Patents by Inventor Akitoshi Hara
Akitoshi Hara has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9325292Abstract: A piezoelectric device includes: a piezoelectric vibrating reed; and a package, wherein the piezoelectric vibrating reed has a vibrating part and first and second supporting arms extending from a base end part, the package has a base, a lid, a cavity defined by the base and the lid, a convex part projecting from the base or the lid into the cavity, a length of the first supporting arm is shorter than a length of the second supporting arm, and the convex part is provided in a range ahead of a leading end of the first vibrating arm in an extension direction of the first supporting arm and at least partially overlapping with the second supporting arm in a length direction of the piezoelectric vibrating reed so as not to overlap with the piezoelectric vibrating reed in a plan view.Type: GrantFiled: March 24, 2014Date of Patent: April 26, 2016Assignee: Seiko Epson CorporationInventors: Katsuo Ishikawa, Akitoshi Hara
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Publication number: 20140202245Abstract: A piezoelectric device includes: a piezoelectric vibrating reed; and a package, wherein the piezoelectric vibrating reed has a vibrating part and first and second supporting arms extending from a base end part, the package has a base, a lid, a cavity defined by the base and the lid, a convex part projecting from the base or the lid into the cavity, a length of the first supporting arm is shorter than a length of the second supporting arm, and the convex part is provided in a range ahead of a leading end of the first vibrating arm in an extension direction of the first supporting arm and at least partially overlapping with the second supporting arm in a length direction of the piezoelectric vibrating reed so as not to overlap with the piezoelectric vibrating reed in a plan view.Type: ApplicationFiled: March 24, 2014Publication date: July 24, 2014Applicant: Seiko Epson CorporationInventors: Katsuo ISHIKAWA, Akitoshi HARA
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Patent number: 8723401Abstract: A piezoelectric device includes: a piezoelectric vibrating reed; and a package, wherein the piezoelectric vibrating reed has a vibrating part and first and second supporting arms extending from a base end part, the package has a base, a lid, a cavity defined by the base and the lid, a convex part projecting from the base or the lid into the cavity, a length of the first supporting arm is shorter than a length of the second supporting arm, and the convex part is provided in a range ahead of a leading end of the first vibrating arm in an extension direction of the first supporting arm and at least partially overlapping with the second supporting arm in a length direction of the piezoelectric vibrating reed so as not to overlap with the piezoelectric vibrating reed in a plan view.Type: GrantFiled: September 19, 2013Date of Patent: May 13, 2014Assignee: Seiko Epson CorporationInventors: Katsuo Ishikawa, Akitoshi Hara
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Patent number: 8643254Abstract: A piezoelectric device includes: a piezoelectric vibrating reed; and a package, wherein the piezoelectric vibrating reed has a vibrating part and first and second supporting arms extending from a base end part, the package has a base, a lid, a cavity defined by the base and the lid, a convex part projecting from the base or the lid into the cavity, a length of the first supporting arm is shorter than a length of the second supporting arm, and the convex part is provided in a range ahead of a leading end of the first vibrating arm in an extension direction of the first supporting arm and at least partially overlapping with the second supporting arm in a length direction of the piezoelectric vibrating reed so as not to overlap with the piezoelectric vibrating reed in a plan view.Type: GrantFiled: December 2, 2010Date of Patent: February 4, 2014Assignee: Seiko Epson CorporationInventors: Katsuo Ishikawa, Akitoshi Hara
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Publication number: 20140015618Abstract: A piezoelectric device includes: a piezoelectric vibrating reed; and a package, wherein the piezoelectric vibrating reed has a vibrating part and first and second supporting arms extending from a base end part, the package has a base, a lid, a cavity defined by the base and the lid, a convex part projecting from the base or the lid into the cavity, a length of the first supporting arm is shorter than a length of the second supporting arm, and the convex part is provided in a range ahead of a leading end of the first vibrating arm in an extension direction of the first supporting arm and at least partially overlapping with the second supporting arm in a length direction of the piezoelectric vibrating reed so as not to overlap with the piezoelectric vibrating reed in a plan view.Type: ApplicationFiled: September 19, 2013Publication date: January 16, 2014Applicant: Seiko Epson CorporationInventors: Katsuo ISHIKAWA, Akitoshi HARA
