Patents by Inventor Akito Yoshida
Akito Yoshida has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240081718Abstract: A biological information measurement device includes a sensor unit that detects predetermined biological information related to an organ of a living body, an A/D conversion unit that converts a measurement signal output from the sensor unit into a digital signal, a storage unit that stores information including a digital signal related to the measurement signal output from the A/D conversion unit, an analysis processing unit that determines presence or absence of a suspicion of an abnormality in the organ by analyzing the digital signal, and a measurement control unit that changes a sampling frequency related to A/D conversion of the measurement signal under a predetermined condition when the analysis processing unit has determined that a suspicion of an abnormality is present in the organ.Type: ApplicationFiled: November 16, 2023Publication date: March 14, 2024Inventors: Kenji FUJII, Yasuhiro KAWABATA, Naomi MATSUMURA, Akito ITO, Yuki SAKAGUCHI, Daizo OKA, Takuya YOSHIDA, Seiji FUKUNAGA, Tatsuaki OKA
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Publication number: 20240006337Abstract: In one example, an electronic device includes a substrate having an upper side, a lower side opposite to the upper side, a lateral side connecting the upper side to the lower side, and a conductive structure. An electronic component is coupled to the conductive structure at the upper side of the substrate. An encapsulant covers a lateral side of the electronic component and the upper side of the substrate and having an encapsulant top side and an encapsulant lateral side. The electronic device includes first metallic coating having a first metallic coating top side, a first metallic coating sidewall; and a first metallic coating thickness. The electronic device includes a second metallic coating having a second metallic coating thickness that is greater than the first metallic coating thickness.Type: ApplicationFiled: June 29, 2022Publication date: January 4, 2024Applicant: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Akito YOSHIDA, Glen SIEW, Dong Su RYU, Min Jae KONG, Jo Hyun BAE
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Publication number: 20230354523Abstract: A stackable via package includes a substrate having an upper surface and a trace on the upper surface, the trace including a terminal. A solder ball is on the terminal. The solder ball has a solder ball diameter A and a solder ball height D. A via aperture is formed in a package body enclosing the solder ball to expose the solder ball. The via aperture includes a via bottom having a via bottom diameter B and a via bottom height C from the upper surface of the substrate, where A<B and 0=<C<1/2×D. The shape of the via aperture prevents solder deformation of the solder column formed from the solder ball as well as prevents solder bridging between adjacent solder columns.Type: ApplicationFiled: July 10, 2023Publication date: November 2, 2023Inventors: Akito Yoshida, Mahmoud Dreiza, Curtis Michael Zwenger
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Patent number: 11700692Abstract: A stackable via package includes a substrate having an upper surface and a trace on the upper surface, the trace including a terminal. A solder ball is on the terminal. The solder ball has a solder ball diameter A and a solder ball height D. A via aperture is formed in a package body enclosing the solder ball to expose the solder ball. The via aperture includes a via bottom having a via bottom diameter B and a via bottom height C from the upper surface of the substrate, where A<B and 0=<C<1/2×D. The shape of the via aperture prevents solder deformation of the solder column formed from the solder ball as well as prevents solder bridging between adjacent solder columns.Type: GrantFiled: August 6, 2021Date of Patent: July 11, 2023Assignee: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Akito Yoshida, Mahmoud Dreiza, Curtis Michael Zwenger
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Publication number: 20220117087Abstract: A stackable via package includes a substrate having an upper surface and a trace on the upper surface, the trace including a terminal. A solder ball is on the terminal. The solder ball has a solder ball diameter A and a solder ball height D. A via aperture is formed in a package body enclosing the solder ball to expose the solder ball. The via aperture includes a via bottom having a via bottom diameter B and a via bottom height C from the upper surface of the substrate, where A<B and 0=<C<1/2×D. The shape of the via aperture prevents solder deformation of the solder column formed from the solder ball as well as prevents solder bridging between adjacent solder columns.Type: ApplicationFiled: August 6, 2021Publication date: April 14, 2022Inventors: Akito Yoshida, Mahmoud Dreiza, Curtis Michael Zwenger
