Abstract: Disclosed herein is a card device including a semiconductor package section having memory functions and a substrate section joined to the semiconductor package section by superposition and mounted by a variety of electronic components. The semiconductor package section includes a card-side connector section having card-side terminals for inputting and outputting information signals, and package-side terminals at a location at which the semiconductor package section is joined to the substrate section by superposition. The substrate section includes substrate-side terminals at a location at which the substrate section is connected to the semiconductor package section by superposition. The substrate section is electrically joined to the semiconductor package section by making use of the package-side terminals and the substrate-side terminals.

Abstract: A card device capable of improving mechanical strength of a mounting substrate with a simple structure is provided. A memory card includes the mounting substrate and a semiconductor package in a package. An electronic component such as a communication component on the mounting substrate is covered with a protective member having an electromagnetic shield function. The protective member is formed by drawing process of a sheet metal, has a containable space by a ceiling section and a side wall, and has a curve section at a joint section between an all rim of the ceiling section and the side wall. A flange is provided on the bottom end of the side wall, and the flange is solder-jointed with a ground region of the mounting substrate. In the protective member having the foregoing structure, stress hardly concentrates locally. Thus, its mechanical strength is large, and rigidity of the mounting substrate is increased.

Abstract: Disclosed herein is a card device including a semiconductor package section having memory functions and a substrate section joined to the semiconductor package section by superposition and mounted by a variety of electronic components. The semiconductor package section includes a card-side connector section having card-side terminals for inputting and outputting information signals, and package-side terminals at a location at which the semiconductor package section is joined to the substrate section by superposition. The substrate section includes substrate-side terminals at a location at which the substrate section is connected to the semiconductor package section by superposition. The substrate section is electrically joined to the semiconductor package section by making use of the package-side terminals and the substrate-side terminals.