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Patent number: 8248813Abstract: An electronic device includes: an outline configuration including a first surface, a second surface facing opposite from the first surface, and a mounting surface coupled to the first and second surfaces; a first substrate including a first electrode; a second substrate including a second electrode; a resin disposed between the first and second substrates; and an electric element sealed with the resin and having an outline configuration of a polyhedron, the electric element being disposed such that a broadest surface of the polyhedron faces one of the first substrate and the second substrate. The first surface is one surface of the first substrate, the one surface being opposite from another surface of the first substrate on a side adjacent to the resin. The second surface is one surface of the second substrate, the one surface being opposite from another surface of the second substrate on a side adjacent to the resin.Type: GrantFiled: March 18, 2011Date of Patent: August 21, 2012Assignee: Seiko Epson CorporationInventors: Atsushi Ono, Yoshihiro Kobayashi, Shojiro Kitamura, Masayuki Matsunaga, Akitoshi Hara
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Publication number: 20110162452Abstract: An electronic device includes: an outline configuration including a first surface, a second surface facing opposite from the first surface, and a mounting surface coupled to the first and second surfaces; a first substrate including a first electrode; a second substrate including a second electrode; a resin disposed between the first and second substrates; and an electric element sealed with the resin and having an outline configuration of a polyhedron, the electric element being disposed such that a broadest surface of the polyhedron faces one of the first substrate and the second substrate. The first surface is one surface of the first substrate, the one surface being opposite from another surface of the first substrate on a side adjacent to the resin. The second surface is one surface of the second substrate, the one surface being opposite from another surface of the second substrate on a side adjacent to the resin.Type: ApplicationFiled: March 18, 2011Publication date: July 7, 2011Applicant: EPSON TOYOCOM CORPORATIONInventors: Atsushi ONO, Yoshihiro KOBAYASHI, Shojiro KITAMURA, Masayuki MATSUNAGA, Akitoshi HARA
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Publication number: 20110133605Abstract: A piezoelectric device includes: a piezoelectric vibrating reed; and a package, wherein the piezoelectric vibrating reed has a vibrating part and first and second supporting arms extending from a base end part, the package has a base, a lid, a cavity defined by the base and the lid, a convex part projecting from the base or the lid into the cavity, a length of the first supporting arm is shorter than a length of the second supporting arm, and the convex part is provided in a range ahead of a leading end of the first vibrating arm in an extension direction of the first supporting arm and at least partially overlapping with the second supporting arm in a length direction of the piezoelectric vibrating reed so as not to overlap with the piezoelectric vibrating reed in a plan view.Type: ApplicationFiled: December 2, 2010Publication date: June 9, 2011Applicant: SEIKO EPSON CORPORATIONInventors: Katsuo ISHIKAWA, Akitoshi HARA
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Patent number: 7933128Abstract: An electronic device includes: an outline configuration including a first surface, a second surface facing opposite from the first surface, and a mounting surface coupled to the first and second surfaces; a first substrate including a first electrode; a second substrate including a second electrode; a resin disposed between the first and second substrates; and an electric element sealed with the resin and having an outline configuration of a polyhedron, the electric element being disposed such that a broadest surface of the polyhedron faces one of the first substrate and the second substrate. The first surface is one surface of the first substrate, the one surface being opposite from another surface of the first substrate on a side adjacent to the resin. The second surface is one surface of the second substrate, the one surface being opposite from another surface of the second substrate on a side adjacent to the resin.Type: GrantFiled: October 9, 2008Date of Patent: April 26, 2011Assignee: Epson Toyocom CorporationInventors: Atsushi Ono, Yoshihiro Kobayashi, Shojiro Kitamura, Masayuki Matsunaga, Akitoshi Hara