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Patent number: 11236001Abstract: A hydrothermal treatment device (3) is a hydrothermal treatment device (3) performing hydrothermal treatment by heating high-water-content biomass, the hydrothermal treatment device (3) including a treatment container (21) that stores sludge, a sludge supply unit (22) that supplies the sludge to inside of the treatment container (21) such that a space (S) is formed in a vertical upper part of the treatment container (21), a stirrer (23) that is provided within the treatment container (21) and stirs stored matter such that counter flows in an up/down direction occur, and a heat transfer tube (24) that is disposed in a horizontal direction within the treatment container (21) and heats the sludge with heat of vapor flowing within the heat transfer tube (24).Type: GrantFiled: May 30, 2019Date of Patent: February 1, 2022Assignee: MITSUBISHI POWER, LTD.Inventors: Yoichi Shimbo, Yuta Ozawa, Akito Yoshida
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Patent number: 11089685Abstract: A stackable via package includes a substrate having an upper surface and a trace on the upper surface, the trace including a terminal. A solder ball is on the terminal. The solder ball has a solder ball diameter A and a solder ball height D. A via aperture is formed in a package body enclosing the solder ball to expose the solder ball. The via aperture includes a via bottom having a via bottom diameter B and a via bottom height C from the upper surface of the substrate, where A<B and 0=<C<½×D. The shape of the via aperture prevents solder deformation of the solder column formed from the solder ball as well as prevents solder bridging between adjacent solder columns.Type: GrantFiled: January 28, 2020Date of Patent: August 10, 2021Assignee: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Akito Yoshida, Mahmoud Dreiza, Curtis Michael Zwenger
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Publication number: 20210230494Abstract: A hydrothermal treatment device (3) is a hydrothermal treatment device (3) performing hydrothermal treatment by heating high-water-content biomass, the hydrothermal treatment device (3) including a treatment container (21) that stores sludge, a sludge supply unit (22) that supplies the sludge to inside of the treatment container (21) such that a space (S) is formed in a vertical upper part of the treatment container (21), a stirrer (23) that is provided within the treatment container (21) and stirs stored matter such that counter flows in an up/down direction occur, and a heat transfer tube (24) that is disposed in a horizontal direction within the treatment container (21) and heats the sludge with heat of vapor flowing within the heat transfer tube (24).Type: ApplicationFiled: May 30, 2019Publication date: July 29, 2021Applicant: Mitsubishi Power, Ltd.Inventors: Yoichi Shimbo, Yuta Ozawa, Akito Yoshida
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Publication number: 20200337152Abstract: A stackable via package includes a substrate having an upper surface and a trace on the upper surface, the trace including a terminal. A solder ball is on the terminal. The solder ball has a solder ball diameter A and a solder ball height D. A via aperture is formed in a package body enclosing the solder ball to expose the solder ball. The via aperture includes a via bottom having a via bottom diameter B and a via bottom height C from the upper surface of the substrate, where A<B and 0=<C<½×D. The shape of the via aperture prevents solder deformation of the solder column formed from the solder ball as well as prevents solder bridging between adjacent solder columns.Type: ApplicationFiled: January 28, 2020Publication date: October 22, 2020Inventors: Akito Yoshida, Mahmoud Dreiza, Curtis Michael Zwenger
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Patent number: 10548221Abstract: A stackable via package includes a substrate having an upper surface and a trace on the upper surface, the trace including a terminal. A solder ball is on the terminal. The solder ball has a solder ball diameter A and a solder ball height D. A via aperture is formed in a package body enclosing the solder ball to expose the solder ball. The via aperture includes a via bottom having a via bottom diameter B and a via bottom height C from the upper surface of the substrate, where A<B and 0=<C<½×D. The shape of the via aperture prevents solder deformation of the solder column formed from the solder ball as well as prevents solder bridging between adjacent solder columns.Type: GrantFiled: February 11, 2019Date of Patent: January 28, 2020Assignee: Amkor Technology, Inc.Inventors: Akito Yoshida, Mahmoud Dreiza, Curtis Michael Zwenger
