiroshi NOMURA, Takuma ESAKA, Tatsuaki SUGITO
  • Patent number: 11422165
    Abstract: A current sensor includes a plurality of individual sensors and a wiring case. Each of the individual sensors includes an electrical-conduction member through which a measurement current to be measured flows, a magnetoelectric converter and an insulating sensor housing. The magnetoelectric converter converts a measurement magnetic field caused by a flow of the measurement current into an electric signal. The sensor housing accommodates the electrical-conduction member and the magnetoelectric converter therein. The wiring case is larger than the sensor housing. The wiring case includes an insulating integrated housing in which the plurality of individual sensors is fixed, and an input/output wiring disposed in the integrated housing and electrically connected to the megnetoelectric converter of each of the plurality of individual sensors.
    Type: Grant
    Filed: September 17, 2020
    Date of Patent: August 23, 2022
    Assignee: DENSO CORPORATION
    Inventors: Hiroaki Miwa, Akito Sasaki, Ryosuke Sakai, Takuma Esaka, Tatsuaki Sugito
  • Patent number: 11397196
    Abstract: A current sensor includes a wiring board, a shield, an insulating sensor housing, and a shield adhesive. The wiring board and the shield are accommodated in the sensor housing. The sensor housing has a shield support part to support the shield, and a shield adhesion part. An application surface of the shield adhesion part is further from the shield than a contact surface of the shield support part. The shield is mounted on the contact surface of the shield support part, and the shield adhesive is disposed between the application surface of the shield adhesion part and the shield. The shield and the wiring board are aligned with and spaced from each other in the sensor housing.
    Type: Grant
    Filed: September 17, 2020
    Date of Patent: July 26, 2022
    Assignee: DENSO CORPORATION
    Inventors: Akito Sasaki, Ryosuke Sakai, Hiroaki Miwa, Takeshi Tsukamoto, Hiroshi Nomura, Takuma Esaka, Tatsuaki Sugito