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Patent number: 7859172Abstract: A piezoelectric resonator includes a piezoelectric resonator element having a resonating arm and a metal film that is formed on the resonating arm; a package including a bottom part on which the piezoelectric resonator element is fixed and a frame wall that surrounds the bottom part, and having an opening above the bottom part; and a lid including a frame in which a through hole is provided and an optically transparent part that has an upper face and a lower face of the frame and is disposed at the through hole, the through hole penetrating a front face and a back face, the lower face of the optically transparent part being disposed so as to oppose the metal film, and the lid closing the opening of the package such that the lid overlaps with the bottom part and the frame wall, the through hole having a curved inner wall face whose curved face is coupled with at least one of the front face and the back face at least one opening edge of the front face and the back face and a vertical inner wall face that is proType: GrantFiled: June 18, 2008Date of Patent: December 28, 2010Assignee: Epson Toyocom CorporationInventors: Katsuo Ishikawa, Akitoshi Hara, Yukihiro Tonegawa
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Publication number: 20100180415Abstract: A piezoelectric resonator includes a piezoelectric resonator element having a base portion and a resonating arm extending from the base portion, a package including a bottom to which the piezoelectric resonator element is fixed and a frame wall that surrounds the bottom and having an opening above the bottom, and a lid for closing the opening of the package. In this piezoelectric resonator, the lid includes a main body having a through-hole formed therein, a flange formed to surround a periphery of the main body and to be thinner than the main body, and an optically transparent member located in the through-hole. The flange has a joining portion with an upper end surface of the frame wall, and the main body projects in a direction from the flange to the bottom in a thickness direction. Also, the through-hole is at a position displaced in a first direction approaching a first end of the main body from a center of the main body.Type: ApplicationFiled: March 29, 2010Publication date: July 22, 2010Applicant: EPSON TOYOCOM CORPORATIONInventors: Akitoshi HARA, Katsuo ISHIKAWA, Yukihiro TONEGAWA
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Patent number: 7714484Abstract: A piezoelectric resonator includes a piezoelectric resonator element having a base portion and a resonating arm extending from the base portion, a package including a bottom to which the piezoelectric resonator element is fixed and a frame wall that surrounds the bottom and having an opening above the bottom, and a lid for closing the opening of the package. In this piezoelectric resonator, the lid includes a main body having a through-hole formed therein, a flange formed to surround a periphery of the main body and to be thinner than the main body, and an optically transparent member located in the through-hole. The flange has a joining portion with an upper end surface of the frame wall, and the main body projects in a direction from the flange to the bottom in a thickness direction. Also, the through-hole is at a position displaced in a first direction approaching a first end of the main body from a center of the main body.Type: GrantFiled: June 23, 2008Date of Patent: May 11, 2010Assignee: Epson Toyocom CorporationInventors: Akitoshi Hara, Katsuo Ishikawa, Yukihiro Tonegawa
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Publication number: 20090095510Abstract: An electronic device includes: an outline configuration including a first surface, a second surface facing opposite from the first surface, and a mounting surface coupled to the first and second surfaces; a first substrate including a first electrode; a second substrate including a second electrode; a resin disposed between the first and second substrates; and an electric element sealed with the resin and having an outline configuration of a polyhedron, the electric element being disposed such that a broadest surface of the polyhedron faces one of the first substrate and the second substrate. The first surface is one surface of the first substrate, the one surface being opposite from another surface of the first substrate on a side adjacent to the resin. The second surface is one surface of the second substrate, the one surface being opposite from another surface of the second substrate on a side adjacent to the resin.Type: ApplicationFiled: October 9, 2008Publication date: April 16, 2009Applicant: EPSON TOYOCOM CORPORATIONInventors: Atsushi ONO, Yoshihiro KOBAYASHI, Shojiro KITAMURA, Masayuki MATSUNAGA, Akitoshi HARA
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Publication number: 20090001856Abstract: A piezoelectric resonator includes a piezoelectric resonator element having a base portion and a resonating arm extending from the base portion, a package including a bottom to which the piezoelectric resonator element is fixed and a frame wall that surrounds the bottom and having an opening above the bottom, and a lid for closing the opening of the package. In this piezoelectric resonator, the lid includes a main body having a through-hole formed therein, a flange formed to surround a periphery of the main body and to be thinner than the main body, and an optically transparent member located in the through-hole. The flange has a joining portion with an upper end surface of the frame wall, and the main body projects in a direction from the flange to the bottom in a thickness direction. Also, the through-hole is at a position displaced in a first direction approaching a first end of the main body from a center of the main body.Type: ApplicationFiled: June 23, 2008Publication date: January 1, 2009Applicant: Epson Toyocom CorporationInventors: Akitoshi HARA, Katsuo ISHIKAEA, Yukihiro TONEGAWA