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Patent number: 10257942Abstract: A stackable variable height via package includes a substrate having a first surface and terminals thereon. The terminals include a first terminal and a second terminal. Vias are on the terminals, the vias including a first via on the first terminal and a second via on the second terminal. The first via has a height from the first surface of the substrate less than a height of the second via from the first surface of the substrate. The package further includes a package body and via apertures in the package body to expose the vias. Forming the stackable variable height via package with variable height vias readily accommodate stacking of additional packages having different types of terminals, e.g., LGA and BGA type packages, as well as variable degrees of warpage on the stackable variable height via package. Further, the vias are formed with a minimum pitch.Type: GrantFiled: May 17, 2013Date of Patent: April 9, 2019Assignee: Amkor Technology, Inc.Inventors: Akito Yoshida, Mahmoud Dreiza
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Patent number: 10206285Abstract: A stackable via package includes a substrate having an upper surface and a trace on the upper surface, the trace including a terminal. A solder ball is on the terminal. The solder ball has a solder ball diameter A and a solder ball height D. A via aperture is formed in a package body enclosing the solder ball to expose the solder ball. The via aperture includes a via bottom having a via bottom diameter B and a via bottom height C from the upper surface of the substrate, where A<B and 0=<C<½×D. The shape of the via aperture prevents solder deformation of the solder column formed from the solder ball as well as prevents solder bridging between adjacent solder columns.Type: GrantFiled: July 23, 2018Date of Patent: February 12, 2019Assignee: AMKOR TECHNOLOGY, INC.Inventors: Akito Yoshida, Mahmoud Dreiza, Curtis Michael Zwenger
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Patent number: 10034372Abstract: A stackable via package includes a substrate having an upper surface and a trace on the upper surface, the trace including a terminal. A solder ball is on the terminal. The solder ball has a solder ball diameter A and a solder ball height D. A via aperture is formed in a package body enclosing the solder ball to expose the solder ball. The via aperture includes a via bottom having a via bottom diameter B and a via bottom height C from the upper surface of the substrate, where A<B and 0=<C<½×D. The shape of the via aperture prevents solder deformation of the solder column formed from the solder ball as well as prevents solder bridging between adjacent solder columns.Type: GrantFiled: August 7, 2017Date of Patent: July 24, 2018Assignee: Amkor Technology, Inc.Inventors: Akito Yoshida, Mahmoud Dreiza, Curtis Michael Zwenger
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Patent number: 9730327Abstract: A stackable via package includes a substrate having an upper surface and a trace on the upper surface, the trace including a terminal. A solder ball is on the terminal. The solder ball has a solder ball diameter A and a solder ball height D. A via aperture is formed in a package body enclosing the solder ball to expose the solder ball. The via aperture includes a via bottom having a via bottom diameter B and a via bottom height C from the upper surface of the substrate, where A<B and 0=<C<1/2×D. The shape of the via aperture prevents solder deformation of the solder column formed from the solder ball as well as prevents solder bridging between adjacent solder columns.Type: GrantFiled: March 13, 2015Date of Patent: August 8, 2017Assignee: AMKOR TECHNOLOGY, INC.Inventors: Akito Yoshida, Mahmoud Dreiza, Curtis Michael Zwenger
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Patent number: 9012789Abstract: An electronic component assembly and a method for making an electronic component assembly. A non-limiting example electronic component assembly may, for example, comprise a lower component comprising a plurality of upward extending pins, and an upper component comprising a plurality of respective terminals, each which comprising a respective reflowable conductive structure that extends downward to a respective one of the plurality of upward extending pins.Type: GrantFiled: April 7, 2014Date of Patent: April 21, 2015Inventors: Akito Yoshida, Mahmoud Dreiza, Curtis Michael Zwenger
