Abstract: The measuring apparatus for a semiconductor device according to the present invention includes an electrically conductive probe needle having a lower dangling part which extends vertically downward having its tip that makes contact with an object to be measured, an upper dangling part extending upward coaxially with the lower dangling part, and a bent part located between the lower dangling part and the upper dangling part for obtaining a uniform needle pressure by buffering the contact pressure during an over-drive, a printed circuit board having a wiring which is connected electrically to an end of the upper dangling part of the probe needle, and a rotational operation mechanism which acts on the bent part of the probe needle during the over-drive to cause the bent part and the lower dangling part rotate with the axis of the upper dangling part as the center.