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Publication number: 20080315727Abstract: A piezoelectric resonator includes a piezoelectric resonator element having a resonating arm and a metal film that is formed on the resonating arm; a package including a bottom part on which the piezoelectric resonator element is fixed and a frame wall that surrounds the bottom part, and having an opening above the bottom part; and a lid including a frame in which a through hole is provided and an optically transparent part that has an upper face and a lower face of the frame and is disposed at the through hole, the through hole penetrating a front face and a back face, the lower face of the optically transparent part being disposed so as to oppose the metal film, and the lid closing the opening of the package such that the lid overlaps with the bottom part and the frame wall, the through hole having a curved inner wall face whose curved face is coupled with at least one of the front face and the back face at least one opening edge of the front face and the back face and a vertical inner wall face that is proType: ApplicationFiled: June 18, 2008Publication date: December 25, 2008Applicant: Epson Toyocom CorporationInventors: Katsuo Ishikawa, Akitoshi Hara, Yukihiro Tonegawa
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Patent number: 6900076Abstract: Certain embodiments of the present invention relate to a method for manufacturing a semiconductor chip, a method for manufacturing a semiconductor device, a semiconductor chip, a semiconductor device, a connection substrate and an electronic apparatus, in which semiconductor chips stacked in layers are electrically connected to one another without using wires. In one embodiment, after an electrode 18 is formed on a surface 16 of a first semiconductor chip 12, a hole 26 is formed from an opposite surface 24 thereof until a tungsten layer 20 of the electrode 18 is exposed. A protrusion 30 is formed by etching on a surface 31 of a second semiconductor chip 14 and thereafter an abutting electrode 32 is formed on an apex section of the protrusion 30. The first semiconductor chip 12 and the second semiconductor chip 14 are stacked on top of the other such that the abutting electrode 32 contacts the electrode 18.Type: GrantFiled: February 4, 2001Date of Patent: May 31, 2005Assignee: Seiko Epson CorporationInventors: Tadashi Komiyama, Akitoshi Hara, Eiichi Sato
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Patent number: 6566232Abstract: After a silicon oxide film is formed on a semiconductor wafer, pattern formation alignment marks are provided in the chip formation areas and through-holes for stacking are formed in each chip formation area using an alignment mark as reference in order to improve accuracy in vertically stacking semiconductor chips. Next, after forming elements, wiring and electrode parts on the semiconductor wafer, the semiconductor wafer is cut along the chip formation area and is divided into semiconductor chips. Then, the divided semiconductor chips, as many as needed, are stacked by matching the through-holes.Type: GrantFiled: October 19, 2000Date of Patent: May 20, 2003Assignee: Seiko Epson CorporationInventors: Akitoshi Hara, Eiichi Sato
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Publication number: 20010021582Abstract: Certain embodiments of the present invention relate to a method for manufacturing a semiconductor chip, a method for manufacturing a semiconductor device, a semiconductor chip, a semiconductor device, a connection substrate and an electronic apparatus, in which semiconductor chips stacked in layers are electrically connected to one another without using wires. In one embodiment, after an electrode 18 is formed on a surface 16 of a first semiconductor chip 12, a hole 26 is formed from an opposite surface 24 thereof until a tungsten layer 20 of the electrode 18 is exposed. A protrusion 30 is formed by etching on a surface 31 of a second semiconductor chip 14 and thereafter an abutting electrode 32 is formed on an apex section of the protrusion 30. The first semiconductor chip 12 and the second semiconductor chip 14 are stacked on top of the other such that the abutting electrode 32 contacts the electrode 18.Type: ApplicationFiled: February 4, 2001Publication date: September 13, 2001Inventors: Tadashi Komiyama, Akitoshi Hara, Eiichi Sato
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Patent number: D580096Type: GrantFiled: October 11, 2007Date of Patent: November 4, 2008Assignee: Epson Toyocom CorporationInventors: Akitoshi Hara, Katsuo Ishikawa, Yukihiro Tonegawa
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Patent number: D580592Type: GrantFiled: October 11, 2007Date of Patent: November 11, 2008Assignee: Epson Toyocom CorporationInventors: Akitoshi Hara, Katsuo Ishikawa, Yukihiro Tonegawa