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Patent number: 8704368Abstract: A stackable via package includes a substrate having an upper surface and a trace on the upper surface, the trace including a terminal. A solder ball is on the terminal. The solder ball has a solder ball diameter A and a solder ball height D. A via aperture is formed in a package body enclosing the solder ball to expose the solder ball. The via aperture includes a via bottom having a via bottom diameter B and a via bottom height C from the upper surface of the substrate, where A<B and 0=<C<½×D. The shape of the via aperture prevents solder deformation of the solder column formed from the solder ball as well as prevents solder bridging between adjacent solder columns.Type: GrantFiled: June 20, 2012Date of Patent: April 22, 2014Inventors: Akito Yoshida, Mahmoud Dreiza, Curtis Michael Zwenger
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Patent number: 8623753Abstract: A method of forming a stackable protruding via package including enclosing an electronic component and electrically conductive first traces on a first surface of a substrate in a package body. Protruding via apertures are formed through the package body to expose the first traces. The protruding via apertures are filled with solder to form electrically conductive vias in direct physical and electrical contact with the first traces. Via extension bumps are attached to first surfaces of the vias. The vias and the via extension bumps are reflowed to form protruding vias. The protruding vias extend from the first traces through the package body and protrude above a principal surface of the package body. The protruding vias enable electrical connection of the stackable protruding via package to a larger substrate such as a printed circuit motherboard. Further, the protruding vias in accordance with one embodiment are formed with a minimum pitch.Type: GrantFiled: May 28, 2009Date of Patent: January 7, 2014Inventors: Akito Yoshida, Mahmoud Dreiza, Curtis Michael Zwenger
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Patent number: 8471154Abstract: A stackable variable height via package includes a substrate having a first surface and terminals thereon. The terminals include a first terminal and a second terminal. Vias are on the terminals, the vias including a first via on the first terminal and a second via on the second terminal. The first via has a height from the first surface of the substrate less than a height of the second via from the first surface of the substrate. The package further includes a package body and via apertures in the package body to expose the vias. Forming the stackable variable height via package with variable height vias readily accommodate stacking of additional packages having different types of terminals, e.g., LGA and BGA type packages, as well as variable degrees of warpage on the stackable variable height via package. Further, the vias are formed with a minimum pitch.Type: GrantFiled: August 6, 2009Date of Patent: June 25, 2013Assignee: Amkor Technology, Inc.Inventors: Akito Yoshida, Mahmoud Dreiza
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Patent number: 8466545Abstract: A stackable semiconductor package includes a substrate with a first side surface that includes circuit patterns. Each circuit pattern includes a pad. A semiconductor die is electrically coupled to the circuit patterns. An encapsulant covers the semiconductor die and the first side surface of the substrate inward of the pads. A layer of a solder is fused to each of the pads. A lateral distance between immediately adjacent pads is selected to be greater than a lateral distance between sidewalls of the encapsulant and immediately adjacent pads, and a height of the solder layers relative to the first side surface is selected to be less than a height of the sidewalls of the encapsulant, so that misalignment of a semiconductor package stacked on the solder layers/pads is self-correcting when juxtaposed ones of the solder layers and respective solder balls of the second semiconductor package are reflowed and fused together.Type: GrantFiled: June 20, 2012Date of Patent: June 18, 2013Assignee: Amkor Technology, Inc.Inventors: Akito Yoshida, Young Wook Heo
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Patent number: 8300423Abstract: A method of forming a stackable treated via package includes coupling interconnection balls to terminals. The interconnection balls are encapsulated in a package body. Via apertures are formed in the package body to expose the interconnection balls. The interconnection balls are treated to form treated interconnection balls comprising treated surfaces. The treated interconnection balls of the stackable treated via package enhance bonding with interconnection balls of a stacked electronic component package thus maximizing yield.Type: GrantFiled: May 25, 2010Date of Patent: October 30, 2012Assignee: Amkor Technology, Inc.Inventors: Robert Francis Darveaux, Ludovico Bancod, Akito Yoshida